Abstract: A sensor package includes host substrate assembly includes a first substrate, circuit layers in the first substrate, and first contact pads electrically coupled to the circuit layers. A sensor chip includes a second substrate with opposing first and second surfaces, sensor(s) formed on or under the first surface of the second substrate, a plurality of second contact pads formed at the first surface of the second substrate and which are electrically coupled to the sensor(s), a plurality of holes each formed into the second surface of the second substrate and extends through the second substrate to one of the second contact pads, and conductive leads each extending from one of the second contact pads, through one of the plurality of holes, and along the second surface of the second substrate. A plurality of electrical connectors each electrically connect one of the first contact pads and one of the conductive leads.

Abstract: A sensor package comprising a host substrate with opposing first and second surfaces, an aperture extending therethrough, circuit layers, and first contact pads. A second substrate at least partially in the aperture has opposing first and second surfaces, a plurality of photo detectors, second contact pads at the second substrate first surface and electrically coupled to the photo detectors, and trenches formed into the second substrate first surface, conductive traces extending from the second contact pads and into the trenches. A third substrate has a first surface mounted to the first surface of the second substrate. The third substrate includes a cavity formed into its first surface and positioned over the photo detectors. Electrical connectors connect the first contact pads and conductive traces. A lens module is mounted to the host substrate for focusing light through the third substrate and onto the photo detectors.

Abstract: A method of forming lenses includes providing a lens handler having a plurality of cavities formed into an upper surface thereof. For each of the cavities, the method includes dispensing a first polymer material into the cavity, pressing a non-planar stamp surface onto the first polymer material wherein an upper surface of the first polymer material is conformed to the non-planar stamp surface, and applying UV light to the first polymer material to cure the first polymer material. A dispenser carrier can be used that includes a plurality of liquid polymer dispensers. A stamp carrier can be used that includes a plurality of stamps each having a non-planar stamp surface. Alternately, a stamp handler having a plurality of stamps arranged along a curved surface can be used to roll along the polymer material such that an upper surface thereof conforms to the non-planar stamp surfaces.

Abstract: This invention is a new type of drum brake and its variants for motor vehicles, the shoe mechanism assembly of which has at least one set of interconnected shoe mechanism and automatic adjusting mechanism of brake clearance. The interconnected shoe mechanism consists of two interconnected composite shoes of multiple degrees of freedom. Each composite shoe consists of a shoe and a driving lever. The shoe is jointed to the driving lever with a cylindrical pin or a elliptical pin matching with a cylindrical hole or a spherical joint, and the driving lever is pivoted on the backplate of brake with a cylindrical pin or a elliptical pin matching with a cylindrical hole or a spherical joint. The automatic clearance adjusting mechanism is fixed on the backplate and interconnected with the driving lever.

Abstract: This invention is a new type of drum brake and its variants for motor vehicles, the shoe mechanism assembly of which has at least one set of interconnected shoe mechanism and automatic adjusting mechanism of brake clearance. The interconnected shoe mechanism consists of two interconnected composite shoes of multiple degrees of freedom. Each composite shoe consists of a shoe and a driving lever. The shoe is jointed to the driving lever with a cylindrical pin or a elliptical pin matching with a cylindrical hole or a spherical joint, and the driving lever is pivoted on the backplate of brake with a cylindrical pin or a elliptical pin matching with a cylindrical hole or a spherical joint. The automatic clearance adjusting mechanism is fixed on the backplate and interconnected with the driving lever.