Abstract: Disclosed is a photosensitive module (21), adapted to a camera module, comprising a photosensitive element (211), a light transmitting element (212) and an isolation adhesive layer (213), wherein the photosensitive element has a photosensitive region and a non-photosensitive region, the light transmitting element is arranged in a photosensitive path of the photosensitive element, and wherein the isolation adhesive layer is arranged in the non-photosensitive region and supports the light transmitting element, and the isolation adhesive layer is formed by means of photolithography.

Abstract: A method may include generating an optimal operational window (OOW) that specifies operational parameter values for drilling operations using equipment at a rig site, based on data indicative of rig state and formation characteristics, and based on mutation-based optimization of the operational parameter values; and instructing a control system to perform the drilling operations according to the OOW using the equipment at the rig site.

Abstract: An ultrasound therapy system has both a therapy transducer configured to transmit therapeutic ultrasound energy toward a target tissue and an imaging transducer configured to image the target tissue over a three-dimensional volume. The transducers are preferably arranged in a common housing but have respective controllers. The therapy controller causes the therapy transducer to focus the therapeutic ultrasound energy at a selectable focal position within a three-dimensional treatment region and the imaging controller generates a three-dimensional image of the target tissue, which is displayed for viewing by a user. Target location information is then transferred from the imaging controller to the therapy controller. The therapy controller adjusts the focal position of the therapeutic ultrasound energy within the three-dimensional treatment region accordingly.

Abstract: The present application provides a photosensitive assembly, comprising: a photosensitive chip, having a first surface and a second surface facing away from the first surface, the first surface having a photosensitive region; an electronic element arranged around the photosensitive chip; a molded portion formed by a molding process and packaging the electronic element and the photosensitive chip together, the molded portion having a third surface flush with the first surface; and a first re-wiring layer formed on a non-photosensitive region of the first surface and on the third surface, a pad of the photosensitive chip being electrically connected to the electronic element through the first re-wiring layer, wherein a side surface or a bottom surface of the photosensitive assembly has a conductive region, and the conductive region is electrically connected to the first re-wiring layer. The present application further provides a corresponding manufacturing method of photosensitive assembly.

Abstract: The present disclosure provides a camera apparatus, an SMA driving device and a manufacturing method, a driving method and a wiring method, wherein the SMA driving device further comprises a lens carrier, at least one upgoing driver, and at least one downgoing driver; wherein the lens carrier is connected to the upgoing driver, and the upgoing driver supports the lens carrier upwardly in a thermally driven manner, and pulls the lens carrier to move upward; wherein the lens carrier is connected to the downgoing driver, and the downgoing driver draws the lens carrier downwardly in a thermally driven manner, and pulls the lens carrier to move downward; and wherein the lens is disposed on the lens carrier of the SMA driving device, and the SMA driving device drives the lens to move up and down, thereby improving the focusing speed of the lens.

Abstract: A molded photosensitive assembly includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

Abstract: A method can include receiving input for a multiwell pad; selecting, based at least in part on a portion of the input, a template for the multiwell pad; generating, based at least in part on the template, well trajectories for the multiwell pad, where each of the well trajectories extends from a surface location of the multiwell pad to one or more reservoir target locations and where each of the well trajectories includes at least one curve generated using one or more dogleg severity values and one or more geometric control points that are not required to lie on one or more of the well trajectories; and outputting specifications for the generated trajectories of the multiwell pad.

Abstract: Systems and methods for machine learning of medical records are provided. The system can execute multiple machine learning models on the medical records in parallel using multi-threaded approach wherein each machine learning model executes using its own, dedicated computational thread in order to significantly speed up the time with which relevant information can be identified from documents by the system. The multi-threaded machine learning models can include, but are not limited to, sentence classification models, comorbidity models, ICD models, body parts models, prescription models, and provider name models. The system can also utilize combined convolutional neural networks and long short-term models (CNN+LSTMs) as well as ensemble machine learning models to categorize sentences in medical records. The system can also extract service provider, medical specializations, and dates of service information from medical records.

Abstract: A method may include receiving input for a multiwell structure and subsurface target locations, where the multiwell structure includes slots; generating, based at least in part on the input, a position for the multiwell structure, slot-well assignments for the slots, and well trajectories, where each of the well trajectories extends from an assigned one of the slots to one or more of the subsurface target locations; and outputting a set of specifications for the position for the multiwell structure, the well trajectories, and an order for drilling the well trajectories.

Abstract: A method can include receiving input for a multiwell pad; selecting, based at least in part on a portion of the input, a template for the multiwell pad; generating, based at least in part on the template, well trajectories for the multiwell pad, where each of the well trajectories extends from a surface location of the multiwell pad to one or more reservoir target locations and where each of the well trajectories includes at least one curve generated using one or more dogleg severity values and one or more geometric control points that are not required to lie on one or more of the well trajectories; and outputting specifications for the generated trajectories of the multiwell pad.

Abstract: The present invention provides a terminal device, and a display screen thereof and an application thereof. The terminal device includes a terminal device body, a display screen, and a camera module. The display screen is provided with a light through hole. The camera module is located below the display screen, and has a front end. The front end of the camera module is fixedly attached to the display screen and the camera module is aligned with the light through hole of the display screen, so that light outside the display screen is received by the camera module via the light through hole.

Abstract: A camera module is provided, including a circuit board, a photosensitive element, an optical lens, and a filter element. The circuit board includes a substrate having a substrate front surface, a substrate back surface, and a substrate channel. The substrate front surface and the substrate back surface correspond to each other, and the substrate channel extends from the substrate front surface to the substrate back surface. The photosensitive element has a photosensitive area and a non-photosensitive area surrounding the photosensitive area. A first part of the non-photosensitive area is mounted on the back surface substrate. The photosensitive element and the substrate are conductively connected. The photosensitive area and a second part of the non-photosensitive area correspond to the substrate channel. The optical lens is held in a photosensitive path of the photosensitive element. The filter element is directly mounted on the substrate front surface of the substrate.

Abstract: Provided are a camera module, a molding photosensitive assembly and manufacturing method thereof, and an electronic device. The molding photosensitive assembly comprises a molding portion, at least one photosensitive chip and at least one circuit board, wherein the photosensitive chip is provided on the circuit board, the molding portion comprises a molding portion main body, the molding portion main body is made of a transparent material, and the molding portion main body, the photosensitive chip and the circuit board form an integral structure by means of a molding technique, so as to facilitate production.

Abstract: The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.

Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.

Abstract: Disclosed are a camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method. The photosensitive assembly includes a photosensitive chip, at least one resistance-capacitance device, an extended wiring layer, a filter element assembly, and a molded base. The filter element assembly includes a filter element and a bonding layer bonded around the filter element. The filter element assembly is attached to a top surface of the extended wiring layer, and the filter element of the filter element assembly corresponds to a light transmission hole of the extended wiring layer, so that external light is filtered by the filter element before reaching a photosensitive area of the photosensitive chip through the light transmission hole.

Abstract: A camera module and photosensitive component or unit thereof and manufacturing method therefor are provided. The photosensitive unit includes an encapsulation portion and a photosensitive portion that includes a main circuit board and a photosensitive sensor, wherein the encapsulation portion is integrally encapsulated to form on the main circuit board and the photosensitive sensor.

Abstract: The present invention discloses an array camera module and application thereof, wherein the array camera module comprises at least one optical lens and at least one circuit board assembly. The circuit board assembly further comprises at least one photosensitive chip, at least one circuit board, and at least one electronic component, wherein the photosensitive chip and the circuit board are conductively connected, at least one of the electronic components is attached to a back face of the circuit board, and the optical lens is held in a photosensitive path of the photosensitive chip. In this way, at least one of the length and the width of the array camera module can be reduced, so as to be beneficial to the miniaturization of the array camera module, so that the array camera module can be conveniently applied to a light-weighted and thinned electronic device.

Abstract: A method for dynamic output force distribution of a multi-degree-of-freedom over-actuated motion stage includes: establishing a mathematical model G(s) of a motion stage based on a modal representation; setting a time delay interval parameter ?? and an instruction shaper order nCS, and calculating each pulse time delay parameter ?i; calculating matrices Tb and Vb; initializing q=1; defining Hq; calculating intermediate variable {tilde over (T)}jq, {tilde over (V)}, ?Hq, YHq, T?Hq, V?Hq, and ?q; calculating an estimated value ?q of Hq; obtaining an amplitude Aikq of an instruction shaper; q=q+1, until calculation is completed for all logical axis channels; calculating ?(s) by using Aikq; and obtaining a dynamic output force distribution matrix Tf(s). Zero-residue vibration suppression in all controllable flexible modalities can be realized with finite actuator redundancies.

Abstract: A lens (10) and a camera module (100) and a manufacturing method thereof, wherein the lens (10) comprises an edge-cut lens sheet (114), wherein the edge-cut lens sheet (14) includes at least one chord edge (1141) and at least one circular edge (1142), wherein the chord edge (1141) and the circular edge (1142) are adjacently connected to each other, and wherein the chord edge (1141) and the circular edge (1142) have different curvatures, so that the lens sheet (114) becomes narrow and the width of the lens (10) become narrow, to form an ultra-narrow camera module (100).