Patents by Inventor Zhi-Bin Kuan

Zhi-Bin Kuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7545645
    Abstract: A heat dissipation device includes a heat spreader (20), a heat pipe (30), a heat sink (40) and a cooling fan (50) for generating forced airflow to the heat sink. The heat pipe has an evaporating section (301) being thermally attached to the heat spreader and a condensing section (302). The heat sink has a fin assembly defining a plurality of channels (405) for the airflow flowing therethrough. Each of the channels has at least one portion with a width being gradually decreased along the flowing direction of the airflow. The channels (405) each are defined between two adjacent fins (401, 402), wherein at least one of the two adjacent fins is arc-shaped.
    Type: Grant
    Filed: September 27, 2007
    Date of Patent: June 9, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventor: Zhi-Bin Kuan
  • Publication number: 20090021913
    Abstract: A heat dissipation device includes a heat spreader (20), a heat pipe (30), a heat sink (40) and a cooling fan (50) for generating forced airflow to the heat sink. The heat pipe has an evaporating section (301) being thermally attached to the heat spreader and a condensing section (302). The heat sink has a fin assembly defining a plurality of channels (405) for the airflow flowing therethrough. Each of the channels has at least one portion with a width being gradually decreased along the flowing direction of the airflow. The channels (405) each are defined between two adjacent fins (401, 402), wherein at least one of the two adjacent fins is arc-shaped.
    Type: Application
    Filed: September 27, 2007
    Publication date: January 22, 2009
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventor: ZHI-BIN KUAN
  • Publication number: 20090008067
    Abstract: A heat dissipation device includes a heat sink (30) having a plurality of fins (34), and a cooling fan (10) surrounded by the fins. The cooling fan includes a frusto-conical hub (22) having a peripheral wall (222) and a concaved side wall (224) extending upwardly from the peripheral wall. A plurality of fan blades (24) are arranged on and around the hub. Each fan blade includes a radial-flow first portion (240) extending outwardly from the peripheral wall and a second portion (242) extending outwardly from the side wall; the second portions of the fan blades are inclined with respect to the first portions for guiding air to the first portions of fan blades when the fan is activated.
    Type: Application
    Filed: July 16, 2007
    Publication date: January 8, 2009
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventor: ZHI-BIN KUAN