Patents by Inventor Zheng Zheng WONG

Zheng Zheng WONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TRANSDUCER, DEVICE AND METHOD FOR MONITORING INTEGRITY OF AN ADHESIVE BOND
    Publication number: 20210341427
    Abstract: A transducer for monitoring integrity of an adhesive bond between a first element and a second element, the transducer comprising: a transducing adhesive, the transducing adhesive provided to act as at least one of: an actuator to convert an electrical signal to an acoustic signal and a sensor to convert an acoustic signal to an electrical signal; and an electrode provided on the transducing adhesive, the electrode provided to perform at least one of: providing an electrical signal to the transducing adhesive and receiving an electrical signal from the transducing adhesive; wherein, in use, the transducer is provided at least partially in the adhesive bond between the first element and the second element, and the acoustic signal is passed through the adhesive bond.
    Type: Application
    Filed: October 25, 2019
    Publication date: November 4, 2021
    Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
    Inventors: Zheng Zheng WONG, Kui YAO, Shuting CHEN, Lei ZHANG