Patents by Inventor Zhengguo WEN

Zhengguo WEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulation structure with high density, multiple sided and exposed leads and method for manufacturing the same
    Patent number: 11088053
    Abstract: The invention discloses an encapsulation structure with high density, multiple sided and exposed leads and method for manufacturing the same. The encapsulation structure includes a package, a die pad and a plurality of leads, wherein the die pad and the leads are disposed at a bottom of the package; bottom surfaces of the leads expose in a bottom surface of the package, and the leads extends towards multiple sides of the package until beyond the package; the package includes an integrated circuit provided on the die pad and connected with the leads, and a plastic package for packaging the integrated circuit, the die pad and the leads; a bottom surface of the die pad and the bottom surfaces of the leads are provided on the same horizontal plane; the leads comprise a first lead distant from the die pad.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: August 10, 2021
    Assignee: GUANGDONG CHIPPACKING TECHNOLOGY CO., LTD.
    Inventors: Xilin Rao, Zhengguo Wen, Jianwei Yang, Yiwei Huang, Yiping Si, Fangbiao Liu
  • Encapsulation structure with high density, multiple sided and exposed leads and method for manufacturing the same
    Publication number: 20210183749
    Abstract: The invention discloses an encapsulation structure with high density, multiple sided and exposed leads and method for manufacturing the same. The encapsulation structure includes a package, a die pad and a plurality of leads, wherein the die pad and the leads are disposed at a bottom of the package; bottom surfaces of the leads expose in a bottom surface of the package, and the leads extends towards multiple sides of the package until beyond the package; the package includes an integrated circuit provided on the die pad and connected with the leads, and a plastic package for packaging the integrated circuit, the die pad and the leads; a bottom surface of the die pad and the bottom surfaces of the leads are provided on the same horizontal plane; the leads comprise a first lead distant from the die pad.
    Type: Application
    Filed: January 9, 2020
    Publication date: June 17, 2021
    Inventors: Xilin RAO, Zhengguo WEN, Jianwei YANG, Yiwei HUANG, Yiping SI, Fangbiao LIU