Abstract: The disclosure discloses a naphthalene isoxazoline compound and an application thereof. The compound is referred to as 4-(5-(3-chloro-5-(trifluoromethyl)phenyl)-5-(trifluoromethyl)-4,5-dihydroisoxazol-3-yl)-N-((methoxylimino)methyl)-1-naphthyl formamide, is a novel ?-aminobutyric acid (GABA) gated chloride ion channel allosteric modulator type insecticide, and can be applied to the prevention and control of various pests and/or pest mites in agriculture. Compared with commercially available agricultural insecticides, the compound has better insecticidal effects and also has a wider insecticidal range. In addition, a synthesis process for the novel compound is easy to operate and has high safety, and the compound has great application potential.

Abstract: A semiconductor package comprises a semiconductor substrate, a plurality of contact pads, a plurality of metal bumps, a metal layer, and a molding encapsulation. A thickness of the semiconductor substrate is less than 35 microns. A first method comprises the steps of providing a device wafer; attaching a first carrier; applying a thinning process; forming a metal layer; applying a first tape; removing the first carrier; applying a first singulation process; removing the first tape; attaching a second carrier; forming a molding encapsulation; removing the second carrier; forming a plurality of metal bumps; applying a second tape; and applying a singulation process and removing the second tape. A second method comprises the steps of providing a device wafer; attaching a carrier; applying a thinning process; forming a metal layer; forming a molding encapsulation; removing the carrier; forming a plurality of metal bumps; and applying a singulation process.

Abstract: A semiconductor package comprises a semiconductor substrate, a plurality of contact pads, a seed layer, a first thick metal layer, a second thick metal layer, and a coating metal layer. Direct attachment of the first thick metal layer and the second thick metal layer comprises bonded metal atoms. The first thick metal layer and the second thick metal layer are bonded by an SAB process. A method comprises the steps of providing an upper device portion, providing a lower carrier portion, applying an SAB process, applying a de-bonding process, applying a tape, applying a singulation process, and removing the tape.

Abstract: A power module includes a first metal layer-coated substrate, a plurality of chips, and a first connection piece. A first electrode of each chip is electrically connected to a first metal layer of the first metal layer-coated substrate. The first connection piece includes a first main body part and a plurality of first contact parts. A second electrode of each of the plurality of chips is in contact with at least one of the first contact parts. A part of the first main body part is between at least one pair of adjacent first contact parts. A current flowing out from the chip directly flows to the first main body part through the first contact part. The chips are connected in parallel by using the first connection piece.

Abstract: An integrated plugging and perforating operation system is provided, including an operation truck, a wellhead equipment pry, and a centralized control room. A mechanical mechanism and a power mechanism are arranged on a chassis of the operation truck. The mechanical mechanism includes a turntable assembly, where a telescopic arm assembly is installed on the turntable assembly, a mechanical arm assembly for logging operation is installed at an operating end of the telescopic arm assembly, and a logging winch assembly and a follow-up winch assembly are arranged at a counterweight end of the telescopic arm assembly to form a counter weight of the telescopic arm assembly. The power mechanism is configured for providing power output to the mechanical mechanism.

Abstract: An electronic device may have a hinge that allows the device to be flexed about a bend axis. A display may span the bend axis. The device may have a stainless steel and/or carbon fiber reinforced polymer layer with slots. The slots may overlap the bend axis. The slots may have at least one property that varies in a non-linear manner as a function of position on the layer. The device may include an adhesive layer with a cutout that overlaps the slots. An interface that defines the cutout may have a plurality of recesses with varying depths. A flexible printed circuit may be attached to an edge of the display panel. The display cover layer may overlap a bonding region between the flexible printed circuit and the edge of the display panel. A UV-curable gap filler may be interposed between the flexible printed circuit and the display cover layer.

Abstract: A power module is provided that may include a first metal-clad substrate, a chip located on a side of the first metal-clad substrate, and first solder located between the first metal-clad substrate and the chip. A first metal layer is disposed on a surface that is of the first metal-clad substrate and that faces the chip, and the first metal layer includes a groove and a blocking part. A first thickness of the first metal layer is less than a second thickness. The first thickness is a thickness of at least a part of an area in the blocking part, and the second thickness is a thickness of the first metal layer in an area other than the groove and the blocking part. The blocking part is located between the chip and the adjacent groove, and is configured to prevent the first solder from overflowing into the groove.

Abstract: A 6G pervasive channel modeling method includes the following steps: S1, setting a propagation scenario and a propagation condition, and determining a carrier frequency, an antenna type, a layout of a transmitting end and a receiving end, and the like; S2, generating large-scale fadings such as path loss, shadowing and blocking effect loss; S3, generating large-scale parameters having spatial consistency; S4, generating scatterer positions in ellipsoid Gaussian scattering distribution, and calculating a delay, an angle and a power of a cluster according to the positions of the transmitting end, the receiving end and the scatterers to generate a channel coefficient, and S5, on the basis of movements of the transmitting end and the receiving end and a birth-death process of each cluster, updating the large scale parameters and small-scale parameters, and generating a new channel coefficient.

Abstract: A power semiconductor module, a motor driver and a method for manufacturing a power semiconductor module. A thermal conductive layer is disposed between a heat sink and a power semiconductor package, where the thermal conductive layer is a thermal conductive material having metal bonding wires on a surface, or is a solid-state thermal conductive layer formed by curable silicone grease, so that both the power semiconductor package and the heat sink are combined with the thermal conductive layer to form the power semiconductor module, thereby reducing a risk of damage caused by stress generated by the power semiconductor module in a process of assembling the entire motor driver. This implements helium inspection of the power semiconductor module in advance, improves a qualification rate of secondary processing of the entire motor driver.

Abstract: A substrate, a packaged structure, and an electronic device are provided. The substrate is configured to be electrically connected to a chip. The chip includes a power terminal and a signal terminal. The substrate includes a first substrate and a second substrate mounted on the first substrate. The first substrate includes a first layout, and the first layout is configured to be electrically connected to the power terminal. The second substrate includes a second layout, and the second layout is configured to be electrically connected to the signal terminal. A spacing between lines of the second layout is less than a spacing between lines of the first layout. The substrate provided in this application has a small size and high integration.

Abstract: An injection mold and an injection molding method are provided. The injection mold includes a housing and a cover. The housing is provided with a mold cavity. The mold cavity is configured to accommodate a power module. The cover is provided with a plurality of vias. The cover is detachably connected to the housing. The cover is located in the mold cavity and locates the power module jointly with the housing. The plurality of vias are configured to match a plurality of pins of the power module. In this application, the cover is disposed, and the cover is provided with the vias for pins to pass through. By using covers with different arrangement manners of vias, a same set of injection molds can be compatible with power modules of a same series that have different locations of pins. Arrangement manners of vias on different covers are different.

Abstract: Methods and apparatuses to provide a pin, a pin combination structure and a package body are described. A baffle structure is sleeved on the pin. The baffle structure is used to prevent a plastic packaging material from overflowing from a cavity that accommodates the plastic packaging material. The cavity is in a mold for packaging the package body.

Abstract: A method for producing a power semiconductor system includes packaging a power device in plastic to form a power semiconductor component, forming a first heat dissipation face on a surface of the power semiconductor component; heating a first material between a first heat sink and the first heat dissipation face; and cooling the first material on the first heat dissipation face to connect the power semiconductor component and the first heat sink.

Abstract: A device for inspecting the rotor windings of a generator includes a sequential logic circuit that generates a full-cycle pulse. A high-voltage full-cycle pulse matching generator couples the full-cycle pulse generated by the sequential logic circuit to form a corresponding transient bidirectional rotating magnetic field pulse. The transient bidirectional rotating magnetic field pulse is transmitted to two ends and a large shaft of the generator rotor winding through an impedance-matched connecting line. The transient bidirectional rotating magnetic field pulse generates a resonance effect with each large coil in the rotor. The pulse signal coupling feedback acquisition circuit couples all waveforms reflected by the generator rotor to form a magnetic field waveform, and the magnetic field waveform is transmitted to a data acquisition system by an operational amplifier. A central processing unit transmits a digital information stream to an upper computer.

Abstract: Methods and apparatuses to provide a pin, a pin combination structure and a package body are described. A baffle structure is sleeved on the pin. The baffle structure is used to prevent a plastic packaging material from overflowing from a cavity that accommodates the plastic packaging material. The cavity is in a mold for packaging the package body.

Abstract: A device for inspecting the rotor windings of a generator includes a sequential logic circuit that generates a full-cycle pulse. A high-voltage full-cycle pulse matching generator couples the full-cycle pulse generated by the sequential logic circuit to form a corresponding transient bidirectional rotating magnetic field pulse. The transient bidirectional rotating magnetic field pulse is transmitted to two ends and a large shaft of the generator rotor winding through an impedance-matched connecting line. The transient bidirectional rotating magnetic field pulse generates a resonance effect with each large coil in the rotor. The pulse signal coupling feedback acquisition circuit couples all waveforms reflected by the generator rotor to form a magnetic field waveform, and the magnetic field waveform is transmitted to a data acquisition system by an operational amplifier. A central processing unit transmits a digital information stream to an upper computer.

Abstract: Methods and systems to manage refrigerant flow inside a shell and tube heat exchanger, such as a condenser, to reduce inundation effect are provided. A method of managing refrigerant flow may include collecting at least a portion the refrigerant in the liquid state and directing the collected refrigerant in the liquid state toward an end of an internal space of the condenser. The method may further include directing the refrigerant in the liquid form toward a subcooling section. The method may also include directing the collected in the liquid state toward a refrigerant outlet located at proximately a middle section of a length of the condenser through the subcooling section. The condenser may have one or more separation/collection pans positioned within heat transfer tubes to collect and direct the refrigerant in the liquid form. A two-stage refrigerant distributor is also disclosed.

Abstract: Methods and systems to manage refrigerant flow inside a shell and tube heat exchanger, such as a condenser, to reduce inundation effect are provided. A method of managing refrigerant flow may include collecting at least a portion the refrigerant in the liquid state and directing the collected refrigerant in the liquid state toward an end of an internal space of the condenser. The method may further include directing the refrigerant in the liquid form toward a subcooling section. The method may also include directing the collected in the liquid state toward a refrigerant outlet located at proximately a middle section of a length of the condenser through the subcooling section. The condenser may have one or more separation/collection pans positioned within heat transfer tubes to collect and direct the refrigerant in the liquid form. A two-stage refrigerant distributor is also disclosed.

Abstract: The present invention discloses a functional electrical stimulation system comprising a primary power, a boost module, an energy storage section, an output control relay, an automatic discharge circuit, a foot/hand controlled switch, a current detection chip and a current limiting fuse. The boost module comprises n DC chopper circuits connected in series, and outputs a high voltage of 100-200V. According to an enable signal and a current detection signal, the output control relay disables/enables the DC boost module. The automatic discharge circuit discharges capacitance of the energy storage section automatically when the relay turns off the power input. The Foot/hand controlled switch, the current detection chip and the current limiting fuse form a triple accident protection circuit. The functional electrical stimulation system maximizes the intensity of electrical stimulation within the range that the human body can withstand.

Abstract: The present invention discloses a functional electrical stimulation system comprising a primary power, a boost module, an energy storage section, an output control relay, an automatic discharge circuit, a foot/hand controlled switch, a current detection chip and a current limiting fuse. The boost module comprises n DC chopper circuits connected in series, and outputs a high voltage of 100-200V. According to an enable signal and a current detection signal, the output control relay disables/enables the DC boost module. The automatic discharge circuit discharges capacitance of the energy storage section automatically when the relay turns off the power input. The Foot/hand controlled switch, the current detection chip and the current limiting fuse form a triple accident protection circuit. The functional electrical stimulation system maximizes the intensity of electrical stimulation within the range that the human body can withstand.