Abstract: Substrates, particularly low surface energy substrates, can be bonded using certain solvent-free liquid polyurethane adhesives. The adhesive cures through reaction with moisture and/or an active hydrogen-containing curing agent to form a tough, strong, thermoset polymer having excellent chemical and heat resistance. The adhesive is based on a polyurethane prepolymer obtained by reacting a stoichiometric excess of at least one polyfunctional isocyanate having a functionality of less than 2.2 with at least one polyether polyol and at least one polyester polyol containing isophthalic acid moieties but relatively few if any phthalic acid or terephthalic acid moieties.

Abstract: Substrates, particularly low surface energy substrates, can be bonded using certain solvent-free liquid polyurethane adhesives. The adhesive cures through reaction with moisture and/or an active hydrogen-containing curing agent to form a tough, strong, thermoset polymer having excellent chemical and heat resistance. The adhesive is based on a polyurethane prepolymer obtained by reacting a stoichiometric excess of at least one polyfunctional isocyanate having a functionality of less than 2.2 with at least one polyether polyol and at least one polyester polyol containing isophthalic acid moieties but relatively few if any phthalic acid or terephthalic acid moieties.

Abstract: Hot melt polyurethane adhesive compositions which are solid at room temperature and capable of being cured by moisture are obtained by combining isocyanate-functionalized polyurethane prepolymers and hollow polymeric microspheres. The adhesive compositions exhibit enhanced green strength, shortened open time and reduced densities as compared to analogous adhesives that are not modified with hollow polymeric microspheres.

Abstract: A copper clad metal printing plate can be coated with an azide-containing photoresist comprising a polyformal resin together with a modified polyformal resin that has up to 100% of its hydroxyl groups converted to carboxyl groups, an organo azide and a photosensitive dye that absorbs light at the frequency of a patterning laser and converts it to heat energy. This de-crosslinks the resin that has been exposed to the laser light. Preferably the photoresist is flood exposed with ultraviolet light prior to laser exposure. The photoresist becomes soluble in the laser-exposed areas, exposing the underlying copper after development. The printing plates are completed by etching away the copper in the exposed areas, removing the remaining photoresist, thereby providing a patterned copper layer on the printing plate.

Abstract: A metal substrate printing plate is provided comprising a surface layer of a photosensitive composition containing azide compound, an IR sensitive dye, a crosslinkable polymer resin and an adhesion promoting resin that is put through a post thermal process during the manufacturing of the plate. This special thermal treatment allows for improved mechanical and chemical resistance as well as affording run lengths up to one million impressions after imaging and processing.

Abstract: A copper clad metal printing plate can be coated with an azide-containing photoresist comprising a polyformal resin together with a modified polyformal resin that has up to 100% of its hydroxyl groups converted to carboxyl groups, an organo azide and a photosensitive dye that absorbs light at the frequency of a patterning laser and converts it to heat energy. This de-crosslinks the resin that has been exposed to the laser light. Preferably the photoresist is flood exposed with ultraviolet light prior to laser exposure. The photoresist becomes soluble in the laser-exposed areas, exposing the underlying copper after development. The printing plates are completed by etching away the copper in the exposed areas, removing the remaining photoresist, thereby providing a patterned copper layer on the printing plate.

Abstract: A copper clad metal printing plate can be coated with an azide-containing photoresist comprising a polyformal resin together with a modified polyformal resin that has up to 100% of its hydroxyl groups converted to carboxyl groups, an organo azide and a photosensitive dye that absorbs light at the frequency of a patterning laser and converts it to heat energy. This de-crosslinks the resin that has been exposed to the laser light. Preferably the photoresist is flood exposed with ultraviolet light prior to laser exposure. The photoresist becomes soluble in the laser-exposed areas, exposing the underlying copper after development. The printing plates are completed by etching away the copper in the exposed areas, removing the remaining photoresist, thereby providing a patterned copper layer on the printing plate.

Abstract: A method of making improved aluminum printing plates comprising graining the aluminum plates, de-smutting them by treating them with nitric acid solution, then rinsing with hot water, acetating the aluminum plates, and silicating the aluminum plates. The plates are then coated with a photoresist, pattern exposed and developed. The printing plates of the invention have improved characteristics; they have excellent adhesion of the resist in image areas, and ink repellency in non-image areas. The developed printing plates have excellent durability without baking.

Abstract: A method of making improved aluminum printing plates comprising graining the aluminum plates, de-smutting them by treating them with nitric acid solution, then rinsing with hot water, acetating the aluminum plates, and silicating the aluminum plates. The plates are then coated with a photoresist, pattern exposed and developed. The printing plates of the invention have improved characteristics; they have excellent adhesion of the resist in image areas, and ink repellency in non-image areas. The developed printing plates have excellent durability without baking.