Patents by Inventor ZHI-BING LI

ZHI-BING LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Computer chassis welding device
    Patent number: 11433472
    Abstract: A chassis welding device for welding brackets as standard members to a body of a chassis includes a frame, a first transferring member, a plurality of loading mechanisms, a plurality of carriers, a conveying member, a shifting member, and a spot welder. The loading mechanism transfers standard members to individual preset positions on the carrier to face the solder joints on the standard members away from the carrier. The first transferring member transports the carrier to the shifting member. The shifting member transfers the carrier from the first transferring member to the spot welder. The conveying member transfers the body into contact with the solder joints. The spot welder applies heat to melt the solder joints to bond the standard members to the body.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: September 6, 2022
    Assignees: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chung Chai, Yu-Ming Xiao, Lin Ding, Zhi-Bing Li
  • COMPUTER CHASSIS WELDING DEVICE
    Publication number: 20200101556
    Abstract: A chassis welding device for welding brackets as standard members to a body of a chassis includes a frame, a first transferring member, a plurality of loading mechanisms, a plurality of carriers, a conveying member, a shifting member, and a spot welder. The loading mechanism transfers standard members to individual preset positions on the carrier to face the solder joints on the standard members away from the carrier. The first transferring member transports the carrier to the shifting member. The shifting member transfers the carrier from the first transferring member to the spot welder. The conveying member transfers the body into contact with the solder joints. The spot welder applies heat to melt the solder joints to bond the standard members to the body.
    Type: Application
    Filed: July 8, 2019
    Publication date: April 2, 2020
    Inventors: CHUNG CHAI, YU-MING XIAO, LIN DING, ZHI-BING LI
  • Repair apparatus and method for circuit board assembly
    Patent number: 8537547
    Abstract: A repair apparatus for a circuit board assembly includes a cooling device for a surface of the circuit board assembly opposite to the surface to be repaired. The cooling device defines a chamber for receiving the circuit board assembly. The circuit board assembly is disposed within the chamber to define a heat exchange space between the circuit board assembly and the bottom of the chamber. A method for repairing a circuit board assembly is also provided.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: September 17, 2013
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Yu-Ching Liu, Chi-An Yu, Xi-Hang Li, Bing Liu, Zhi-Bing Li, Jie-Peng Kang, Jing-Bin Liang, Hai-Gui Huang
  • REPAIR APPARATUS AND METHOD FOR CIRCUIT BOARD ASSEMBLY
    Publication number: 20120008284
    Abstract: A repair apparatus for a circuit board assembly includes a cooling device for a surface of the circuit board assembly opposite to the surface to be repaired. The cooling device defines a chamber for receiving the circuit board assembly. The circuit board assembly is disposed within the chamber to define a heat exchange space between the circuit board assembly and the bottom of the chamber. A method for repairing a circuit board assembly is also provided.
    Type: Application
    Filed: December 30, 2010
    Publication date: January 12, 2012
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
    Inventors: YU-CHING LIU, CHI-AN YU, XI-HANG LI, BING LIU, ZHI-BING LI, JIE-PENG KANG, JING-BIN LIANG, HAI-GUI HUANG