Patents by Inventor Zhenhai YIN

Zhenhai YIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230316969
    Abstract: A display panel, a motherboard, and a mini LED display device. The display panel includes: a panel edge extending along a first direction, and a display region and a test region. The test region is between the display region and the panel edge and includes test pads. At least two test pads are arranged along the first direction, adjacent ones of which are spaced by at least two first electrostatic discharge protection wires extending from one side of the display region adjacent to the test region to the panel edge. Each first electrostatic discharge protection wire includes a first line segment located between two adjacent test pads and a second line segment adjacent to the panel edge. A distance between adjacent first line segments between two adjacent test pads in the first direction is less than a distance between adjacent second line segments in the first direction.
    Type: Application
    Filed: April 12, 2023
    Publication date: October 5, 2023
    Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
    Inventors: Yimiao DING, Lihua WANG, Zhenhai YIN, Tingting LI, Peng GUI, Zhicheng WU, Qiongqin MAO
  • Publication number: 20230275102
    Abstract: A curved light-emitting substrate and its formation method, and a display apparatus are provided in the present disclosure. The curved light-emitting substrate includes a substrate; an array layer, disposed on a side of the substrate; a plurality of light-emitting elements, electrically connected to the array layer, where a light-emitting element of the plurality of light-emitting elements includes a light-emitting main body and a first soldering pad on a side of the light-emitting main body facing the array layer; a second soldering pad which is on a side of the array layer facing the light-emitting element and electrically connected to the first soldering pad; and a flexible padding layer, between the light-emitting main body and the array layer along a first direction, where the first direction is perpendicular to a surface of the array layer.
    Type: Application
    Filed: April 26, 2022
    Publication date: August 31, 2023
    Inventors: Zhenhai YIN, Shanshan LIU