Patents by Inventor Zhi Cai
Zhi Cai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240147134Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 18, 2023Publication date: May 2, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137689Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 15, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137693Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 15, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137682Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 18, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137683Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 18, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137687Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 18, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137684Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 15, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137681Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 19, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137690Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 15, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Publication number: 20240137692Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.Type: ApplicationFiled: December 15, 2023Publication date: April 25, 2024Applicant: SHENZHEN SHOKZ CO., LTD.Inventors: Junjiang FU, Yueqiang WANG, Chaojie CUI, Lei ZHONG, Zhi CAI, Yingying ZHANG, Weihua ZHOU, Piyou CHENG
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Patent number: 11943105Abstract: Embodiments of the present disclosure relate to a method, apparatus, device and computer readable storage media for management of application servers network edge computing device and a method, apparatus, device and computer readable storage media for performing management operation related to application servers network edge computing device. In example embodiments, at a management function module, a calling function deployment command is transmitted to a network edge computing device to deploy a calling function instance thereon, the calling function instance being configured to connect with application servers for respective applications and handle communications between terminal devices and the application server. A management command for application servers on the network edge computing device is transmitted to at least one of the network edge computing device and the calling function instance, in response to a network condition meeting one of predetermined management policies.Type: GrantFiled: June 15, 2018Date of Patent: March 26, 2024Assignee: NOKIA TECHNOLOGIES OYInventors: Jiongxuan Chen, Zhi Wang, Yigang Cai
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Publication number: 20240091561Abstract: A radiation therapy system is disclosed. The radiation therapy system includes a gantry, a first radiation source, and a second radiation source. The gantry is configured to have a cavity extending in a direction along a rotation axis, and the cavity is configured to house a target object. The first radiation source is mounted on the gantry, and configured to emit a treatment beam to a treatment area of the target object. The second radiation source is mounted on the gantry, and configured to emit an imaging beam to an imaging area of the target object. The treatment area partially overlaps the imaging area. A rotation plane of the first radiation source and a rotation plane of the second radiation source are distributed in a direction along the rotation axis.Type: ApplicationFiled: September 18, 2023Publication date: March 21, 2024Inventors: CAN LIAO, BO CAI, LING-QING MEI, ZHI-DU ZHANG, CHENG NI, WEI ZHANG
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Patent number: D1022011Type: GrantFiled: February 20, 2022Date of Patent: April 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Zeteng Yan, Lei Zhong, Zhi Cai, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
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Patent number: D1022016Type: GrantFiled: February 20, 2022Date of Patent: April 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Zeteng Yan, Lei Zhong, Zhi Cai, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
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Patent number: D1022017Type: GrantFiled: February 20, 2022Date of Patent: April 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Sunjie Huang, Lei Zhong, Zhi Cai, Zeteng Yan, Haofeng Zhang, Xin Fu, Zhiqing Liu
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Patent number: D1022018Type: GrantFiled: February 20, 2022Date of Patent: April 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Zhi Cai, Lei Zhong, Zeteng Yan, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
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Patent number: D1022019Type: GrantFiled: February 20, 2022Date of Patent: April 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Lei Zhong, Zhi Cai, Zeteng Yan, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
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Patent number: D1022020Type: GrantFiled: February 20, 2022Date of Patent: April 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Lei Zhong, Zhi Cai, Zeteng Yan, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
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Patent number: D1022023Type: GrantFiled: February 20, 2022Date of Patent: April 9, 2024Assignee: SHENZHEN SHOKZ CO., LTD.Inventors: Zeteng Yan, Lei Zhong, Zhi Cai, Sunjie Huang, Haofeng Zhang, Xin Fu, Zhiqing Liu
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Patent number: D1023148Type: GrantFiled: March 25, 2021Date of Patent: April 16, 2024Inventors: Ding He, Zhi Liu, Xufeng Yang, Zhengchen Cai