Abstract: A massage chair is provided, comprising a body and side plates, the side plates being connected to the body by means of swing rod mechanisms so as to expand the space on two sides of the body by moving from outside to behind relative to the body. The massage chair also comprises limiting mechanisms, the limiting mechanisms being arranged between the body and the swing rod mechanisms, or between the side plates and the swing rod mechanisms. When the swing rod mechanisms are driven by the side plates to switch between different swing states, the limiting mechanisms are correspondingly driven to switch between different limiting states, so as to enable the swing rod mechanisms to correspondingly maintain different swing states.

Abstract: An electronic package comprises a substrate core; one or more dielectric material layers over the substrate core and having a lower dielectric material layer, and a plurality of metallization layers comprising an upper-most metallization layer; an integrated circuit (IC) die embedded within the dielectric material and below the upper-most metallization layer; and at least one conductive feature below and coupled to the IC die. A downwardly facing surface of the conductive feature is located on the lower dielectric material layer and defines a horizontal plane at a junction between the conductive feature and the lower dielectric material layer. The lower dielectric material layer has an upper facing surface facing in a direction of the IC die adjacent the conductive feature that is vertically offset from the horizontal plane.

Abstract: The present disclosure is directed to a patterned stiffener that includes a metallic body, which is a component of and is attached to a semiconductor device platform for providing rigidity. In an aspect, there are patterned sections formed on the metallic body that act to modulate the metallic body to obtain a desired configuration for the semiconductor device platform. In another aspect, the present disclosure is also directed to a method that includes providing a platform for forming an electronic component, disposing a stiffener having a metallic body on the platform, disposing at least one semiconductor device onto the platform, performing one or more bonding process steps, and exposing the stiffener to localized heating to modulate changes in the stiffener to a pre-determined shape or desired configuration.

Abstract: Hybrid cores including adhesive promotion layers and related methods are disclosed. An example substrate core for an integrated circuit disclosed herein includes a frame including interior edge, a glass panel including an exterior edge, and an adhesion promotion layer disposed between the interior edge and the exterior edge.

Abstract: Disclosed are a hydrogenated styrene/conjugated diolefin copolymer, a foaming material thereof, and application thereof. The copolymer contains a styrene structure unit and a hydrogenated conjugated diolefin structure unit; by taking the total content of the copolymer as a reference, the content of the styrene structure unit is 15-50 wt %, the content of 1,2-polymerization structure unit in the hydrogenated conjugated diolefin structure unit is 8-32%, the degree of randomness of the styrene structure unit in the hydrogenated conjugated diolefin structure unit is 30-80%, and the degree of hydrogenation of conjugated diolefin in the copolymer is 85-100%. The tensile strength at break of the hydrogenated styrene/conjugated diolefin copolymer is 30-60 MPa, the elongation at break is 300-600%, and the hardness (Shore A) is 70-98.

Abstract: Disclosed are a hydrogenated styrene/conjugated diolefin copolymer, a foaming material thereof, and application thereof. The copolymer contains a styrene structure unit and a hydrogenated conjugated diolefin structure unit; by taking the total content of the copolymer as a reference, the content of the styrene structure unit is 15-50 wt %, the content of 1,2-polymerization structure unit in the hydrogenated conjugated diolefin structure unit is 8-32%, the degree of randomness of the styrene structure unit in the hydrogenated conjugated diolefin structure unit is 30-80%, and the degree of hydrogenation of conjugated diolefin in the copolymer is 85-100%. The tensile strength at break of the hydrogenated styrene/conjugated diolefin copolymer is 30-60 MPa, the elongation at break is 300-600%, and the hardness (Shore A) is 70-98.