Patents by Inventor Zheng Yu Gao

Zheng Yu Gao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for in-mold degating
    Patent number: 7695269
    Abstract: An apparatus and method for degating is provided for separating excess molding material from encapsulated electronic packages while the electronic packages are located in a molding system. At least one holding device is coupled to a mold of the molding system, which is located such that excess molding material is molded onto at least a portion of the holding device during molding. A locking feature on the portion of the holding device locks the excess molding material such that the holding device may hold the excess molding material molded onto it to forcibly separate the excess molding material from the encapsulated electronic packages after molding.
    Type: Grant
    Filed: May 25, 2007
    Date of Patent: April 13, 2010
    Assignee: ASM Technology Singapore Pte Ltd.
    Inventors: See Yap Ong, Si Liang Lu, Zheng Yu Gao, Swee Huat Lee
  • Vacuum molding apparatus
    Patent number: 7677874
    Abstract: A molding apparatus is provided for molding a leadframe, the molding apparatus comprising a mold having a leadframe-receiving area on its surface that is configured to receive and clamp the leadframe in the leadframe-receiving area. At least one molding cavity and a plurality of vacuum suction holes formed adjacent to the molding cavity are located within the leadframe-receiving area. The vacuum suction holes are operative to evacuate air from the mold surface, especially the molding cavity, through air vents connecting the vacuum suction holes to the molding cavity.
    Type: Grant
    Filed: February 2, 2007
    Date of Patent: March 16, 2010
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Zheng Yu Gao, Shu Chuen Ho
  • VACUUM MOLDING APPARATUS
    Publication number: 20080187615
    Abstract: A molding apparatus is provided for molding a leadframe, the molding apparatus comprising a mold having a leadframe-receiving area on its surface that is configured to receive and clamp the leadframe in the leadframe-receiving area. At least one molding cavity and a plurality of vacuum suction holes formed adjacent to the molding cavity are located within the leadframe-receiving area. The vacuum suction holes are operative to evacuate air from the mold surface, especially the molding cavity, through air vents connecting the vacuum suction holes to the molding cavity.
    Type: Application
    Filed: February 2, 2007
    Publication date: August 7, 2008
    Inventors: Zheng Yu GAO, Shu Chuen HO
  • APPARATUS AND METHOD FOR IN-MOLD DEGATING
    Publication number: 20070278710
    Abstract: An apparatus and method for degating is provided for separating excess molding material from encapsulated electronic packages while the electronic packages are located in a molding system. At least one holding device is coupled to a mold of the molding system, which is located such that excess molding material is molded onto at least a portion of the holding device during molding. A locking feature on the portion of the holding device locks the excess molding material such that the holding device may hold the excess molding material molded onto it to forcibly separate the excess molding material from the encapsulated electronic packages after molding.
    Type: Application
    Filed: May 25, 2007
    Publication date: December 6, 2007
    Inventors: See Yap ONG, Si Liang LU, Zheng Yu GAO, Swee Huat LEE