Abstract: The present disclosure provides systems, methods, and devices for producing an interconnect. An electronic device of the present disclosure includes a deformable substrate including a circuit. The circuit includes a channel extending from a first portion of the deformable substrate to a second portion of the deformable substrate. A first circuit component is adjacent to the first portion of the deformable substrate. A second circuit component is adjacent to the second portion of the deformable substrate. A first metal material is formed overlaying a first portion of the deformable substrate including a first portion of the channel. A second metal material interfaces with the first metal material, thereby substantially occupying an interior volume of the channel.

Abstract: Described herein are conductive elastomeric foam materials and methods of making and using the same. The conductive elastomeric foam materials include a polymeric matrix, one or more conductive fillers, and one or more foaming agents. The polymeric matrix can include a thermoset polymer or a thermoplastic polymer. Also described herein are methods of making conductive elastomeric foam materials. Further described herein are molded products including the conductive elastomeric foam materials as described herein and wearable devices including the molded products.

Abstract: Disclosed apparatus may include a membrane, a first electrode supported by the membrane, a second electrode, and optionally a controller configured to control an electrical potential applied between the first electrode and the second electrode. Example apparatus may include one or more flexible membranes that may, at least in part, define an enclosure that is at least partially filled with a dielectric fluid. A flexible membrane may include a functionalized polymer or inorganic dielectric material, such as a fluoropolymer composite including at least one electrically conductive additive and/or at least one toughener. Examples also include associated materials (e.g., polymers), methods of fabrication, methods of apparatus operation, and systems.

Abstract: A method of encapsulating an electronic assembly comprises disposing a plurality of electrically non-conductive particles on a substrate which carries one or more components of the electronic assembly; introducing a reactive parylene monomer in a vapor form into interstitial spaces among the plurality of the electrically non-conductive particles; and forming a parylene binder in the interstitial spaces of the electrically non-conductive particles from the reactive parylene monomer.

Abstract: Methods, systems, devices, and products for performing well logging in a borehole intersecting an earth formation. Apparatus include a carrier conveyable in the borehole; a tool disposed on the carrier. The tool comprises a substrate including a first attachment interface electrically connected to a second attachment interface by a substrate connection element, wherein the first attachment interface comprises a first attachment interface material and the second attachment interface comprises a second attachment interface material different than the first attachment interface material; and at least two terminals, each terminal attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a join.

Abstract: Methods, systems, devices, and products for performing well logging in a borehole intersecting an earth formation. Apparatus include a carrier conveyable in the borehole; a tool disposed on the carrier. The tool comprises a substrate including a first attachment interface electrically connected to a second attachment interface by a substrate connection element, wherein the first attachment interface comprises a first attachment interface material and the second attachment interface comprises a second attachment interface material different than the first attachment interface material; and at least two terminals, each terminal attached to at least one of the first attachment interface material of the substrate and the second attachment interface material of the substrate by a join.

Abstract: A method of encapsulating an electronic assembly comprises disposing a plurality of electrically non-conductive particles on a substrate which carries one or more components of the electronic assembly; introducing a reactive parylene monomer in a vapor form into interstitial spaces among the plurality of the electrically non-conductive particles; and forming a parylene binder in the interstitial spaces of the electrically non-conductive particles from the reactive parylene monomer.