Patents by Inventor Zhenhua Gu

Zhenhua Gu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240340593
    Abstract: The present disclosure discloses a sounding device including a frame, a vibration system mounted on the frame, including a diaphragm fixed to the frame and enclosing a front cavity with the frame; and a magnet system configured to drive the vibration system to generate sound, enclosing a rear cavity with the diaphragm and the frame; a connection hole is provided on the frame for connecting the front cavity with the rear cavity; an air-permeable membrane is inserted into the frame and covers the connection hole. The sounding device in the present disclosure has high assembly performance, waterproof performance and acoustic performance.
    Type: Application
    Filed: November 24, 2023
    Publication date: October 10, 2024
    Inventors: Wei Pang, Zhenhua Gu
  • Patent number: 9669426
    Abstract: A method for manufacturing a heat conductive adhesive film includes: forming a non-solid heat conductive adhesive layer with cured particles on a substrate; forming several bumps on the non-solid heat conductive adhesive layer while performing curing, so as to yield the heat conductive adhesive film with several bumps. A heat conductive adhesive film and an OLED panel are provided. Several bumps are formed on a flat surface of the heat conductive adhesive film, thus increasing the surface area of the heat conductive adhesive film such that heat from the heat generating unit can be duly discharged.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: June 6, 2017
    Assignees: BOE HYUNDAI LCD INC., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Quanzhong Wang, Zhenhua Gu, Moyu Zhu
  • Publication number: 20140342117
    Abstract: A method for manufacturing a heat conductive adhesive film includes: forming a non-solid heat conductive adhesive layer with cured particles on a substrate; forming several bumps on the non-solid heat conductive adhesive layer while performing curing, so as to yield the heat conductive adhesive film with several bumps. A heat conductive adhesive film and an OLED panel are provided. Several bumps are formed on a flat surface of the heat conductive adhesive film, thus increasing the surface area of the heat conductive adhesive film such that heat from the heat generating unit can be duly discharged.
    Type: Application
    Filed: September 17, 2013
    Publication date: November 20, 2014
    Inventors: Quanzhong Wang, Zhenhua Gu, Moyu Zhu