Abstract: The present application provides a liquid metal microcapsule, a conductive paste and preparation methods thereof, and an electronic device, and relates to the technical field of new materials. The present application provides a liquid metal microcapsule, including: a liquid metal core, a cohesive layer coating the liquid metal core, and a coating layer coating the cohesive layer. Binding force between the cohesive layer and liquid metal is greater than that between the coating layer and the liquid metal, and binding force between the cohesive layer and the coating layer is greater than that between the coating layer and the liquid metal. According to the technical solution of the present application, stability of the conductive paste containing liquid metal can be improved.

Abstract: A method for prepares low melting point metal particles, a conductive paste and a method for preparing the conductive paste, and relates to the technical field of functional materials. The method for preparing low melting point metal particles includes providing an organic resin carrier having fluidity, adding a low melting point metal material and the organic resin carrier into a sealed container for a vacuuming operation or filling a protective gas, making a temperature in the sealed container higher than the melting point of the low melting point metal and performing dispersion by stirring, and lowering the temperature, after performing the dispersion, to be below the melting point of the low melting point metal with continuous stirring during a cooling process to obtain low melting point metal particles dispersed in the organic resin carrier. Low melting point metal particles can be effectively prepared.

Abstract: The present application provides a liquid metal microcapsule, a conductive paste and preparation methods thereof, and an electronic device, and relates to the technical field of new materials. The present application provides a liquid metal microcapsule, including: a liquid metal core, a cohesive layer coating the liquid metal core, and a coating layer coating the cohesive layer. Binding force between the cohesive layer and liquid metal is greater than that between the coating layer and the liquid metal, and binding force between the cohesive layer and the coating layer is greater than that between the coating layer and the liquid metal. According to the technical solution of the present application, stability of the conductive paste containing liquid metal can be improved.

Abstract: The present disclosure provides a liquid metal conductive paste and an electronic device, and relates to a technical field of new materials. The liquid metal conductive paste provided by the present disclosure includes: 1%-50% by weight of a liquid metal microcapsule, 30%-80% by weight of a conductive powder, 1%-25% by weight of a base polymer and 10%-40% by weight of a solvent. A capsule wall of the liquid metal microcapsule is made of a coating polymer, and a capsule core is made of a liquid metal. Melting point of the liquid metal satisfies: the liquid metal is in a liquid state at least when the wire made of the liquid metal conductive paste is deformed. The present disclosure can achieve a better flexible wire.

Abstract: A flexible conductive paste and a flexible electronic device are provided, which relate to the technical field of new materials. The flexible conductive paste includes: 3% to 7% by weight of a film former; 20% to 50% by weight of a conductive powder; 25% to 45% by weight of a liquid metal microcapsule; 10% to 30% by weight of a solvent; 0.1% to 5% by weight of a curing agent; and 0.5% to 5% by weight of a functional additive. The wall of the liquid metal microcapsule is a coating resin, the core of the liquid metal microcapsule is a liquid metal. The melting point Tm of the liquid metal satisfies Tm?T1. The film former has a molecular weight within a range of 15000 to 30000, and has a glass transition temperature Tg smaller than or equal to T1. T1 is a temperature at which the flexible conductive circuit manufactured by the flexible conductive paste is deformed. The flexible conductive circuit of the present disclosure can have better conductivity and better flexibility simultaneously.

Abstract: The present disclosure provides a liquid metal conductive paste and an electronic device, and relates to a technical field of new materials. The liquid metal conductive paste provided by the present disclosure includes: 1%-50% by weight of a liquid metal microcapsule, 30%-80% by weight of a conductive powder, 1%-25% by weight of a base polymer and 10%-40% by weight of a solvent. A capsule wall of the liquid metal microcapsule is made of a coating polymer, and a capsule core is made of a liquid metal. Melting point of the liquid metal satisfies: the liquid metal is in a liquid state at least when the wire made of the liquid metal conductive paste is deformed. The present disclosure can achieve a better flexible wire.

Abstract: A flexible conductive paste and a flexible electronic device are provided, which relate to the technical field of new materials. The flexible conductive paste includes: 3% to 7% by weight of a film former; 20% to 50% by weight of a conductive powder; 25% to 45% by weight of a liquid metal microcapsule; 10% to 30% by weight of a solvent; 0.1% to 5% by weight of a curing agent; and 0.5% to 5% by weight of a functional additive. The wall of the liquid metal microcapsule is a coating resin, the core of the liquid metal microcapsule is a liquid metal. The melting point Tm of the liquid metal satisfies Tm?T1. The film former has a molecular weight within a range of 15000 to 30000, and has a glass transition temperature Tg smaller than or equal to T1. T1 is a temperature at which the flexible conductive circuit manufactured by the flexible conductive paste is deformed. The flexible conductive circuit of the present disclosure can have better conductivity and better flexibility simultaneously.