Patents by Inventor Zhenggang Cheng

Zhenggang Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Display backing
    Patent number: 11906745
    Abstract: Display backing components for head-mounted devices (HMDs) are described that reduce eddy currents in magnetic fields generated by a coil. A HMD may include a coil that is used to generate a magnetic field that may be used to track position of other devices with respect to the HMD. Display backing components, used to provide rigidity, are modified with holes or other gaps to interrupt the path of the eddy currents and reduce the interference with the magnetic field, thus improving the power efficiency of the coil and of the HMD. These modifications may be formed by casting, drilling, cutting or otherwise perforating the display backing during manufacture.
    Type: Grant
    Filed: April 14, 2022
    Date of Patent: February 20, 2024
    Assignee: Apple Inc.
    Inventors: Qianyi Zhao, Runren Zhang, Zhenggang Cheng, Jeffrey A Griffis, Stephen E Dey
  • High bandwidth routing for die to die interposer and on-chip applications
    Patent number: 10566286
    Abstract: Routing structures including signal routing between die areas is described. In an embodiment, routing structures include signal lines with a characteristic thickness that is greater than a width. The signal lines may be twisted, and run directly underneath pads.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: February 18, 2020
    Assignee: APPLE INC.
    Inventors: Sanjay Dabral, David A. Secker, Huabo Chen, Zhenggang Cheng
  • HIGH BANDWIDTH ROUTING FOR DIE TO DIE INTERPOSER AND ON-CHIP APPLICATIONS
    Publication number: 20190189560
    Abstract: Routing structures including signal routing between die areas is described. In an embodiment, routing structures include signal lines with a characteristic thickness that is greater than a width. The signal lines may be twisted, and run directly underneath pads.
    Type: Application
    Filed: January 17, 2019
    Publication date: June 20, 2019
    Inventors: Sanjay Dabral, David A. Secker, Huabo Chen, Zhenggang Cheng
  • High bandwidth routing for die to die interposer and on-chip applications
    Patent number: 10217708
    Abstract: Routing structures including signal routing between die areas is described. In an embodiment, routing structures include signal lines with a characteristic thickness that is greater than a width. The signal lines may be twisted, and run directly underneath pads.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: February 26, 2019
    Assignee: Apple Inc.
    Inventors: Sanjay Dabral, David A. Secker, Huabo Chen, Zhenggang Cheng