Patents by Inventor Zhenfang Li

Zhenfang Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230202902
    Abstract: A device and method for bending vehicle glass are provided in the disclosure. The device for bending vehicle glass includes a concave solid lower mold, at least one blowing pipe, and multiple extraction pipes. The concave solid lower mold includes a base and a top plate covered on the base. The base and the top plate cooperatively define an accommodating space. Multiple first partitions are arranged in the accommodating space to divide the accommodating space into multiple subspaces. The top plate has a carrying surface that is concave and away from the base. The top plate has multiple through holes that are in communication with the accommodating space and arranged at intervals. Each of the multiple subspaces corresponds to at least one of the multiple through holes.
    Type: Application
    Filed: February 21, 2023
    Publication date: June 29, 2023
    Applicant: FUYAO GLASS INDUSTRY GROUP CO., LTD.
    Inventors: Zunguang ZHOU, Zongfa ZHENG, Daoding CHEN, Tao LIN, Guangjin ZHUO, Zhenfang LI
  • Patent number: 11311236
    Abstract: Embodiments of the present disclosure provide a device for determining a location of a blood vessel and a method thereof. The device includes a plurality of sensors, a processor, and an indicating device. The plurality of sensors may detect pressure values at a plurality of skin locations in contact with the plurality of sensors. The processor may determine the location of the blood vessel based on the pressure values. The pressure value at the skin location corresponding to the location of the blood vessel is greater than the pressure values at both sides of the skin location in a direction perpendicular to a direction of the blood vessel. The indicating device may indicate the location of the blood vessel.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: April 26, 2022
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Qiangqiang Luo, Yingxi Tai, Haitao Wang, Zhenfang Li
  • Publication number: 20200268310
    Abstract: Embodiments of the present disclosure provide a device for determining a location of a blood vessel and a method thereof. The device includes a plurality of sensors, a processor, and an indicating device. The plurality of sensors may detect pressure values at a plurality of skin locations in contact with the plurality of sensors. The processor may determine the location of the blood vessel based on the pressure values. The pressure value at the skin location corresponding to the location of the blood vessel is greater than the pressure values at both sides of the skin location in a direction perpendicular to a direction of the blood vessel. The indicating device may indicate the location of the blood vessel.
    Type: Application
    Filed: November 29, 2018
    Publication date: August 27, 2020
    Inventors: Qiangqiang LUO, Yingxi TAI, Haitao WANG, Zhenfang LI
  • Publication number: 20190261917
    Abstract: Embodiments of the present disclosure provide a device for determining a location of a blood vessel and a method thereof. The device includes a plurality of sensors, a processor, and an indicating device. The plurality of sensors may detect pressure values at a plurality of skin locations in contact with the plurality of sensors. The processor may determine the location of the blood vessel based on the pressure values. The pressure value at the skin location corresponding to the location of the blood vessel is greater than the pressure values at both sides of the skin location in a direction perpendicular to a direction of the blood vessel. The indicating device may indicate the location of the blood vessel.
    Type: Application
    Filed: November 29, 2018
    Publication date: August 29, 2019
    Inventors: Qiangqiang LUO, Yingxi TAI, Haitao WANG, Zhenfang LI
  • Publication number: 20170213852
    Abstract: A method for manufacturing an array substrate includes: forming a first conductive pattern and a second conductive pattern on a base substrate; forming a via hole on the base substrate formed with the first conductive pattern and the second conductive pattern, and a lateral side of the via hole being half opened; and forming a jumper wire film on the base substrate formed with the via hole.
    Type: Application
    Filed: January 5, 2016
    Publication date: July 27, 2017
    Inventors: Zhenfang Li, Xiaoyu Yang, Kiyoung Kwon, Qiangqiang Luo
  • Patent number: 9679924
    Abstract: An array substrate and manufacturing method thereof, a display device are provided. The array substrate includes a display region and a non-display region; the non-display region includes a first laminated structure and a second laminated structure that are separately disposed on a base substrate, a gap between the first laminated structure and the second laminated structure constitutes a connecting hole; the first laminated structure includes a first via hole provided for exposing a first metal layer, the second laminated structure includes a second via hole provided for exposing a second metal layer, the first via hole and the second via hole are connected to a connecting hole via breaches on corresponding walls, and the first metal layer and the second metal are electrically connected with a conductive film.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: June 13, 2017
    Assignees: BOE Technology Group Co., Ltd., Hefei BOE Optoelectronics Technology Co., Ltd.
    Inventors: Qiangqiang Luo, Xiaoyu Yang, Kiyoung Kwon, Zhenfang Li, Xiaojun Su
  • Publication number: 20170012058
    Abstract: An array substrate and manufacturing method thereof, a display device are provided. The array substrate includes a display region and a non-display region; the non-display region includes a first laminated structure and a second laminated structure that are separately disposed on a base substrate, a gap between the first laminated structure and the second laminated structure constitutes a connecting hole; the first laminated structure includes a first via hole provided for exposing a first metal layer, the second laminated structure includes a second via hole provided for exposing a second metal layer, the first via hole and the second via hole are connected to a connecting hole via breaches on corresponding walls, and the first metal layer and the second metal are electrically connected with a conductive film.
    Type: Application
    Filed: April 14, 2016
    Publication date: January 12, 2017
    Inventors: Qiangqiang Luo, Xiaoyu Yang, Kiyoung Kwon, Zhenfang Li, Xiaojun Su
  • Publication number: 20160282659
    Abstract: The present invention discloses an array substrate, a method for fabricating the same, and a display apparatus. The array substrate is provided with a plurality of signal lines in a peripheral area, at least two adhesion layers of different thicknesses are provided at positions of each signal line where the signal lines are connected with a driving IC chip, and said adhesion layers are electrically connected via a conductive metal layer. The adhesion layer is designed to have at least two adhesion layers, instead of a single layer in the prior art. Two adhesion layers with different thicknesses are provided at a bonding position, and are connected via a conductive metal layer. Thus, it is possible to avoid the abnormity in bonding due to difference in thickness and offset between metal layers, thus reducing poor wiring due to abnormity in bonding and improving quality of products.
    Type: Application
    Filed: June 5, 2014
    Publication date: September 29, 2016
    Inventors: Qiangqiang Luo, Kiyoung Kwon, Baoquan Zhou, Kun Qu, Zhenfang Li