Abstract: An integrated circuit (IC) module includes a substrate, a first IC unit, a second IC unit, a cover and a carrier. The substrate has a first surface and a second surface opposite to the first surface. A plurality of first connecting pads is disposed on the second surface. The first IC unit is disposed on the first surface of the substrate. The cover covers the first IC unit. The second IC unit is disposed on the second surface of the substrate. The carrier is disposed corresponding to the first connecting pad and has a third surface, on which a plurality of second connecting pads is formed. The second connecting pads are electrically connected to the first connecting pads, respectively.

Abstract: A bonding method of an object having at least one pad on a surface of the object includes the steps of: putting a mask on the object, when the mask has at least one pattern corresponding to the pad; and printing to form a solder ball on the pad by a printing method.