Patents by Inventor Zheng-Fen WAN

Zheng-Fen WAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power module
    Patent number: 10276522
    Abstract: The disclosure discloses a power module. The power module includes a substrate, a power chip, a bonding material, and at least one spacer. The substrate includes a circuit-patterned layer. The power chip bonded to the circuit-patterned layer by the bonding material. The spacer is located between the circuit-patterned layer and the power chip, so as to keep the power chip away from the circuit-patterned layer in a distance.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: April 30, 2019
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Tao Wang, Zhen-Qing Zhao, Kai Lu, Zheng-Fen Wan, Hai-Bin Xu
  • Power module packaging structure and method for manufacturing the same
    Patent number: 9698701
    Abstract: A power module packaging structure includes a first conducting layer, a first insulating layer, a second conducting layer, a first power device, and a first controlling device. The first insulating layer is disposed above the first conducting layer. The second conducting layer is disposed above the first insulating layer. The first power device is disposed on the first conducting layer. The first controlling device is disposed on the second conducting layer and used for controlling the first power device. The first conducting layer, the second conducting layer, the first power device, and the first controlling device form a loop. A direction of a current which flows through the first conducting layer in the loop is opposite to a direction of a current which flows through the second conducting layer in the loop.
    Type: Grant
    Filed: May 30, 2016
    Date of Patent: July 4, 2017
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Zeng Li, Jun-Cheng Lu, Tao Wang, Zheng-Fen Wan, Zhen-Qing Zhao
  • POWER MODULE PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20160352247
    Abstract: A power module packaging structure includes a first conducting layer, a first insulating layer, a second conducting layer, a first power device, and a first controlling device. The first insulating layer is disposed above the first conducting layer. The second conducting layer is disposed above the first insulating layer. The first power device is disposed on the first conducting layer. The first controlling device is disposed on the second conducting layer and used for controlling the first power device. The first conducting layer, the second conducting layer, the first power device, and the first controlling device form a loop. A direction of a current which flows through the first conducting layer in the loop is opposite to a direction of a current which flows through the second conducting layer in the loop.
    Type: Application
    Filed: May 30, 2016
    Publication date: December 1, 2016
    Inventors: Zeng LI, Jun-Cheng LU, Tao WANG, Zheng-Fen WAN, Zhen-Qing ZHAO
  • POWER MODULE
    Publication number: 20160113107
    Abstract: The disclosure discloses a power module. The power module includes a substrate, a power chip, a bonding material, and at least one spacer. The substrate includes a circuit-patterned layer. The power chip bonded to the circuit-patterned layer by the bonding material. The spacer is located between the circuit-patterned layer and the power chip, so as to keep the power chip away from the circuit-patterned layer in a distance.
    Type: Application
    Filed: August 6, 2015
    Publication date: April 21, 2016
    Inventors: Tao WANG, Zhen-Qing ZHAO, Kai LU, Zheng-Fen WAN, Hai-Bin XU