Patents by Inventor Zhenxing Yue

Zhenxing Yue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6695972
    Abstract: This invention relates to the formula and preparation method for a multi-layer chip inductor material used in very high frequencies. The main composition of this material is planar hexagonal soft magnetic ferrite, and ingredient is low temperature sintering aid. Preparation method is a synthetic method of solid phase reaction. The sintering aid is prepared by secondary doping. By the process of ball grinding, drying, pre-calcining, ball grinding, drying, granulating, forming, sintering, and so forth, very high frequency inductor material of superior quality is obtained, realizing low temperature sintering under a temperature lower than 900° C. This invention is of low cost, high performance, suitable for multi-layer chip inductors at very high frequencies of 300M-800 MHz.
    Type: Grant
    Filed: January 14, 2002
    Date of Patent: February 24, 2004
    Assignees: Tsinghua Tongfang Co., Ltd., Tsinghua University
    Inventors: Xiaohui Wang, Longtu Li, Ji Zhou, Shuiyuan Su, Zhilun Gui, Zhenxing Yue, Zhenwei Ma, Li Zhang
  • Publication number: 20030052298
    Abstract: This invention relates to the formula and preparation method for a multi-layer chip inductor material used in very high frequencies. The main composition of this material is planar hexagonal soft magnetic ferrite, and ingredient is low temperature sintering aid. Preparation method is a synthetic method of solid phase reaction. The sintering aid is prepared by secondary doping. By the process of ball grinding, drying, pre-calcining, ball grinding, drying, granulating, forming, sintering, and so forth, very high frequency inductor material of superior quality is obtained, realizing low temperature sintering under a temperature lower than 900° C. This invention is of low cost, high performance, suitable for multi-layer chip inductors at very high frequencies of 300M-800 MHz.
    Type: Application
    Filed: January 14, 2002
    Publication date: March 20, 2003
    Applicant: Tsinghua Tongfang Co., Ltd.
    Inventors: Xiaohui Wang, Longtu Li, Ji Zhou, Shuiyuan Su, Zhilun Gui, Zhenxing Yue, Zhenwei Ma, Li Zhang