Patents by Inventor Zhengyuan WEI

Zhengyuan WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for dynamically measuring deformation of rotating-body mold
    Patent number: 11544837
    Abstract: A method for dynamically measuring deformation of a rotating-body mold, including: (S1) subjecting an overall outer surface of the rotating-body mold to three-dimensional measurement to acquire an initial point cloud data; (S2) shooting, by a multi-camera system, the mold from different angles to obtain three-dimensional coordinates of marking points and coding points on the overall outer surface of the rotating-body mold; (S3) rotating the mold, and repeatedly photographing the marking points and the coding points on the mold surface under different angle poses; and calculating three-dimensional coordinates of the marking points and the coding points; and (S4) predicting a point cloud data of the outer surface under different angle poses based on a conversion relationship among the marking points to analyze a deformation degree of the mold during a rotation process.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: January 3, 2023
    Assignee: NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS
    Inventors: Zhongde Shan, Jun Wang, Zhengyuan Wei, Honghua Chen, Qian Xie
  • METHOD FOR DYNAMICALLY MEASURING DEFORMATION OF ROTATING-BODY MOLD
    Publication number: 20220198648
    Abstract: A method for dynamically measuring deformation of a rotating-body mold, including: (S1) subjecting an overall outer surface of the rotating-body mold to three-dimensional measurement to acquire an initial point cloud data; (S2) shooting, by a multi-camera system, the mold from different angles to obtain three-dimensional coordinates of marking points and coding points on the overall outer surface of the rotating-body mold; (S3) rotating the mold, and repeatedly photographing the marking points and the coding points on the mold surface under different angle poses; and calculating three-dimensional coordinates of the marking points and the coding points; and (S4) predicting a point cloud data of the outer surface under different angle poses based on a conversion relationship among the marking points to analyze a deformation degree of the mold during a rotation process.
    Type: Application
    Filed: January 13, 2022
    Publication date: June 23, 2022
    Inventors: Zhongde SHAN, Jun WANG, Zhengyuan WEI, Honghua CHEN, Qian XIE