Patents by Inventor Zhewei Wang

Zhewei Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240101676
    Abstract: The present invention provides PD-1 monoclonal antibodies, particularly human monoclonal antibodies of PD-1, which specifically bind to PD-1 with high affinity and comprise a heavy chain and a light chain. The present invention further provides nucleic acid sequence encoding the antibodies of the invention, cloning or expression vectors, host cells and methods for expressing or isolating the antibodies. Immunoconjugates, therapeutic compositions comprising the antibodies of the invention are also provided. The invention also provides methods for treating various cancers with anti-PD-1 antibodies.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 28, 2024
    Inventors: Yong Zheng, Jing Li, Gennady Gololobov, Xinhua Zhang, Baotian Yang, Zhewei Tang, Dong Li, Jianqing Xu, Zhuozhi Wang
  • Patent number: 9559032
    Abstract: The present invention provides a method of forming a passivation layer of a MOS device, and a MOS device. The method of forming a passivation layer of a MOS device includes: forming a substrate; forming a dielectric on the substrate; patterning the dielectric to expose a part of the substrate; forming a metal on the exposed part of the substrate, and the dielectric; forming a TEOS on the metal; forming a PSG on the TEOS; and forming a silicon nitrogen compound on the PSG. Therefore, the cracks problem of the passivation can be alleviated.
    Type: Grant
    Filed: July 25, 2013
    Date of Patent: January 31, 2017
    Assignee: CSMC Technologies Fab2 Co., Ltd.
    Inventors: Zhewei Wang, Xuelei Chen, Binbin Liu, Liuchun Gao, Hongxing Zhao, Guomin Huang, Long Jiang, Jibin Jiao
  • Patent number: 9548297
    Abstract: Provided are a semiconductor device and a method of manufacturing the same. The semiconductor device includes a substrate and a PIP capacitor located. The PIP capacitor includes a first polysilicon layer, a metallic silicide layer, a protective layer, a dielectric layer, and a second polysilicon layer, which have a lower conductive plate pattern and are successively arranged. The method includes: providing a substrate; successively forming a first polysilicon layer, a metallic silicide, and a protective layer on the substrate; transferring a lower conductive plate pattern into the first polysilicon layer, the metallic silicide layer, and the protective layer, thus forming the first polysilicon layer, the metallic silicide layer, and the protective layer having the lower conductive plate pattern; successively forming a dielectric layer and a second polysilicon layer having a lower conductive plate pattern on the protective layer. The capacitance and reliability of the PIP capacitor are improved.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: January 17, 2017
    Assignee: CSMC TECHNOLOGIES FAB2 CO., LTD.
    Inventors: Liangwei Mou, Zhaoxing Huang, Xuelei Chen, Li Wang, Zhewei Wang
  • Patent number: 9517262
    Abstract: The invention provides a vaccine injection, which includes a vaccine and a Traditional Chinese medicinal adjuvant in a mass ratio of 1:0.5-1:10, or a vaccine, a Traditional Chinese medicinal adjuvant and an aluminum adjuvant in a mass ratio of 1:0.5:2.5-1:10:20. The vaccine injection is in the form of powders, and the size of the powders is between 10 and 120 micrometers. The vaccine injection of the present invention is particularly suitable for the needle free injection technology. The invention also provides a preparation method for the vaccine injection.
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: December 13, 2016
    Assignees: CHINA 302 MILITARY HOSPITAL OF PLA
    Inventors: Jiabo Wang, Xiaohe Xiao, Zhewei Wang, Cheng Jin, Qi Li
  • Publication number: 20150364397
    Abstract: The present invention provides a method of forming a passivation layer of a MOS device, and a MOS device. The method of forming a passivation layer of a MOS device includes: forming a substrate; forming a dielectric on the substrate; patterning the dielectric to expose a part of the substrate; forming a metal on the exposed part of the substrate, and the dielectric; forming a TEOS on the metal; forming a PSG on the TEOS; and forming a nitrogen silicon compound on the PSG. Therefore, the cracks problem of the passivation can be alleviated.
    Type: Application
    Filed: July 25, 2013
    Publication date: December 17, 2015
    Inventors: ZHEWEI WANG, XUELEI CHEN, BINBIN LIU, LIUCHUN GAO, HONGXING ZHAO, GUOMIN HUANG, LONG JIANG, JIBIN JIAO
  • Publication number: 20140167126
    Abstract: Provided are a semiconductor device and a method of manufacturing the same. The semiconductor device includes a substrate and a PIP capacitor located. The PIP capacitor includes a first polysilicon layer, a metallic silicide layer, a protective layer, a dielectric layer, and a second polysilicon layer, which have a lower conductive plate pattern and are successively arranged. The method includes: providing a substrate; successively forming a first polysilicon layer, a metallic silicide, and a protective layer on the substrate; transferring a lower conductive plate pattern into the first polysilicon layer, the metallic silicide layer, and the protective layer, thus forming the first polysilicon layer, the metallic silicide layer, and the protective layer having the lower conductive plate pattern; successively forming a dielectric layer and a second polysilicon layer having a lower conductive plate pattern on the protective layer. The capacitance and reliability of the PIP capacitor are improved.
    Type: Application
    Filed: July 31, 2012
    Publication date: June 19, 2014
    Applicant: CSMC Technologies FAB2 Co., Ltd
    Inventors: Liangwei Mou, Zhaoxing Huang, Xuelei Chen, Li Wang, Zhewei Wang
  • Publication number: 20140004150
    Abstract: The invention provides a vaccine injection, which includes a vaccine and a Traditional Chinese medicinal adjuvant in a mass ratio of 1:0.5-1:10, or a vaccine, a Traditional Chinese medicinal adjuvant and an aluminum adjuvant in a mass ratio of 1:0.5:2.5-1:10:20. The vaccine injection is in the form of powders, and the size of the powders is between 10 and 120 micrometers. The vaccine injection of the present invention is particularly suitable for the needle free injection technology. The invention also provides a preparation method for the vaccine injection.
    Type: Application
    Filed: April 8, 2011
    Publication date: January 2, 2014
    Applicants: CHINA 302 MILITARY HOSPITAL OF PLA
    Inventors: Jiabo Wang, Xiaohe Xiao, Zhewei Wang, Cheng Jin, Qi Li