Patents by Inventor Zhenguo SHI

Zhenguo SHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220291326
    Abstract: A system and a method for event recognition comprising the steps of reading a signal transmitted over a defined space, wherein the signal reading includes signal information arranged to be affected by an event within the defined space; processing the signal information with a matching engine, wherein the engine is arranged to match the signal information with one or more associated event labels to recognize the event within the defined space.
    Type: Application
    Filed: September 1, 2020
    Publication date: September 15, 2022
    Inventors: Jian Zhang, Yi Da Xu, Zhenguo Shi
  • Patent number: 10731002
    Abstract: A semiaromatic copolyamide resin and a polyamide molding composition consisting of the same are provided, consisting of following repeat units: (A) 26-80 mol % of units derived from para-amino benzoic acid; (B) 4-70 mol % of units derived from 11-aminoundecanoic acid or undecanolactam, and 0-70 mol % of units derived from another amino acids having 6 to 36 carbon atoms or units consisting of a lactam having 6-36 carbon atoms; (C) 0-37 mol % of units derived from a diamine unit having 4 to 36 carbon atoms; and (D) 0-37 mol % of units derived from a diacid unit having 6 to 36 carbon atoms; wherein, (A)+(B)+(C)+(D)=100 mol %; and molar contents of the units derived from para-amino benzoic acid and those derived from 11-aminoundecanoic acid or undecanolactam are not equal to 50 mol % simultaneously.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: August 4, 2020
    Assignees: KINGFA SCI. & TECH. CO., LTD., ZHUHAI VANTEQUE SPECIALTY ENGINEERING PLASTICS CO., LTD., SHANGHAI KINGFA SCI. & TECH. DVPT. CO., LTD.
    Inventors: Chuanhui Zhang, Min Cao, Sujun Jiang, Zhenguo Shi, Xueke Sun, Liming Fan, Mingqin Chen, Mujun Huang, Xianbo Huang
  • Publication number: 20190002639
    Abstract: The present invention discloses a semiaromatic copolyamide resin and a polyamide molding composition consisting of the same, consisting of following repeat units: (A) 26-80 mol % of units derived from para-amino benzoic acid; (B) 4-70 mol % of units derived from 11-aminoundecanoic acid or undecanolactam, and 0-70 mol % of units derived from another amino acids having 6 to 36 carbon atoms or units consisting of a lactam having 6-36 carbon atoms; (C) 0-37 mol % of units derived from a diamine unit having 4 to 36 carbon atoms; and (D) 0-37 mol % of units derived from a diacid unit having 6 to 36 carbon atoms; wherein, (A)+(B)+(C)+(D)=100 mol %; and molar contents of the units derived from para-amino benzoic acid and those derived from 11-aminoundecanoic acid or undecanolactam are not equal to 50 mol % simultaneously.
    Type: Application
    Filed: March 29, 2017
    Publication date: January 3, 2019
    Applicants: KINGFA SCI. & TECH. CO., LTD., ZHUHAI VANTEQUE SPECIALTY ENGINEERING PLASTICS CO., LTD., SHANGHAI KINGFA SCI. & TECH. DVPT. CO., LTD.
    Inventors: Chuanhui ZHANG, Min CAO, Sujun JIANG, Zhenguo SHI, Xueke SUN, Liming FAN, Mingqin CHEN, Mujun HUANG, Xianbo HUANG
  • Publication number: 20190002638
    Abstract: The present invention discloses a semiaromatic polyamide resin, a preparation method thereof, and a polyamide molding composition consisting of the same, which consists of following components: (A) 20 to 95 wt % of a PA10T homopolymer derived from 1,10-decanediamine and terephthalic acid; and (B) 5 to 80 wt % of a PA6T homopolymer derived from 1,6-hexanediamine and terephthalic acid. Particularly, (A)+(B)=100 wt %. In the present invention, by adding a certain amount of the PA10T homopolymer into the PA6T homopolymer, a melting point of the PA6T homopolymer can be significantly decreased to be below a decomposition temperature thereof, and thereby a processability of the PA6T homopolymer is improved. The prepared semiaromatic polyamide resin has a decreased melting point, and may be processed normally. The polyamide molding composition consisting of the semiaromatic polyamide resin has a good processability, and has excellent surface properties.
    Type: Application
    Filed: June 9, 2017
    Publication date: January 3, 2019
    Applicants: KINGFA SCI. & TECH. CO., LTD., ZHUHAI VANTEQUE SPECIALTY ENGINEERING PLASTICS CO., LTD.
    Inventors: Chuanhui ZHANG, Min CAO, Sujun JIANG, Xianbo HUANG, Jiehong MAI, Jieming LONG, Zhenguo SHI, Kun YAN, Liming FAN