Patents by Inventor Zhen-Qing ZHAO
Zhen-Qing ZHAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10381286Abstract: A power module is disclosed. The power module includes a first substrate, a first metal layer, at least one conductive structure and at least one power device. The first metal layer is disposed on the first substrate. The first metal layer has a first thickness d1. The first thickness d1 satisfies: 5 ?m?d1?50 ?m. The conductive structure is disposed at a position different to the first metal layer on the first substrate. The conductive structure has a second thickness d2. The second thickness d2 satisfies: d2?100 ?m. The power device is disposed on the first substrate, the first metal layer or the conductive structure. The driving electrode of the power device is electrically connected to the first metal layer. The power electrode of the power device is electrically coupled to the conductive structure.Type: GrantFiled: August 7, 2017Date of Patent: August 13, 2019Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.Inventors: Shou-Yu Hong, Gan-Yu Zhou, Jian-Hong Zeng, Zhen-Qing Zhao
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Patent number: 10314178Abstract: A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height.Type: GrantFiled: September 27, 2018Date of Patent: June 4, 2019Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.Inventors: Hai-Bin Xu, Tao Wang, Shou-Yu Hong, Zhen-Qing Zhao
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Patent number: 10276522Abstract: The disclosure discloses a power module. The power module includes a substrate, a power chip, a bonding material, and at least one spacer. The substrate includes a circuit-patterned layer. The power chip bonded to the circuit-patterned layer by the bonding material. The spacer is located between the circuit-patterned layer and the power chip, so as to keep the power chip away from the circuit-patterned layer in a distance.Type: GrantFiled: August 6, 2015Date of Patent: April 30, 2019Assignee: DELTA ELECTRONICS, INC.Inventors: Tao Wang, Zhen-Qing Zhao, Kai Lu, Zheng-Fen Wan, Hai-Bin Xu
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Patent number: 10204882Abstract: A package module includes a power module, a first thermal dissipating component and a packaging plastic. The power module includes a substrate and at least one power semiconductor component disposed on the substrate. The first thermal dissipating component is disposed over the power module. The packaging plastic covers the power module and the first thermal dissipating component, wherein a portion of the first thermal dissipating component is exposed from the packaging plastic.Type: GrantFiled: November 30, 2017Date of Patent: February 12, 2019Assignee: DELTA ELECTRONICS, INC.Inventors: Le Liang, Shou-Yu Hong, Zhen-Qing Zhao
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Publication number: 20190037706Abstract: A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height.Type: ApplicationFiled: September 27, 2018Publication date: January 31, 2019Inventors: Hai-Bin XU, Tao WANG, Shou-Yu HONG, Zhen-Qing ZHAO
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Patent number: 10123428Abstract: A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height.Type: GrantFiled: March 10, 2016Date of Patent: November 6, 2018Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.Inventors: Hai-Bin Xu, Tao Wang, Shou-Yu Hong, Zhen-Qing Zhao
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Patent number: 10096562Abstract: A power module package includes a single-layered circuit board, a first electronic component, and a second electronic component. The single-layered circuit board includes an insulating substrate and a conductive layer thereon. A bottom surface of the conductive layer touches a top surface of the insulating substrate. The insulating substrate has plural first openings to allow the conductive layer to be exposed from the bottom surface of the insulating substrate. The first electronic component is disposed on a top surface of the conductive layer. The second electronic component is disposed on the bottom surface of the insulating substrate and received in the first openings. The second electronic component is connected to the conductive layer via the first openings. At least one of the first electronic component and the second electronic component is a bare die.Type: GrantFiled: July 14, 2016Date of Patent: October 9, 2018Assignee: DELTA ELECTRONICS, INC.Inventors: Le Liang, Kai Lu, Zhen-Qing Zhao, Zeng Li
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Publication number: 20180082980Abstract: A package module includes a power module, a first thermal dissipating component and a packaging plastic. The power module includes a substrate and at least one power semiconductor component disposed on the substrate. The first thermal dissipating component is disposed over the power module. The packaging plastic covers the power module and the first thermal dissipating component, wherein a portion of the first thermal dissipating component is exposed from the packaging plastic.Type: ApplicationFiled: November 30, 2017Publication date: March 22, 2018Inventors: Le LIANG, Shou-Yu HONG, Zhen-Qing ZHAO
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Patent number: 9875991Abstract: A package module includes a power module, a first thermal dissipating component and a packaging plastic. The power module includes a substrate and at least one power semiconductor component disposed on the substrate. The first thermal dissipating component is disposed over the power module. The packaging plastic covers the power module and the first thermal dissipating component, wherein a portion of the first thermal dissipating component is exposed from the packaging plastic.Type: GrantFiled: March 16, 2016Date of Patent: January 23, 2018Assignee: DELTA ELECTRONICS, INC.Inventors: Le Liang, Shou-Yu Hong, Zhen-Qing Zhao
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Publication number: 20170358516Abstract: A power module is disclosed. The power module includes a first substrate, a first metal layer, at least one conductive structure and at least one power device. The first metal layer is disposed on the first substrate. The first metal layer has a first thickness d1. The first thickness d1 satisfies: 5 ?m?d1?50 ?m. The conductive structure is disposed at a position different to the first metal layer on the first substrate. The conductive structure has a second thickness d2. The second thickness d2 satisfies: d2?100 ?m. The power device is disposed on the first substrate, the first metal layer or the conductive structure. The driving electrode of the power device is electrically connected to the first metal layer. The power electrode of the power device is electrically coupled to the conductive structure.Type: ApplicationFiled: August 7, 2017Publication date: December 14, 2017Inventors: Shou-Yu HONG, Gan-Yu ZHOU, Jian-Hong ZENG, Zhen-Qing ZHAO
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Patent number: 9806010Abstract: A method of fabricating a package module includes placing a pin frame having plural pins on a circuit substrate; bonding the pins to corresponding bonding areas on a circuit substrate, thereby connecting the pins to the bonding areas; cutting off a connecting portion of the pin frame; and bending the pins to be vertical to the circuit substrate. By placing the pins on the corresponding bonding areas on the circuit substrate through the pin frame, and then cutting off the connecting portion of the pin frame and bending the pins, the efficiency of assembling the package module can be greatly promoted.Type: GrantFiled: March 14, 2016Date of Patent: October 31, 2017Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.Inventors: Kai Lu, Zhen-Qing Zhao, Tao Wang
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Patent number: 9698701Abstract: A power module packaging structure includes a first conducting layer, a first insulating layer, a second conducting layer, a first power device, and a first controlling device. The first insulating layer is disposed above the first conducting layer. The second conducting layer is disposed above the first insulating layer. The first power device is disposed on the first conducting layer. The first controlling device is disposed on the second conducting layer and used for controlling the first power device. The first conducting layer, the second conducting layer, the first power device, and the first controlling device form a loop. A direction of a current which flows through the first conducting layer in the loop is opposite to a direction of a current which flows through the second conducting layer in the loop.Type: GrantFiled: May 30, 2016Date of Patent: July 4, 2017Assignee: DELTA ELECTRONICS, INC.Inventors: Zeng Li, Jun-Cheng Lu, Tao Wang, Zheng-Fen Wan, Zhen-Qing Zhao
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Publication number: 20170025379Abstract: A power module package includes a single-layered circuit board, a first electronic component, and a second electronic component. The single-layered circuit board includes an insulating substrate and a conductive layer thereon. A bottom surface of the conductive layer touches a top surface of the insulating substrate. The insulating substrate has plural first openings to allow the conductive layer to be exposed from the bottom surface of the insulating substrate. The first electronic component is disposed on a top surface of the conductive layer. The second electronic component is disposed on the bottom surface of the insulating substrate and received in the first openings. The second electronic component is connected to the conductive layer via the first openings. At least one of the first electronic component and the second electronic component is a bare die.Type: ApplicationFiled: July 14, 2016Publication date: January 26, 2017Inventors: Le LIANG, Kai LU, Zhen-Qing ZHAO, Zeng LI
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Publication number: 20160374223Abstract: A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height.Type: ApplicationFiled: March 10, 2016Publication date: December 22, 2016Inventors: Hai-Bin XU, Tao WANG, Shou-Yu HONG, Zhen-Qing ZHAO
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Publication number: 20160365306Abstract: A method of fabricating a package module includes placing a pin frame having plural pins on a circuit substrate; bonding the pins to corresponding bonding areas on a circuit substrate, thereby connecting the pins to the bonding areas; cutting off a connecting portion of the pin frame; and bending the pins to be vertical to the circuit substrate. By placing the pins on the corresponding bonding areas on the circuit substrate through the pin frame, and then cutting off the connecting portion of the pin frame and bending the pins, the efficiency of assembling the package module can be greatly promoted.Type: ApplicationFiled: March 14, 2016Publication date: December 15, 2016Inventors: Kai LU, Zhen-Qing ZHAO, Tao WANG
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Publication number: 20160358837Abstract: A package module includes a power module, a first thermal dissipating component and a packaging plastic. The power module includes a substrate and at least one power semiconductor component disposed on the substrate. The first thermal dissipating component is disposed over the power module. The packaging plastic covers the power module and the first thermal dissipating component, wherein a portion of the first thermal dissipating component is exposed from the packaging plastic.Type: ApplicationFiled: March 16, 2016Publication date: December 8, 2016Inventors: Le LIANG, Shou-Yu HONG, Zhen-Qing ZHAO
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Publication number: 20160352247Abstract: A power module packaging structure includes a first conducting layer, a first insulating layer, a second conducting layer, a first power device, and a first controlling device. The first insulating layer is disposed above the first conducting layer. The second conducting layer is disposed above the first insulating layer. The first power device is disposed on the first conducting layer. The first controlling device is disposed on the second conducting layer and used for controlling the first power device. The first conducting layer, the second conducting layer, the first power device, and the first controlling device form a loop. A direction of a current which flows through the first conducting layer in the loop is opposite to a direction of a current which flows through the second conducting layer in the loop.Type: ApplicationFiled: May 30, 2016Publication date: December 1, 2016Inventors: Zeng LI, Jun-Cheng LU, Tao WANG, Zheng-Fen WAN, Zhen-Qing ZHAO
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Publication number: 20160113107Abstract: The disclosure discloses a power module. The power module includes a substrate, a power chip, a bonding material, and at least one spacer. The substrate includes a circuit-patterned layer. The power chip bonded to the circuit-patterned layer by the bonding material. The spacer is located between the circuit-patterned layer and the power chip, so as to keep the power chip away from the circuit-patterned layer in a distance.Type: ApplicationFiled: August 6, 2015Publication date: April 21, 2016Inventors: Tao WANG, Zhen-Qing ZHAO, Kai LU, Zheng-Fen WAN, Hai-Bin XU
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Publication number: 20150085454Abstract: A power module is disclosed. The power module includes a first substrate, a first metal layer, at least one conductive structure and at least one power device. The first metal layer is disposed on the first substrate. The first metal layer has a first thickness d1. The first thickness d1 satisfies: 5 ?m?d1?50 ?m. The conductive structure is disposed at a position different to the first metal layer on the first substrate. The conductive structure has a second thickness d2. The second thickness d2 satisfies: d2?100 ?m. The power device is disposed on the first substrate, the first metal layer or the conductive structure. The driving electrode of the power device is electrically connected to the first metal layer. The power electrode of the power device is electrically coupled to the conductive structure.Type: ApplicationFiled: July 14, 2014Publication date: March 26, 2015Inventors: Shou-Yu HONG, Gan-Yu ZHOU, Jian-Hong ZENG, Zhen-Qing ZHAO