Patents by Inventor Zhenqiu GAO

Zhenqiu GAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging structure and method of packaging tunable laser device, and tunable laser device
    Patent number: 9608402
    Abstract: The present disclosure provides a packaging structure and a method of packaging an tunable laser device, and an tunable laser device. The packaging structure of the tunable laser device may include a TO tube base and a TO tube cap, wherein a first thermal sink is disposed on the TO tube base, a semiconductor laser chip is disposed on a vertical side of the first thermal sink, an aspheric lens is disposed on the TO tube cap, and the semiconductor laser chip is disposed on a central axis of the aspheric lens; and wherein the vertical side of the first thermal sink is a side of the first thermal sink perpendicular to the TO tube base. The tunable laser device according to the present disclosure may be applicable to communication over an optical fiber.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: March 28, 2017
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA CORPORATION, HISENSE INTERNATIONAL CO., LTD.
    Inventor: Zhenqiu Gao
  • PACKAGING STRUCTURE AND METHOD OF PACKAGING TUNABLE LASER DEVICE, AND TUNABLE LASER DEVICE
    Publication number: 20160276802
    Abstract: The present disclosure provides a packaging structure and a method of packaging an tunable laser device, and an tunable laser device. The packaging structure of the tunable laser device may include a TO tube base and a TO tube cap, wherein a first thermal sink is disposed on the TO tube base, a semiconductor laser chip is disposed on a vertical side of the first thermal sink, an aspheric lens is disposed on the TO tube cap, and the semiconductor laser chip is disposed on a central axis of the aspheric lens; and wherein the vertical side of the first thermal sink is a side of the first thermal sink perpendicular to the TO tube base. The tunable laser device according to the present disclosure may be applicable to communication over an optical fiber.
    Type: Application
    Filed: May 31, 2016
    Publication date: September 22, 2016
    Inventor: Zhenqiu GAO
  • Packaging structure and method of packaging tunable laser device, and tunable laser device
    Patent number: 9379518
    Abstract: The present disclosure provides a packaging structure and a method of packaging an tunable laser device, and an tunable laser device. The packaging structure of the tunable laser device may include a TO tube base and a TO tube cap, wherein a first thermal sink is disposed on the TO tube base, a semiconductor laser chip is disposed on a vertical side of the first thermal sink, an aspheric lens is disposed on the TO tube cap, and the semiconductor laser chip is disposed on a central axis of the aspheric lens; and wherein the vertical side of the first thermal sink is a side of the first thermal sink perpendicular to the TO tube base. The tunable laser device according to the present disclosure may be applicable to communication over an optical fiber.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: June 28, 2016
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA CORPORATION, HISENSE INTERNATIONAL CO., LTD.
    Inventor: Zhenqiu Gao
  • PACKAGING STRUCTURE AND METHOD OF PACKAGING TUNABLE LASER DEVICE, AND TUNABLE LASER DEVICE
    Publication number: 20160064896
    Abstract: The present disclosure provides a packaging structure and a method of packaging an tunable laser device, and an tunable laser device. The packaging structure of the tunable laser device may include a TO tube base and a TO tube cap, wherein a first thermal sink is disposed on the TO tube base, a semiconductor laser chip is disposed on a vertical side of the first thermal sink, an aspheric lens is disposed on the TO tube cap, and the semiconductor laser chip is disposed on a central axis of the aspheric lens; and wherein the vertical side of the first thermal sink is a side of the first thermal sink perpendicular to the TO tube base. The tunable laser device according to the present disclosure may be applicable to communication over an optical fiber.
    Type: Application
    Filed: March 24, 2015
    Publication date: March 3, 2016
    Inventor: Zhenqiu GAO