Abstract: Disclosed is a preparation method for a low-color number, low-odor polyisocyanate curing agent. The preparation method comprises a step of carrying out a polymerization reaction on a diisocyanate monomer under the action of a trimerization catalyst in a polymerization reaction kettle with continuously flowing inert gas, an upper head of the polymerization reaction kettle being provided with an inert gas inlet pipe, the inert gas inlet pipe being an insertion pipe, and the upper head of the polymerization reaction kettle also being provided with an inert gas outlet and a central stirring shaft; the insertion opening position (A) of the inert gas inlet pipe and the inert gas outlet position (B) on the surface of the upper head form an angle ? (?ACB) with the fixed position (C) of the central stirring shaft projected onto the plane on the upper head surface, where 30°???180°.

Abstract: The disclosure discloses a liquid metal packaging structure for chip heat dissipation, comprising: a fixing frame and a sealing frame, wherein a chip is provided in the inner frame of the sealing frame, and a heat sink is provided on side of the sealing frame away from the electronic component, and the heat sink is hermetically covered on an end surface of the sealing frame, the sealing frame is filled with liquid metal, and the heat sink is integrally molded with a pressing block at a position corresponding to the inner frame of the sealing frame, and the liquid metal is arranged between the chip and the pressing block. According to the liquid metal packaging structure for chip heat dissipation, the sealing frame is fixed by the fixing frame, and the sealing frame is filled with liquid metal.