Abstract: Disclosed are a retractable camera module and an electronic device, wherein a lens of the retractable camera module is retractable relative to a photosensitive chip thereof, so as to be switched between a working state and a non-working state, wherein in the working state, the lens of the retractable camera module is stretched out for imaging, in the non-working state, the lens of the retractable camera module is retracted back to reduce the overall height of the retractable camera module, in this way, the technical contradiction between the overall height dimension and a large effective focal length of the traditional upright camera module is solved.

Abstract: Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof, said photosensitive component comprising: a circuit board, a photosensitive element, and a molding base; the molding base is integrally formed on the circuit board and photosensitive element to form a light window; a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the light window; said first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to said first portion surface; a first angle between said first partial surface and the optical axis of the camera module is greater than a second angle between the second partial surface and the optical axis; a second end side opposite to and away from the flexible region of the molding base has a second side surface facing the light window; said second side surface comprises a third partial surface arranged adjacent to the

Abstract: Disclosed a photosensitive assembly, an imaging module, a smart terminal, and a method and a mould for manufacturing the photosensitive assembly.

Abstract: A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.

Abstract: A camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the fixed-focus camera module comprises a circuit board; a photosensitive element, which is conductively connected to the circuit board; a molded base, wherein the molded base is integrally molded on the circuit board and the photosensitive element, and the molded base forms a light window, so as to provide a light passage for the photosensitive chip through the light window; and an optical lens, wherein the optical lens is supported on the molded base and corresponds to the light window formed by the molded base, wherein the circuit board comprises a circuit board substrate and at least one electronic component, wherein the at least one electronic component is electrically connected to the circuit board substrate, wherein the circuit board substrate has a blank side, and wherein the blank side of the circuit board substrate is free of the at least one electronic component.

Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.

Abstract: Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof, said photosensitive component comprising: a circuit board, a photosensitive element, and a molding base; the molding base is integrally formed on the circuit board and photosensitive element to form a light window; a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the light window; said first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to said first portion surface; a first angle between said first partial surface and the optical axis of the camera module is greater than a second angle between the second partial surface and the optical axis; a second end side opposite to and away from the flexible region of the molding base has a second side surface facing the light window; said second side surface comprises a third partial surface arranged adjacent to the

Abstract: A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.

Abstract: Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof, said photosensitive component comprising: a circuit board, a photosensitive element, and a molding base; the molding base is integrally formed on the circuit board and photosensitive element to form a light window; a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the light window; said first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to said first portion surface; a first angle between said first partial surface and the optical axis of the camera module is greater than a second angle between the second partial surface and the optical axis; a second end side opposite to and away from the flexible region of the molding base has a second side surface facing the light window; said second side surface comprises a third partial surface arranged adjacent to the

Abstract: A photosensitive assembly includes a circuit board, a photosensitive element mounted on the circuit board and including a first edge, a first metal wire electrically connecting the photosensitive element and the circuit board and spanning the first edge, a first electronic element mounted on the circuit board and having a mounting area corresponding to an extension line of the first edge, and a molding portion formed on the circuit board, surrounding the photosensitive element, extending to the photosensitive element, covering the first electronic element and the first metal wire, and contacting with a surface of the photosensitive element. Also included are a corresponding camera module, a photosensitive assembly jointed panel and a manufacturing method thereof. The damage risk of a gold wire in a molding process can be reduced to a certain extent without adding additional components and changing a die.

Abstract: An array camera module having a height difference, a circuit board assembly and a manufacturing method therefor, and an electronic device. The array camera module comprises a first camera module unit and a second camera module unit, wherein the first camera module unit comprises at least one first photosensitive assembly and at least one first lens; the first lens is located on a photosensitive path of the first photosensitive assembly; the first photosensitive assembly comprises at least one extension portion; the extension portion at least partially extends towards the direction away from the first photosensitive assembly; and the second camera module unit is fixedly connected to a second extension portion, so that the ends of the two camera module units are consistent.

Abstract: A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.

Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.

Abstract: An optical lens (1), comprising a first lens (100) and a lens assembly (110). The first lens (100) includes a first optical area (101) and a first structural area (102) surrounding the first optical area (101), and the first structure area (102) includes a height measurement area (103) not coated with an anti-reflective coating. The lens assembly (110) includes a lens barrel (104) and at least one second lens (105) disposed in the lens barrel (104). The at least one second lens (105) includes a second optical area (106) and a second structural area (107) surrounding the second optical area (106). The first structural area (102) is connected to an end face (109) of the lens barrel (104) near the first lens (100) or the second structural area (107) of the second lens (105) closest to the first lens (100). A manufacturing method of optical lens (1) and a camera module are also disclosed.

Abstract: An optical lens (1000), comprising a first lens element (110) and a second lens component (200). The first lens element (110) has a first surface (112) located on an object side and a second surface (117) located on an image side, wherein a central region of the first surface (112) protrudes toward the object side to form a protruding portion (111), a top surface (113) of the protruding portion (111) forms an optical area (113a), the first surface (112) further has a first structured area (115) surrounding the protruding portion (111), and a side surface (114) connects the optical area (113a) and the first structured area (115). The second lens component (200) comprises a second lens barrel (220) and at least one second lens element (210) mounted inside the second lens barrel (220), and the at least one second lens element (210) and the first lens element (110) together constitute an imageable optical system.

Abstract: Disclosed are a split camera lens (20) and an assembly method thereof, a camera module (10), and a terminal device (100). The split camera lens (20) includes: a first lens portion (21) including a first optical lens (211), and a second lens portion (22): wherein the first lens portion (21) is assembled on the second lens portion (22), and the second lens portion (22) includes a lens barrel (222) and at least one second optical lens (221) mounted in the lens barrel (222); and the second optical lens (221) at the topmost side is completely exposed on the top of the lens barrel (222), thus, a “lens barrel top face” structure of the first lens portion (21) and the second lens portion (22) is removed so as to enlarge an adjustment range of the split camera lens (20).

Abstract: A photosensitive assembly includes a circuit board and a photosensitive chip, as well as a molded base. The molded base is integrally formed on the circuit board and the photosensitive chip, and forms a light window for providing a light path for the photosensitive chip. For a portion of the molded base corresponding to a first end side of the molded base adjacent to a flexible region, a distance between outer and inner edges thereof is a; for a portion of the molded base corresponding to an opposite second end side of the molded base away from the flexible region, a distance between outer and inner edges thereof is c, wherein 0.2 mm?a?1 mm, and 0.2 mm?c?1.5 a. The dimensions a and c enable a corresponding forming groove in a molding process to be filled with molding material.

Abstract: An optical lens (1000) includes a first lens (110) and a second lens component (200). A central area of a first surface (112) of the first lens (110) protrudes to an object side to form a protrusion portion (111), and a top surface (113) of the protrusion portion (111) forms an optical area (113a), and a first structural area (115) surrounds the protrusion portion (111). The second lens component (200) includes a second lens barrel (220) and at least one second lens (210), and a top of the second lens barrel (220) is provided with an extension portion (221) extending inwards, so as to form a light inlet hole (222) of the second lens component (200). Moreover, the topmost second lens (210) has a third surface (211) located at the object side, and the third surface (211) includes an optical area (211a) at center, an inner structural area (211b) surrounding the optical area (211a), and an outer structural area (211c).

Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.

Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.