Patents by Inventor Zhi Cai

Zhi Cai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147134
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: May 2, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137689
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137693
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137682
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137683
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137687
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137684
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137681
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137690
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Publication number: 20240137692
    Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: SHENZHEN SHOKZ CO., LTD.
    Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
  • Patent number: 11943105
    Abstract: Embodiments of the present disclosure relate to a method, apparatus, device and computer readable storage media for management of application servers network edge computing device and a method, apparatus, device and computer readable storage media for performing management operation related to application servers network edge computing device. In example embodiments, at a management function module, a calling function deployment command is transmitted to a network edge computing device to deploy a calling function instance thereon, the calling function instance being configured to connect with application servers for respective applications and handle communications between terminal devices and the application server. A management command for application servers on the network edge computing device is transmitted to at least one of the network edge computing device and the calling function instance, in response to a network condition meeting one of predetermined management policies.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: March 26, 2024
    Assignee: NOKIA TECHNOLOGIES OY
    Inventors: Jiongxuan Chen, Zhi Wang, Yigang Cai
  • Publication number: 20240091561
    Abstract: A radiation therapy system is disclosed. The radiation therapy system includes a gantry, a first radiation source, and a second radiation source. The gantry is configured to have a cavity extending in a direction along a rotation axis, and the cavity is configured to house a target object. The first radiation source is mounted on the gantry, and configured to emit a treatment beam to a treatment area of the target object. The second radiation source is mounted on the gantry, and configured to emit an imaging beam to an imaging area of the target object. The treatment area partially overlaps the imaging area. A rotation plane of the first radiation source and a rotation plane of the second radiation source are distributed in a direction along the rotation axis.
    Type: Application
    Filed: September 18, 2023
    Publication date: March 21, 2024
    Inventors: CAN LIAO, BO CAI, LING-QING MEI, ZHI-DU ZHANG, CHENG NI, WEI ZHANG
  • Patent number: D1022011
    Type: Grant
    Filed: February 20, 2022
    Date of Patent: April 9, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Zeteng Yan, Lei Zhong, Zhi Cai, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
  • Patent number: D1022016
    Type: Grant
    Filed: February 20, 2022
    Date of Patent: April 9, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Zeteng Yan, Lei Zhong, Zhi Cai, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
  • Patent number: D1022017
    Type: Grant
    Filed: February 20, 2022
    Date of Patent: April 9, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Sunjie Huang, Lei Zhong, Zhi Cai, Zeteng Yan, Haofeng Zhang, Xin Fu, Zhiqing Liu
  • Patent number: D1022018
    Type: Grant
    Filed: February 20, 2022
    Date of Patent: April 9, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Zhi Cai, Lei Zhong, Zeteng Yan, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
  • Patent number: D1022019
    Type: Grant
    Filed: February 20, 2022
    Date of Patent: April 9, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhong, Zhi Cai, Zeteng Yan, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
  • Patent number: D1022020
    Type: Grant
    Filed: February 20, 2022
    Date of Patent: April 9, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhong, Zhi Cai, Zeteng Yan, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
  • Patent number: D1022023
    Type: Grant
    Filed: February 20, 2022
    Date of Patent: April 9, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Zeteng Yan, Lei Zhong, Zhi Cai, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
  • Patent number: D1023148
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: April 16, 2024
    Inventors: Ding He, Zhi Liu, Xufeng Yang, Zhengchen Cai