Abstract: A touch panel includes a substrate having a display area and a peripheral area. A peripheral circuit is disposed in the peripheral area. The peripheral circuit comprises at least one bonding pad made of a metal layer. A plurality of touch sensing electrodes is disposed in the display area. The plurality of touch sensing electrodes is made of a metal nanowire layer, a film layer disposed on the metal nanowire layer, and a negative-type photosensitive layer disposed on the film layer. The plurality of touch sensing electrodes is electrically connected to the peripheral circuit.

Abstract: A manufacturing method for a touch panel includes defining a removing area of a photo-sensitive conductive layer and a photo-sensitive layer by an exposure process. On a display area, the photo-sensitive layer and a metal nanowire layer in the removing area are removed by a developer solution so as to form a touch sensing electrode on the display area. On a peripheral area, the photo-sensitive conductive layer, the photo-sensitive layer, and the metal nanowire layer in the removing area are removed by the developer solution so as to form a peripheral trace on the peripheral area. The touch sensing electrode and the peripheral trace are electrically connected with each other.

Abstract: A touch panel includes a substrate having a display area and a peripheral area. A peripheral circuit is disposed in the peripheral area. The peripheral circuit comprises at least one bonding pad made of a metal layer. A plurality of touch sensing electrodes is disposed in the display area. The plurality of touch sensing electrodes is made of a metal nanowire layer, a film layer disposed on the metal nanowire layer, and a negative-type photosensitive layer disposed on the film layer. The plurality of touch sensing electrodes is electrically connected to the peripheral circuit.

Abstract: The direct patterning method includes: providing a substrate having a display area and a peripheral area, which a peripheral circuit having a bonding pad is disposed on the peripheral area; sequentially disposing a metal nanowire layer, a pre-cured film layer and a negative-type photosensitive layer thereon; performing a photolithography step; and curing the pre-cured film layer. The photolithography step includes exposing the negative-type photosensitive layer to define a removal region and a reserved region; and removing the negative-type photosensitive layer, the pre-cured film layer and the metal nanowire layer in the removal region by using a developer, such that a touch sensing electrode is fabricated in the display area and the bonding pad is exposed.

Abstract: A manufacturing method for a touch panel includes defining a removing area of a photo-sensitive conductive layer and a photo-sensitive layer by an exposure process. On a display area, the photo-sensitive layer and a metal nanowire layer in the removing area are removed by a developer solution so as to form a touch sensing electrode on the display area. On a peripheral area, the photo-sensitive conductive layer, the photo-sensitive layer, and the metal nanowire layer in the removing area are removed by the developer solution so as to form a peripheral trace on the peripheral area. The touch sensing electrode and the peripheral trace are electrically connected with each other.

Abstract: The direct patterning method includes: providing a substrate having a display area and a peripheral area, which a peripheral circuit having a bonding pad is disposed on the peripheral area; sequentially disposing a metal nanowire layer, a pre-cured film layer and a negative-type photosensitive layer thereon; performing a photolithography step; and curing the pre-cured film layer. The photolithography step includes exposing the negative-type photosensitive layer to define a removal region and a reserved region; and removing the negative-type photosensitive layer, the pre-cured film layer and the metal nanowire layer in the removal region by using a developer, such that a touch sensing electrode is fabricated in the display area and the bonding pad is exposed.