Abstract: The present invention provides a repairing method for a hydraulic-end valve cage cavity. First, a to-be-repaired hydraulic-end valve cage cavity is mechanically processed to reserve a unilateral repair size of the cavity; shot blasting and cleaning are performed on the cavity; basic repairing is performed on the cavity to form a backing welding layer, and welding and cladding repairing are performed on the backing welding layer for n layers, to form n repair-welding layers; and finally machine finishing is performed on the cavity having undergone welding repair. The repairing method is also applicable to repairing of a plunger-end seal hole. The repairing method provided in the present invention is simple and is easy to be controlled, and a repaired hydraulic-end valve cage and plunger-end seal hole can be used in on-site fracturing construction in a condition of 50 MPa to 100 MPa for 200 h.

Abstract: Die attach methods used in making semiconductor devices and the semiconductor devices resulting from those methods are described. The methods include providing a leadframe with a die attach pad, using a boundary feature(s) containing a bond wire to define a perimeter on the die attach pad, depositing a conductive material (such as solder) within the perimeter, and then attaching a die containing an integrated circuit device to the die attach pad by using the conductive material. The boundary feature(s) allow an increased thickness of conductive material to be used, resulting in increased bond line thickness and increasing the durability and performance of the resulting semiconductor package. Other embodiments are described.

Abstract: Methods, apparatus, and computer readable media with executable instructions stored thereon for optimizing resource skill compliance are provided. Example methods of the present disclosure can include identifying jobs, skills corresponding to the jobs, and resources corresponding to the skills. A job skill level is associated with each skill of each job, and a resource skill level is associated with each skill of each resource. An individual skill compliance is determined by computer for each skill of each resource with respect to each skill of each job based on the resource skill level relative to the job skill level. A resource skill compliance is determined by computer for each resource with respect to each job as a total of the individual skill level compliances for each skill corresponding to each job, and resources are assigned by a computer to jobs in a manner that optimizes a total of the resource skill compliances for those resources assigned to jobs.

Abstract: Die attach methods used in making semiconductor devices and the semiconductor devices resulting from those methods are described. The methods include providing a leadframe with a die attach pad, using a boundary feature(s) containing a bond wire to define a perimeter on the die attach pad, depositing a conductive material (such as solder) within the perimeter, and then attaching a die containing an integrated circuit device to the die attach pad by using the conductive material. The boundary feature(s) allow an increased thickness of conductive material to be used, resulting in increased bond line thickness and increasing the durability and performance of the resulting semiconductor package. Other embodiments are described.

Abstract: Die attach methods used in making semiconductor devices and the semiconductor devices resulting from those methods are described. The methods include providing a leadframe with a die attach pad, using boundary features to define a perimeter on the die pad, depositing a conductive material (such as solder) within the perimeter, and then bonding a die containing an integrated circuit to the die pad by using the conductive material. The boundary features allow an increased thickness of conductive material to be used, resulting in an increased bond line thickness and increasing the durability and performance of the resulting semiconductor device.

Abstract: An optocoupler package is disclosed. The package includes a substrate comprising a substrate surface, a first device, and a clip structure attached to the first device. The clip structure and the first device are mounted on the substrate, and the first device is oriented at an angle with respect to the substrate surface. A second device is mounted on the substrate, where the first device is capable of communicating with the second device.

Abstract: An optocoupler package is disclosed. The package includes a substrate comprising a substrate surface, a first device, and a clip structure attached to the first device. The clip structure and the first device are mounted on the substrate, and the first device is oriented at an angle with respect to the substrate surface. A second device is mounted on the substrate, where the first device is capable of communicating with the second device.

Abstract: Die attach methods used in making semiconductor devices and the semiconductor devices resulting from those methods are described. The methods include providing a leadframe with a die attach pad, using boundary features to define a perimeter on the die pad, depositing a conductive material (such as solder) within the perimeter, and then bonding a die containing an integrated circuit to the die pad by using the conductive material. The boundary features allow an increased thickness of conductive material to be used, resulting in an increased bond line thickness and increasing the durability and performance of the resulting semiconductor device.