Patents by Inventor Zhenxing TANG
Zhenxing TANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250237909Abstract: A snap-fit plasma display module includes a first substrate and a second substrate. A plasma display cavity is formed between the first substrate and the second substrate, and the plasma display cavity is filled with plasma particles. A surface of the first substrate is provided with a filter layer, and a surface of the second substrate facing the first substrate is provided with a pixel electrode layer. A plasma isolation structure extending toward the first substrate is arranged on the pixel electrode layer, a surface of the filter layer facing the second substrate is provided with a snap-fit structure, the snap-fit structure is adapted to the plasma isolation structure to fix the first substrate and the second substrate, and each of the surface of the filter layer facing the second substrate and a surface of the snap-fit structure facing the second substrate is provided with a conductive dielectric layer.Type: ApplicationFiled: April 15, 2022Publication date: July 24, 2025Applicant: WUXI VISION PEAK TECHNOLOGY CO., LTDInventors: Jin BAO, Shan CHEN, Zhenxing TANG, Jun XU
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Patent number: 11996612Abstract: A microstrip line filtering radiation oscillator, a filtering radiation unit, and an antenna, the oscillator includes a substrate. A plurality of first metal sheets parallel to each other are arranged at intervals on a front surface of the substrate, a plurality of second metal sheets parallel to each other are arranged at intervals on a back surface of the substrate, and the first and second metal sheets are correspondingly staggered and coupled by a coupling part running through the substrate. The microstrip line filtering radiation oscillator has functions of signal radiation and interference suppression. The filtering radiation unit includes at least one oscillator and can be used in conjunction with a high-frequency radiation unit, to radiate high-frequency and low-frequency signals simultaneously.Type: GrantFiled: November 22, 2019Date of Patent: May 28, 2024Assignee: TONGYU COMMUNICATION INC.Inventors: Zhonglin Wu, Wei Zhao, Cailong Yue, Zhenxing Tang
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Patent number: 11881622Abstract: An antenna element with a filtering function, a filtering radiation unit, and an antenna. The antenna element is tubular, with a spiral slit arranged around the periphery of the tubular antenna element and extending in an axial direction. The filtering radiation unit includes a support column, and an upper part of the support column is electrically connected to at least one antenna element. The antenna includes a reflecting plate, and at least one filtering radiation unit is fixedly arranged on the reflecting plate. The antenna element with a filtering function has functions of radiating signals and suppressing interference simultaneously. The filtering radiation unit can cooperate with a high-frequency radiation element during use to achieve the aim of radiating a high-frequency signal and a low-frequency signal simultaneously. The antenna is good in performance, small in size, and high in integration degree.Type: GrantFiled: November 22, 2019Date of Patent: January 23, 2024Assignee: TONGYU COMMUNICATION INC.Inventors: Zhonglin Wu, Wei Zhao, Cailong Yue, Zhenxing Tang
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Publication number: 20220407236Abstract: A microstrip line filtering radiation oscillator, a filtering radiation unit, and an antenna, the oscillator includes a substrate. A plurality of first metal sheets parallel to each other are arranged at intervals on a front surface of the substrate, a plurality of second metal sheets parallel to each other are arranged at intervals on a back surface of the substrate, and the first and second metal sheets are correspondingly staggered and coupled by a coupling part running through the substrate. The microstrip line filtering radiation oscillator has functions of signal radiation and interference suppression. The filtering radiation unit includes at least one oscillator and can be used in conjunction with a high-frequency radiation unit, to radiate high-frequency and low-frequency signals simultaneously.Type: ApplicationFiled: November 22, 2019Publication date: December 22, 2022Applicant: TONGYU COMMUNICATION INC.Inventors: Zhonglin WU, Wei ZHAO, Cailong YUE, Zhenxing TANG
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Publication number: 20220393361Abstract: An antenna element with a filtering function, a filtering radiation unit, and an antenna. The antenna element is tubular, with a spiral slit arranged around the periphery of the tubular antenna element and extending in an axial direction. The filtering radiation unit includes a support column, and an upper part of the support column is electrically connected to at least one antenna element. The antenna includes a reflecting plate, and at least one filtering radiation unit is fixedly arranged on the reflecting plate. The antenna element with a filtering function has functions of radiating signals and suppressing interference simultaneously. The filtering radiation unit can cooperate with a high-frequency radiation element during use to achieve the aim of radiating a high-frequency signal and a low-frequency signal simultaneously. The antenna is good in performance, small in size, and high in integration degree.Type: ApplicationFiled: November 22, 2019Publication date: December 8, 2022Applicant: TONGYU COMMUNICATION INC.Inventors: Zhonglin WU, Wei ZHAO, Cailong YUE, Zhenxing TANG
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Patent number: 11239198Abstract: A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.Type: GrantFiled: March 26, 2020Date of Patent: February 1, 2022Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Lili Wang, Haiwei Sun, Zhenxing Tang, Feng Qu, Jing Liu, Chao Liu, Chuhang Wang, Qiangwei Cui, Ke Meng, Linhui Gong
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Publication number: 20210159208Abstract: A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.Type: ApplicationFiled: March 26, 2020Publication date: May 27, 2021Applicant: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Lili WANG, Haiwei SUN, Zhenxing TANG, Feng QU, Jing LIU, Chao LIU, Chuhang WANG, Qiangwei CUI, Ke MENG, Linhui GONG