Abstract: A heat sink for dissipation heat for an electronic components (50) having a dual-in-line package comprises at least two fin units (20, 30, 40). Each of the fin units comprises a base (21, 31, 41) and a plurality of heat dissipation fins (23, 33, 43) extending upwardly from the base. At least one fixing hole (2314, 3314) is formed in one of the fin units. At least one fixing poles (3313, 4313) is formed in another neighboring fin unit. The two neighboring fin units are assembled together with the at least one fixing pole inserted in the at least one fixing hole. A receiving space is defined between the two neighboring fin units for receiving the electronic component therein.