Abstract: An Organic Light-Emitting Diode display substrate and a preparation method thereof. The Organic Light-Emitting Diode display substrate includes: a first flexible organic layer; a first inorganic layer on the first flexible organic layer; a second flexible organic layer on the first inorganic layer; a pixel driving circuit layer on the second flexible organic layer; a light-emitting element layer on the pixel driving circuit layer, and a thickness of the first flexible organic layer is 5 ?m-20 ?m, a thickness of the first inorganic layer is 0.4 ?m-0.5 ?m, and a thickness of the second flexible organic layer is 5 ?m-20 ?m.

Abstract: A display substrate motherboard and a preparation method thereof, a display substrate and a preparation method thereof are disclosed. The display substrate motherboard includes a base substrate, a first flexible organic layer, a first inorganic layer, a second flexible organic layer and a pixel driving circuit layer. The pixel driving circuit layer includes a plurality of pixel driving circuit portions respectively used for a plurality of display substrates, and the plurality of pixel driving circuit portions are insulated from each other. An orthogonal projection of the second flexible organic layer on the base substrate is located inside an orthogonal projection of the first inorganic layer on the base substrate. An orthogonal projection of each of the pixel driving circuit portions on the base substrate is located inside the orthogonal projection of the second flexible organic layer on the base substrate.

Abstract: A display substrate motherboard and a preparation method thereof, a display substrate and a preparation method thereof are disclosed. The display substrate motherboard includes a base substrate, a first flexible organic layer, a first inorganic layer, a second flexible organic layer and a pixel driving circuit layer. The pixel driving circuit layer includes a plurality of pixel driving circuit portions respectively used for a plurality of display substrates, and the plurality of pixel driving circuit portions are insulated from each other. An orthogonal projection of the second flexible organic layer on the base substrate is located inside an orthogonal projection of the first inorganic layer on the base substrate. An orthogonal projection of each of the pixel driving circuit portions on the base substrate is located inside the orthogonal projection of the second flexible organic layer on the base substrate.

Abstract: This disclosure provides a deaeration apparatus comprising: a closable deaeration cavity configured to accommodate a liquid to be deaerated; a heating member configured to heat the deaeration cavity; a temperature detection member configured to detect a temperature inside the deaeration cavity; and a controller configured to receive the temperature detected by the temperature detection member and control the heating member based on the temperature. When using in deaeration of a liquid, the deaeration apparatus of the disclosure can shorten the deaeration time and improve the deaeration efficiency of the liquid.

Abstract: A curing apparatus and a curing method are provided. The curing apparatus comprises: a chamber, configured for accommodating a substrate provided with a polyimide adhesive; an air extracting unit, configured for evacuating the chamber; and a heating unit, configured for performing a first heating on the substrate in the case that a first predetermined pressure is reached in the chamber during a evacuating process of the air extracting unit so as to remove organic gases from the polyimide adhesive, and performing a second heating on the substrate after the first heating so as to cure the polyimide adhesive.

Abstract: This disclosure provides a deaeration apparatus comprising: a closable deaeration cavity configured to accommodate a liquid to be deaerated; a heating member configured to heat the deaeration cavity; a temperature detection member configured to detect a temperature inside the deaeration cavity; and a controller configured to receive the temperature detected by the temperature detection member and control the heating member based on the temperature. When using in deaeration of a liquid, the deaeration apparatus of the disclosure can shorten the deaeration time and improve the deaeration efficiency of the liquid.

Abstract: The present invention belongs to the field of semiconductor technology, and specifically provides a photo mask and an exposure system. The photo mask is provided with a patterning structure for forming a resulting pattern, the patterning structure comprising a strip-like main body for forming a rectilinear pattern, wherein the patterning structure further comprises a patterning structure auxiliary unit provided at two sides of the strip-like main body, the patterning structure auxiliary unit being capable of adjusting and compensating direction and intensity of light during exposure. With the photo mask, the resulting pattern formed through exposure using the photo mask has improved fineness, thereby improving accuracy of the formed rectilinear pattern.

Abstract: The present invention belongs to the field of semiconductor technology, and specifically provides a photo mask and an exposure system. The photo mask is provided with a patterning structure for forming a resulting pattern, the patterning structure comprising a strip-like main body for forming a rectilinear pattern, wherein the patterning structure further comprises a patterning structure auxiliary unit provided at two sides of the strip-like main body, the patterning structure auxiliary unit being capable of adjusting and compensating direction and intensity of light during exposure. With the photo mask, the resulting pattern formed through exposure using the photo mask has improved fineness, thereby improving accuracy of the formed rectilinear pattern.

Abstract: A curing apparatus and a curing method are provided. The curing apparatus comprises: a chamber, configured for accommodating a substrate provided with a polyimide adhesive; an air extracting unit, configured for evacuating the chamber; and a heating unit, configured for performing a first heating on the substrate in the case that a first predetermined pressure is reached in the chamber during a evacuating process of the air extracting unit so as to remove organic gases from the polyimide adhesive, and performing a second heating on the substrate after the first heating so as to cure the polyimide adhesive.