Patents by Inventor ZHENG-YUN CHEN

ZHENG-YUN CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11942358
    Abstract: The present disclosure describes a method of forming low thermal budget dielectrics in semiconductor devices. The method includes forming, on a substrate, first and second fin structures with an opening in between, filling the opening with a flowable isolation material, treating the flowable isolation material with a plasma, and removing a portion of the plasma-treated flowable isolation material between the first and second fin structures.
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Mrunal Abhijith Khaderbad, Ko-Feng Chen, Zheng-Yong Liang, Chen-Han Wang, De-Yang Chiou, Yu-Yun Peng, Keng-Chu Lin
  • Publication number: 20140211426
    Abstract: A motherboard includes a resistor, a display card controller, first and second display connectors, and a signal switch chip. A display device is connected to either the first or second display connector. A detecting pin of the first display connector is connected to a power source through the resistor. The signal switch chip is connected between the display card controller and each of the first display connector and the second display connector.
    Type: Application
    Filed: December 30, 2013
    Publication date: July 31, 2014
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: ZHENG-YUN CHEN, JIN-XING CHEN, AI-YU PAN