Patents by Inventor Zhi-Cheng Hsiao
Zhi-Cheng Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160043239Abstract: Conductive plug structures suitable for stacked semiconductor device package is provided, wherein large contact region between the conductive plug structures and the corresponding pads of devices can be achieved, to reduce electrical impedance. Therefore, package structures such as photosensitive device packages using the conductive plug structures have superior electrical performance and reliability.Type: ApplicationFiled: October 22, 2015Publication date: February 11, 2016Inventors: Hsiang-Hung Chang, Wen-Chih Chen, Chia-Wei Jui, Zhi-Cheng Hsiao, Cheng-Ta Ko, Rong-Shen Lee, Sheng-Shu Yang
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Patent number: 9130080Abstract: An encapsulation of backside illumination photosensitive device including a circuit sub-mount, a backside illumination photosensitive device, a plurality of conductive terminals, and a heat dissipation structure is provided. The backside illumination photosensitive device includes an interconnection layer and a photosensitive device array, wherein the interconnection layer is located on the circuit sub-mount, and between the photosensitive device array and the circuit sub-mount. The conductive terminals are located between the interconnection layer and the circuit sub-mount to electrically connect the interconnection layer and the circuit sub-mount. The heat dissipation structure is located under the interconnection layer, and the heat dissipation structure and the photosensitive device array are respectively located at two opposite sides of the interconnection layer.Type: GrantFiled: July 17, 2013Date of Patent: September 8, 2015Assignee: Industrial Technology Research InstituteInventors: Zhi-Cheng Hsiao, Ming-Ji Dai, Cheng-Ta Ko
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Publication number: 20150097259Abstract: Conductive plug structures suitable for stacked semiconductor device package is provided, wherein large contact region between the conductive plug structures and the corresponding pads of devices can be achieved, to reduce electrical impedance. Therefore, package structures such as photosensitive device packages using the conductive plug structures have superior electrical performance and reliability.Type: ApplicationFiled: December 15, 2014Publication date: April 9, 2015Applicant: Industrial Technology Research InstituteInventors: Hsiang-Hung CHANG, Wen-Chih CHEN, Chia-Wei JUI, Zhi-Cheng HSIAO, Cheng-Ta KO, Rong-Shen LEE, Sheng-Shu YANG
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Publication number: 20140291790Abstract: An encapsulation of backside illumination photosensitive device including a circuit sub-mount, a backside illumination photosensitive device, a plurality of conductive terminals, and a heat dissipation structure is provided. The backside illumination photosensitive device includes an interconnection layer and a photosensitive device array, wherein the interconnection layer is located on the circuit sub-mount, and between the photosensitive device array and the circuit sub-mount. The conductive terminals are located between the interconnection layer and the circuit sub-mount to electrically connect the interconnection layer and the circuit sub-mount. The heat dissipation structure is located under the interconnection layer, and the heat dissipation structure and the photosensitive device array are respectively located at two opposite sides of the interconnection layer.Type: ApplicationFiled: July 17, 2013Publication date: October 2, 2014Inventors: Zhi-Cheng Hsiao, Ming-Ji Dai, Cheng-Ta Ko
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Patent number: 8777437Abstract: A light-emitting module includes a substrate having a first surface and a second surface, at least one light-emitting device disposed on the first surface of the substrate, and an optical reflection layer disposed on the first surface of the substrate and surrounding the light-emitting device for receiving a portion of light emitted from the light-emitting device and reflecting the portion of light. The substrate can be rigid or flexible.Type: GrantFiled: March 11, 2008Date of Patent: July 15, 2014Assignee: Industrial Technology Research InstituteInventors: Zhi-Cheng Hsiao, Chao-Kai Hsu, Yu-Hua Chen
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Patent number: 7973330Abstract: A substrate-free light emitting diode (LED) including an epitaxy layer, a conductive supporting layer, and a first contact pad is provided. The epitaxy layer includes a first type doped semiconductor layer, a light emitting layer, and a second type doped semiconductor layer. The light emitting layer is disposed on the first type doped semiconductor layer, and a portion of the first type doped semiconductor layer is exposed. The second type doped semiconductor layer and the conductive supporting layer are sequentially disposed on the second type doped semiconductor layer. The first contact pad is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The first contact pad and the conductive supporting layer serving as an electrode are disposed on the same side of the epitaxy layer to avoid the light shielding effects of the electrode to improve the front light emitting efficiency of the LED.Type: GrantFiled: July 27, 2009Date of Patent: July 5, 2011Assignee: Industrial Technology Research InstituteInventors: Chien-Cheng Yang, Zhi-Cheng Hsiao, Gen-Wen Hsieh
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Patent number: 7763895Abstract: A flexible light source device including a substrate, a light emitting device, a molding compound, a dielectric layer, and a metal line is provided. The substrate has a first surface, a second surface opposite to the first surface, and a first opening. The light emitting device is disposed on the first surface of the substrate and covers the first opening. The molding compound is located above the first surface and covers the light emitting device. The dielectric layer is disposed on the second surface and covers a sidewall of the first opening. The dielectric layer has a second opening which exposes part of the light emitting device. The metal line is disposed on the dielectric layer, wherein the metal line is electrically connected to the light emitting device via the second opening in the dielectric layer. Additionally, a fabrication method of the flexible light source device is also provided.Type: GrantFiled: April 13, 2009Date of Patent: July 27, 2010Assignee: Industrial Technology Research InstituteInventors: Zhi-Cheng Hsiao, Chao-Kai Hsu, Yu-Hua Chen
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Publication number: 20100163897Abstract: A flexible light source device including a substrate, a light emitting device, a molding compound, a dielectric layer, and a metal line is provided. The substrate has a first surface, a second surface opposite to the first surface, and a first opening. The light emitting device is disposed on the first surface of the substrate and covers the first opening. The molding compound is located above the first surface and covers the light emitting device. The dielectric layer is disposed on the second surface and covers a sidewall of the first opening. The dielectric layer has a second opening which exposes part of the light emitting device. The metal line is disposed on the dielectric layer, wherein the metal line is electrically connected to the light emitting device via the second opening in the dielectric layer. Additionally, a fabrication method of the flexible light source device is also provided.Type: ApplicationFiled: April 13, 2009Publication date: July 1, 2010Applicant: Industrial Technology Research InstituteInventors: Zhi-Cheng Hsiao, Chao-Kai Hsu, Yu-Hua Chen
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Patent number: 7682855Abstract: A substrate-free light emitting diode (LED) including an epitaxy layer, a conductive supporting layer, and a first contact pad is provided. The epitaxy layer includes a first type doped semiconductor layer, a light emitting layer, and a second type doped semiconductor layer. The light emitting layer is disposed on the first type doped semiconductor layer, and a portion of the first type doped semiconductor layer is exposed. The second type doped semiconductor layer and the conductive supporting layer are sequentially disposed on the second type doped semiconductor layer. The first contact pad is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The first contact pad and the conductive supporting layer serving as an electrode are disposed on the same side of the epitaxy layer to avoid the light shielding effects of the electrode to improve the front light emitting efficiency of the LED.Type: GrantFiled: July 31, 2006Date of Patent: March 23, 2010Assignee: Industrial Technology Research InstituteInventors: Chien-Cheng Yang, Zhi-Cheng Hsiao, Gen-Wen Hsieh
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Publication number: 20090283750Abstract: A substrate-free light emitting diode (LED) including an epitaxy layer, a conductive supporting layer, and a first contact pad is provided. The epitaxy layer includes a first type doped semiconductor layer, a light emitting layer, and a second type doped semiconductor layer. The light emitting layer is disposed on the first type doped semiconductor layer, and a portion of the first type doped semiconductor layer is exposed. The second type doped semiconductor layer and the conductive supporting layer are sequentially disposed on the second type doped semiconductor layer. The first contact pad is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The first contact pad and the conductive supporting layer serving as an electrode are disposed on the same side of the epitaxy layer to avoid the light shielding effects of the electrode to improve the front light emitting efficiency of the LED.Type: ApplicationFiled: July 27, 2009Publication date: November 19, 2009Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chien-Cheng Yang, Zhi-Cheng Hsiao, Gen-Wen Hsieh
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Publication number: 20090116244Abstract: A light-emitting module includes a substrate having a first surface and a second surface, at least one light-emitting device disposed on the first surface of the substrate, and an optical reflection layer disposed on the first surface of the substrate and surrounding the light-emitting device for receiving a portion of light emitted from the light-emitting device and reflecting the portion of light. The substrate can be rigid or flexible.Type: ApplicationFiled: March 11, 2008Publication date: May 7, 2009Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Zhi-Cheng Hsiao, Chao-Kai Hsu, Yu-Hua Chen
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Publication number: 20070158639Abstract: A substrate-free light emitting diode (LED) including an epitaxy layer, a conductive supporting layer, and a first contact pad is provided. The epitaxy layer includes a first type doped semiconductor layer, a light emitting layer, and a second type doped semiconductor layer. The light emitting layer is disposed on the first type doped semiconductor layer, and a portion of the first type doped semiconductor layer is exposed. The second type doped semiconductor layer and the conductive supporting layer are sequentially disposed on the second type doped semiconductor layer. The first contact pad is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The first contact pad and the conductive supporting layer serving as an electrode are disposed on the same side of the epitaxy layer to avoid the light shielding effects of the electrode to improve the front light emitting efficiency of the LED.Type: ApplicationFiled: July 31, 2006Publication date: July 12, 2007Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chien-Cheng Yang, Zhi-Cheng Hsiao, Gen-Wen Hsieh
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Publication number: 20060193560Abstract: A coupling structure between a fiber and a PLC to couple the PLC to the fiber is provided. A substrate includes a PLC region and at least one aligning groove for accommodating the fiber. The PLC region has optical circuits and input/output surfaces of the optical circuits. The input/output surfaces face the aligning groove and are at a non-perpendicular angle with respect to progressing direction of the incident light from the top view of the PLC. Therefore, the coupling loss and reflection during transmission can be effectively reduced.Type: ApplicationFiled: April 20, 2006Publication date: August 31, 2006Inventors: Chien-Cheng Yang, Wen-Jiun Liu, Zhi-Cheng Hsiao
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Publication number: 20050265664Abstract: A coupling structure between a fiber and an optical waveguide to couple the optical waveguide to the fiber is disclosed. A substrate includes an optical waveguide region and at least one aligning groove for containing the fiber. The optical waveguide region has optical circuits and input/output surfaces of the optical circuits. The input/output surfaces face the aligning groove. A non-perpendicular angle is formed between input/output surfaces and the progressing direction of the incident light.Type: ApplicationFiled: October 25, 2004Publication date: December 1, 2005Applicant: Industrial Technology Research InstituteInventors: Chien-Cheng Yang, Wen-Jiun Liu, Zhi-Cheng Hsiao
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Publication number: 20050220412Abstract: An optical splitter with reflection suppression is disclosed. It includes an input waveguide and a plurality of receiving waveguides. The input waveguide has at least one output surface for transferring an incident light to the receiving surfaces of the receiving waveguides. Each of the output surfaces parallels the corresponding receiving surfaces, and an oblique angle is formed between the output surface and the progressing direction of the incident light.Type: ApplicationFiled: July 29, 2004Publication date: October 6, 2005Inventors: Wen-Jiun Liu, Chien-Cheng Yang, Zhi-Cheng Hsiao, Shau-Yi Chen, Yun-Wen Lee