Patents by Inventor Zhengqing Gan

Zhengqing Gan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED ARRAY PACKAGE
    Publication number: 20240097084
    Abstract: Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 21, 2024
    Inventors: Vladimir ODNOBLYUDOV, Scott WEST, Cem BASCERI, Zhengqing GAN
  • LED ARRAY PACKAGE
    Publication number: 20240063352
    Abstract: Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.
    Type: Application
    Filed: August 21, 2023
    Publication date: February 22, 2024
    Inventors: Vladimir ODNOBLYUDOV, Scott West, Cem Basceri, Zhengqing Gan
  • LED array package
    Patent number: 11764341
    Abstract: Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.
    Type: Grant
    Filed: May 3, 2022
    Date of Patent: September 19, 2023
    Assignee: BRIDGELUX, INC.
    Inventors: Vladimir Odnoblyudov, Scott West, Cem Basceri, Zhengqing Gan
  • High efficiency chip-on-board light-emitting diode
    Patent number: 11495586
    Abstract: An LED CoB structure with the combination use of blue and red LED dies is used to achieve warm white light, with good quantum conversion efficiency at a reasonably low cost. Both the red and blue LED dies are fabricated on transparent substrates. The current density of the LED dies is designed to match the different degradation rate of each type of LED die. The methods used to achieve high efficiency include adjusting the power, wavelength, and/or position of the dies.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: November 8, 2022
    Assignee: BRIDGELUX, INC.
    Inventors: Peng Chen, Vladimir Odnoblyudov, Zhengqing Gan
  • METHODS OF MAKING LIGHT-EMITTING ASSEMBLIES COMPRISING AN ARRAY OF LIGHT-EMITTING DIODES HAVING AN OPTIMIZED LENS CONFIGURATION
    Publication number: 20220320051
    Abstract: Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.
    Type: Application
    Filed: April 12, 2022
    Publication date: October 6, 2022
    Inventors: Wenhui Zhang, Tao Tong, Zhengqing Gan
  • LED ARRAY PACKAGE
    Publication number: 20220262991
    Abstract: Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.
    Type: Application
    Filed: May 3, 2022
    Publication date: August 18, 2022
    Inventors: Vladimir ODNOBLYUDOV, Scott WEST, Cem BASCERI, Zhengqing GAN
  • LED array package
    Patent number: 11355680
    Abstract: Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: June 7, 2022
    Assignee: BRIDGELUX, INC.
    Inventors: Vladimir Odnoblyudov, Scott West, Cem Basceri, Zhengqing Gan
  • Methods of making light-emitting assemblies comprising an array of light-emitting diodes having an optimized lens configuration
    Patent number: 11302676
    Abstract: Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: April 12, 2022
    Assignee: Bridgelux, Inc.
    Inventors: Wenhui Zhang, Tao Tong, Zhengqing Gan
  • HIGH EFFICIENCY CHIP-ON-BOARD LIGHT-EMITTING DIODE
    Publication number: 20220013506
    Abstract: An LED CoB structure with the combination use of blue and red LED dies is used to achieve warm white light, with good quantum conversion efficiency at a reasonably low cost. Both the red and blue LED dies are fabricated on transparent substrates. The current density of the LED dies is designed to match the different degradation rate of each type of LED die. The methods used to achieve high efficiency include adjusting the power, wavelength, and/or position of the dies.
    Type: Application
    Filed: July 23, 2021
    Publication date: January 13, 2022
    Inventors: Peng CHEN, Vladimir ODNOBLYUDOV, Zhengqing GAN
  • High efficiency chip-on-board light-emitting diode
    Patent number: 11088119
    Abstract: An LED CoB structure with the combination use of blue and red LED dies is used to achieve warm white light, with good quantum conversion efficiency at a reasonably low cost. Both the red and blue LED dies are fabricated on transparent substrates. The current density of the LED dies is designed to match the different degradation rate of each type of LED die. The methods used to achieve high efficiency include adjusting the power, wavelength, and/or position of the dies.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: August 10, 2021
    Assignee: BRIDGELUX, INC.
    Inventors: Peng Chen, Vladimir Odnoblyudov, Zhengqing Gan
  • LED ARRAY PACKAGE
    Publication number: 20210226104
    Abstract: Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.
    Type: Application
    Filed: December 23, 2020
    Publication date: July 22, 2021
    Inventors: Vladimir ODNOBLYUDOV, Scott WEST, Cem BASCERI, Zhengqing GAN
  • LED array package
    Patent number: 10903403
    Abstract: Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: January 26, 2021
    Assignee: BRIDGELUX, INC.
    Inventors: Vladimir Odnoblyudov, Scott West, Cem Basceri, Zhengqing Gan
  • METHODS OF MAKING LIGHT-EMITTING ASSEMBLIES COMPRISING AN ARRAY OF LIGHT-EMITTING DIODES HAVING AN OPTIMIZED LENS CONFIGURATION
    Publication number: 20190371770
    Abstract: Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.
    Type: Application
    Filed: August 13, 2019
    Publication date: December 5, 2019
    Inventors: Wenhui Zhang, Tao Tong, Zhengqing Gan
  • HIGH EFFICIENCY CHIP-ON-BOARD LIGHT-EMITTING DIODE
    Publication number: 20190287950
    Abstract: An LED CoB structure with the combination use of blue and red LED dies is used to achieve warm white light, with good quantum conversion efficiency at a reasonably low cost. Both the red and blue LED dies are fabricated on transparent substrates. The current density of the LED dies is designed to match the different degradation rate of each type of LED die. The methods used to achieve high efficiency include adjusting the power, wavelength, and/or position of the dies.
    Type: Application
    Filed: February 19, 2019
    Publication date: September 19, 2019
    Inventors: Peng CHEN, Vladimir ODNOBLYUDOV, Zhengqing GAN
  • LED ARRAY PACKAGE
    Publication number: 20190273192
    Abstract: Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.
    Type: Application
    Filed: February 5, 2019
    Publication date: September 5, 2019
    Inventors: Vladimir ODNOBLYUDOV, Scott WEST, Cem BASCERI, Zhengqing GAN
  • Methods of making light-emitting assemblies comprising an array of light-emitting diodes having an optimized lens configuration
    Patent number: 10381333
    Abstract: Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: August 13, 2019
    Assignee: Bridgelux, Inc.
    Inventors: Wenhui Zhang, Tao Tong, Zhengqing Gan
  • High efficiency chip-on-board light-emitting diode
    Patent number: 10211185
    Abstract: An LED CoB structure with the combination use of blue and red LED dies is used to achieve warm white light, with good quantum conversion efficiency at a reasonably low cost. Both the red and blue LED dies are fabricated on transparent substrates. The current density of the LED dies is designed to match the different degradation rate of each type of LED die. The methods used to achieve high efficiency include adjusting the power, wavelength, and/or position of the dies.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: February 19, 2019
    Assignee: BRIDGELUX INC.
    Inventors: Peng Chen, Vladimir Odnoblyudov, Zhengqing Gan
  • LED array package
    Patent number: 10205069
    Abstract: Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: February 12, 2019
    Assignee: BRIDGELUX INC.
    Inventors: Vladimir Odnoblyudov, Scott West, Cem Basceri, Zhengqing Gan
  • METHODS OF MAKING LIGHT-EMITTING ASSEMBLIES COMPRISING AN ARRAY OF LIGHT-EMITTING DIODES HAVING AN OPTIMIZED LENS CONFIGURATION
    Publication number: 20180374830
    Abstract: Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.
    Type: Application
    Filed: June 26, 2018
    Publication date: December 27, 2018
    Inventors: Wenhui Zhang, Tao Tong, Zhengqing Gan
  • Methods of making light-emitting assemblies comprising an array of light-emitting diodes having an optimized lens configuration
    Patent number: 10008482
    Abstract: Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: June 26, 2018
    Assignee: Bridgelux, Inc.
    Inventors: Wenhui Zhang, Tao Tong, Zhengqing Gan