Patents by Inventor Zhendong Luo

Zhendong Luo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11869908
    Abstract: A terminal includes a substrate and a photosensitive chip mounted on the substrate, where a side of the photosensitive chip away from the substrate has a photosensitive area and a non-photosensitive area surrounding the photosensitive area, and the photosensitive chip is electrically connected to the substrate by using a metal wire; and the photosensitive chip package structure further includes: a frame, disposed on the side of the photosensitive chip away from the substrate, where an avoidance groove used to avoid the metal wire is disposed on a side of the frame facing the substrate, the avoidance groove extends along a side edge of the frame, and an inner wall of the avoidance groove is an arc-shaped inner wall; and a filling glue, filled in the avoidance groove, and used to wrap the metal wire and bond the frame to the non-photosensitive area of the photosensitive chip and the substrate.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: January 9, 2024
    Assignee: Honor Device Co., Ltd.
    Inventors: Atsushi Yajima, Kun Ran, Zhendong Luo, Lifeng Fu, Weichih Lin, Changfu Huang
  • Publication number: 20210313366
    Abstract: A terminal includes a substrate and a photosensitive chip mounted on the substrate, where a side of the photosensitive chip away from the substrate has a photosensitive area and a non-photosensitive area surrounding the photosensitive area, and the photosensitive chip is electrically connected to the substrate by using a metal wire; and the photosensitive chip package structure further includes: a frame, disposed on the side of the photosensitive chip away from the substrate, where an avoidance groove used to avoid the metal wire is disposed on a side of the frame facing the substrate, the avoidance groove extends along a side edge of the frame, and an inner wall of the avoidance groove is an arc-shaped inner wall; and a filling glue, filled in the avoidance groove, and used to wrap the metal wire and bond the frame to the non-photosensitive area of the photosensitive chip and the substrate.
    Type: Application
    Filed: August 27, 2018
    Publication date: October 7, 2021
    Inventors: Atsushi YAJIMA, Kun RAN, Zhendong LUO, Lifeng FU, Weichih LIN, Changfu HUANG
  • Patent number: 11102384
    Abstract: A camera substrate assembly, a camera apparatus, and a terminal device, where the camera substrate assembly includes a rigid support plate and a printed circuit board laminated, where at least two mounting holes for accommodating camera chips are disposed on the printed circuit board, the rigid support plate has mounting surfaces facing the mounting holes respectively and are configured to support the camera chips, strength of the rigid support plate is greater than strength of the printed circuit board, and flatness of the mounting surfaces is less than a specified threshold. The mounting holes disposed on the printed circuit board and the mounting surfaces disposed on the rigid support plate are used to support cameras. This avoids impact of warpage on camera mounting when the printed circuit board and a flexible circuit board are laminated, and improves flatness after camera mounting.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: August 24, 2021
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Guanghai Wang, Cunying Li, Zhendong Luo, Qingshan Tian, Jianwen Wang, Sheng Li
  • Publication number: 20190356822
    Abstract: A camera substrate assembly, a camera apparatus, and a terminal device, where the camera substrate assembly includes a rigid support plate and a printed circuit board laminated, where at least two mounting holes for accommodating camera chips are disposed on the printed circuit board, the rigid support plate has mounting surfaces facing the mounting holes respectively and are configured to support the camera chips, strength of the rigid support plate is greater than strength of the printed circuit board, and flatness of the mounting surfaces is less than a specified threshold. The mounting holes disposed on the printed circuit board and the mounting surfaces disposed on the rigid support plate are used to support cameras. This avoids impact of warpage on camera mounting when the printed circuit board and a flexible circuit board are laminated, and improves flatness after camera mounting.
    Type: Application
    Filed: January 13, 2017
    Publication date: November 21, 2019
    Inventors: Guanghai Wang, Cunying Li, Zhendong Luo, Qingshan Tian, Jianwen Wang, Sheng Li