Abstract: A liquid-solid axial moving bed reaction and regeneration apparatus and a solid acid alkylation process by using the liquid-solid axial moving bed reaction and regeneration apparatus.

Abstract: An antenna element with a filtering function, a filtering radiation unit, and an antenna. The antenna element is tubular, with a spiral slit arranged around the periphery of the tubular antenna element and extending in an axial direction. The filtering radiation unit includes a support column, and an upper part of the support column is electrically connected to at least one antenna element. The antenna includes a reflecting plate, and at least one filtering radiation unit is fixedly arranged on the reflecting plate. The antenna element with a filtering function has functions of radiating signals and suppressing interference simultaneously. The filtering radiation unit can cooperate with a high-frequency radiation element during use to achieve the aim of radiating a high-frequency signal and a low-frequency signal simultaneously. The antenna is good in performance, small in size, and high in integration degree.

Abstract: A microstrip line filtering radiation oscillator, a filtering radiation unit, and an antenna, the oscillator includes a substrate. A plurality of first metal sheets parallel to each other are arranged at intervals on a front surface of the substrate, a plurality of second metal sheets parallel to each other are arranged at intervals on a back surface of the substrate, and the first and second metal sheets are correspondingly staggered and coupled by a coupling part running through the substrate. The microstrip line filtering radiation oscillator has functions of signal radiation and interference suppression. The filtering radiation unit includes at least one oscillator and can be used in conjunction with a high-frequency radiation unit, to radiate high-frequency and low-frequency signals simultaneously.

Abstract: An antenna element with a filtering function, a filtering radiation unit, and an antenna. The antenna element is tubular, with a spiral slit arranged around the periphery of the tubular antenna element and extending in an axial direction. The filtering radiation unit includes a support column, and an upper part of the support column is electrically connected to at least one antenna element. The antenna includes a reflecting plate, and at least one filtering radiation unit is fixedly arranged on the reflecting plate. The antenna element with a filtering function has functions of radiating signals and suppressing interference simultaneously. The filtering radiation unit can cooperate with a high-frequency radiation element during use to achieve the aim of radiating a high-frequency signal and a low-frequency signal simultaneously. The antenna is good in performance, small in size, and high in integration degree.

Abstract: A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.

Abstract: A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.