Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.

Abstract: Provided is a method for fast booting/shutting down a computing system. The method includes the steps of: when the computing system enters the hibernation mode, sorting the memory of the computing system into swappable pages and non-swappable pages and writing the non-swappable pages into a hibernation file of a storage device; determining whether the swappable pages are frequently-used pages or infrequently-used pages, and if the swappable pages are determined to be frequently-used pages, incorporating the frequently-used pages in the hibernation file; sorting the infrequently-used pages into clean pages and dirty pages; capturing one of the dirty pages and adding pages that are related to the captured page into at least one data set and placing the data set into a swap space of the storage device by continuous accessing process.