Abstract: A substrate, a packaged structure, and an electronic device are provided. The substrate is configured to be electrically connected to a chip. The chip includes a power terminal and a signal terminal. The substrate includes a first substrate and a second substrate mounted on the first substrate. The first substrate includes a first layout, and the first layout is configured to be electrically connected to the power terminal. The second substrate includes a second layout, and the second layout is configured to be electrically connected to the signal terminal. A spacing between lines of the second layout is less than a spacing between lines of the first layout. The substrate provided in this application has a small size and high integration.

Abstract: A 6G pervasive channel modeling method includes the following steps: S1, setting a propagation scenario and a propagation condition, and determining a carrier frequency, an antenna type, a layout of a transmitting end and a receiving end, and the like; S2, generating large-scale fadings such as path loss, shadowing and blocking effect loss; S3, generating large-scale parameters having spatial consistency; S4, generating scatterer positions in ellipsoid Gaussian scattering distribution, and calculating a delay, an angle and a power of a cluster according to the positions of the transmitting end, the receiving end and the scatterers to generate a channel coefficient, and S5, on the basis of movements of the transmitting end and the receiving end and a birth-death process of each cluster, updating the large scale parameters and small-scale parameters, and generating a new channel coefficient.

Abstract: A power module includes a first metal layer-coated substrate, a plurality of chips, and a first connection piece. A first electrode of each chip is electrically connected to a first metal layer of the first metal layer-coated substrate. The first connection piece includes a first main body part and a plurality of first contact parts. A second electrode of each of the plurality of chips is in contact with at least one of the first contact parts. A part of the first main body part is between at least one pair of adjacent first contact parts. A current flowing out from the chip directly flows to the first main body part through the first contact part. The chips are connected in parallel by using the first connection piece.

Abstract: A power module is provided that may include a first metal-clad substrate, a chip located on a side of the first metal-clad substrate, and first solder located between the first metal-clad substrate and the chip. A first metal layer is disposed on a surface that is of the first metal-clad substrate and that faces the chip, and the first metal layer includes a groove and a blocking part. A first thickness of the first metal layer is less than a second thickness. The first thickness is a thickness of at least a part of an area in the blocking part, and the second thickness is a thickness of the first metal layer in an area other than the groove and the blocking part. The blocking part is located between the chip and the adjacent groove, and is configured to prevent the first solder from overflowing into the groove.

Abstract: A 6G pervasive channel modeling method includes the following steps: S1, setting a propagation scenario and a propagation condition, and determining a carrier frequency, an antenna type, a layout of a transmitting end and a receiving end, and the like; S2, generating large-scale fadings such as path loss, shadowing and blocking effect loss; S3, generating large-scale parameters having spatial consistency; S4, generating scatterer positions in ellipsoid Gaussian scattering distribution, and calculating a delay, an angle and a power of a cluster according to the positions of the transmitting end, the receiving end and the scatterers to generate a channel coefficient, and S5, on the basis of movements of the transmitting end and the receiving end and a birth-death process of each cluster, updating the large scale parameters and small-scale parameters, and generating a new channel coefficient.

Abstract: A power semiconductor module, a motor driver and a method for manufacturing a power semiconductor module. A thermal conductive layer is disposed between a heat sink and a power semiconductor package, where the thermal conductive layer is a thermal conductive material having metal bonding wires on a surface, or is a solid-state thermal conductive layer formed by curable silicone grease, so that both the power semiconductor package and the heat sink are combined with the thermal conductive layer to form the power semiconductor module, thereby reducing a risk of damage caused by stress generated by the power semiconductor module in a process of assembling the entire motor driver. This implements helium inspection of the power semiconductor module in advance, improves a qualification rate of secondary processing of the entire motor driver.

Abstract: A substrate, a packaged structure, and an electronic device are provided. The substrate is configured to be electrically connected to a chip. The chip includes a power terminal and a signal terminal. The substrate includes a first substrate and a second substrate mounted on the first substrate. The first substrate includes a first layout, and the first layout is configured to be electrically connected to the power terminal. The second substrate includes a second layout, and the second layout is configured to be electrically connected to the signal terminal. A spacing between lines of the second layout is less than a spacing between lines of the first layout. The substrate provided in this application has a small size and high integration.

Abstract: An injection mold and an injection molding method are provided. The injection mold includes a housing and a cover. The housing is provided with a mold cavity. The mold cavity is configured to accommodate a power module. The cover is provided with a plurality of vias. The cover is detachably connected to the housing. The cover is located in the mold cavity and locates the power module jointly with the housing. The plurality of vias are configured to match a plurality of pins of the power module. In this application, the cover is disposed, and the cover is provided with the vias for pins to pass through. By using covers with different arrangement manners of vias, a same set of injection molds can be compatible with power modules of a same series that have different locations of pins. Arrangement manners of vias on different covers are different.

Abstract: Methods and apparatuses to provide a pin, a pin combination structure and a package body are described. A baffle structure is sleeved on the pin. The baffle structure is used to prevent a plastic packaging material from overflowing from a cavity that accommodates the plastic packaging material. The cavity is in a mold for packaging the package body.

Abstract: A method for producing a power semiconductor system includes packaging a power device in plastic to form a power semiconductor component, forming a first heat dissipation face on a surface of the power semiconductor component; heating a first material between a first heat sink and the first heat dissipation face; and cooling the first material on the first heat dissipation face to connect the power semiconductor component and the first heat sink.

Abstract: A device for inspecting the rotor windings of a generator includes a sequential logic circuit that generates a full-cycle pulse. A high-voltage full-cycle pulse matching generator couples the full-cycle pulse generated by the sequential logic circuit to form a corresponding transient bidirectional rotating magnetic field pulse. The transient bidirectional rotating magnetic field pulse is transmitted to two ends and a large shaft of the generator rotor winding through an impedance-matched connecting line. The transient bidirectional rotating magnetic field pulse generates a resonance effect with each large coil in the rotor. The pulse signal coupling feedback acquisition circuit couples all waveforms reflected by the generator rotor to form a magnetic field waveform, and the magnetic field waveform is transmitted to a data acquisition system by an operational amplifier. A central processing unit transmits a digital information stream to an upper computer.

Abstract: Methods and apparatuses to provide a pin, a pin combination structure and a package body are described. A baffle structure is sleeved on the pin. The baffle structure is used to prevent a plastic packaging material from overflowing from a cavity that accommodates the plastic packaging material. The cavity is in a mold for packaging the package body.

Abstract: A device for inspecting the rotor windings of a generator includes a sequential logic circuit that generates a full-cycle pulse. A high-voltage full-cycle pulse matching generator couples the full-cycle pulse generated by the sequential logic circuit to form a corresponding transient bidirectional rotating magnetic field pulse. The transient bidirectional rotating magnetic field pulse is transmitted to two ends and a large shaft of the generator rotor winding through an impedance-matched connecting line. The transient bidirectional rotating magnetic field pulse generates a resonance effect with each large coil in the rotor. The pulse signal coupling feedback acquisition circuit couples all waveforms reflected by the generator rotor to form a magnetic field waveform, and the magnetic field waveform is transmitted to a data acquisition system by an operational amplifier. A central processing unit transmits a digital information stream to an upper computer.

Abstract: The present invention discloses a functional electrical stimulation system comprising a primary power, a boost module, an energy storage section, an output control relay, an automatic discharge circuit, a foot/hand controlled switch, a current detection chip and a current limiting fuse. The boost module comprises n DC chopper circuits connected in series, and outputs a high voltage of 100-200V. According to an enable signal and a current detection signal, the output control relay disables/enables the DC boost module. The automatic discharge circuit discharges capacitance of the energy storage section automatically when the relay turns off the power input. The Foot/hand controlled switch, the current detection chip and the current limiting fuse form a triple accident protection circuit. The functional electrical stimulation system maximizes the intensity of electrical stimulation within the range that the human body can withstand.

Abstract: The present invention discloses a functional electrical stimulation system comprising a primary power, a boost module, an energy storage section, an output control relay, an automatic discharge circuit, a foot/hand controlled switch, a current detection chip and a current limiting fuse. The boost module comprises n DC chopper circuits connected in series, and outputs a high voltage of 100-200V. According to an enable signal and a current detection signal, the output control relay disables/enables the DC boost module. The automatic discharge circuit discharges capacitance of the energy storage section automatically when the relay turns off the power input. The Foot/hand controlled switch, the current detection chip and the current limiting fuse form a triple accident protection circuit. The functional electrical stimulation system maximizes the intensity of electrical stimulation within the range that the human body can withstand.