Abstract: Encapsulated LEDs can be made by taking a mold tool defining a cavity that defines a lens shape and providing a patterned release film defining the inverse of a microstructure in a surface of the film. The patterned release film is conformed to the cavity of the mold tool. An LED chip is placed in a spaced relationship from the patterned release film in the cavity. A resin is then introduced into the space between the LED chip and the patterned release film in the cavity. The resin is cured in the space between the LED chip and the patterned release film in the cavity while contact is maintained between the patterned release film and the curing resin. The encapsulated LED is then freed from the mold tool and the patterned release film.

Abstract: A method of making a microneedle array structure (20) comprising a plurality of simultaneously formed microneedles (24), each microneedle (24) having a protrusion (32) and a passageway (34) extending therethrough. The method comprises the steps of pressing an embossable sheet material between a complimentary tools and radiantly heating the sheet material using radiant energy from a radiant energy source. One tool is relatively-radiantly-transparent, and another tool and/or the sheet material is relatively-radiantly-absorptive.

Abstract: The present disclosure reveals a reflective, front-projection screen designed to faithfully and accurately display the images from state-of-the-art (SOTA) and next-generation 2D and 3D motion-picture projectors, such as those found in large-capacity public movie theaters, home theaters, offices, and for use with portable projection systems for consumer and commercial applications. In particular it discloses cinema-size light shaping 3D projection screens with front-surface microstructures and horizontal viewing angles in the range of 90 to 120 degrees.

Abstract: The present disclosure reveals a reflective, front-projection screen designed to faithfully and accurately display the images from state-of-the-art (SOTA) and next-generation 2D and 3D motion-picture projectors, such as those found in large-capacity public movie theaters, home theaters, offices, and for use with portable projection systems for consumer and commercial applications. In particular it discloses cinema-size light shaping 3D projection screens with front-surface microstructures and horizontal viewing angles in the range of 90 to 120 degrees.

Abstract: Encapsulated LEDs can be made by taking a mold tool defining a cavity that defines a lens shape and providing a patterned release film defining the inverse of a microstructure in a surface of the film. The patterned release film is conformed to the cavity of the mold tool. An LED chip is placed in a spaced relationship from the patterned release film in the cavity. A resin is then introduced into the space between the LED chip and the patterned release film in the cavity. The resin is cured in the space between the LED chip and the patterned release film in the cavity while contact is maintained between the patterned release film and the curing resin. The encapsulated LED is then freed from the mold tool and the patterned release film.

Abstract: A microchamber structure (100) comprising a base layer (120), a lid layer (130), and at least one microchamber (140) having a cross-sectional shape with a depth (d) of less than 1000 microns and a width (w) of less than 1000 microns. The base layer (120) includes a depression (122) and the lid layer (104) includes a projection (132) positioned within the depression (122) to together define the cross-sectional shape of the microchamber (140).

Abstract: A method of embossing a sheet material includes: heating at least a portion of the sheet directly or indirectly with radiant energy from a radiant energy source; pressing a tool against the heated portion of the sheet, thereby patterning a surface of the sheet; and separating the sheet and the tool. The radiant energy may travel through a solid material that is relatively transparent to radiation, on its way to being absorbed by a relatively-absorptive material. The relatively-transparent material may be an unheated portion of the sheet, and the relatively-absorptive material may be either the tool or the heated portion of the sheet. Alternatively, the relatively-transparent material may be the tool, and the relatively-absorptive material may be all or part of the sheet. The method may be performed as one or more roll-to-roll operations.

Abstract: A method of embossing a sheet material includes: heating at least a portion of the sheet directly or indirectly with radiant energy from a radiant energy source; pressing a tool against the heated portion of the sheet, thereby patterning a surface of the sheet; and separating the sheet and the tool. The radiant energy may travel through a solid material that is relatively transparent to radiation, on its way to being absorbed by a relatively-absorptive material. The relatively-transparent material may be an unheated portion of the sheet, and the relatively-absorptive material may be either the tool or the heated portion of the sheet. Alternatively, the relatively-transparent material may be the tool, and the relatively-absorptive material may be all or part of the sheet. The method may be performed as one or more roll-to-roll operations.

Abstract: Substantially transparent electrodes are formed upon a substrate by forming on the substrate, in order, a high index layer, a metallic conductive layer, and a conductive or semi-conductive top layer; and patterning the top layer and the conductive layer, preferably by laser ablation, to form a plurality of discrete electrodes from the metallic conductive layer. Conductors can be attached directly to the top layer, without requiring removal of this layer to expose the metallic conductive layer. The high index layer, conductive layer and top layer can all be formed by sputtering or similar processes which do not require high temperatures, so that plastic substrates can be used. The electrodes can be used, for example, in flat panel displays and in touch screen displays.

Abstract: The invention disclosed in this patent document relates to transmembrane receptors, more particularly to a human G protein-coupled receptor for which the endogenous ligand is unknown, and to mutated (non-endogenous) versions of the human GPCRs for evidence of constitutive activity.

Abstract: The invention disclosed in this patent document relates to transmembrane receptors, more particularly to a human G protein-coupled receptor for which the endogenous ligand is unknown, and to mutated (non-endogenous) versions of the human GPCRs for evidence of constitutive activity.

Abstract: A substrate having embossed thereon a plurality of shaped recesses of a predetermined precise geometric profile, each recess having a flat bottom surface having a major dimension of about 500 &mgr;m or less, the substrate being capable of undergoing a thermal cycle of about one hour at about 150° C. while maintaining about ±10 &mgr;m or less dimensional stability of the embossed shaped indentations, and wherein the substrate comprises an amorphous thermoplastic material. During the thermal cycle the substrate has an elastic modulus greater than about 1010 dynes/cm2 and a viscoelastic index of less than about 0.1.

Abstract: A microchamber structure (100) comprising a base layer (120), a lid layer (130), and at least one microchamber (140) having a cross-sectional shape with a depth (d) of less than 1000 microns and a width (w) of less than 1000 microns. The base layer (120) includes a depression (122) and the lid layer (104) includes a projection (132) positioned within the depression (122) to together define the cross-sectional shape of the microchamber (140).

Abstract: An anisotropically conductive structure for providing electrical interconnection between electronic components, and the process for making such anisotropically conductive structure. The anisotropically conductive structure includes a dielectric matrix having a substantially uniform thickness; an array of vias extending into or through the matrix; a plurality of conductive elements, wherein individual via contains at least one conductive element; a first adhesive layer adhered to the first major surface of the matrix; and optionally, a second adhesive layer adhered to the second major surface of the matrix.

Abstract: A substrate having embossed thereon a plurality of shaped recesses of a predetermined precise geometric profile, each recess having a flat bottom surface having a major dimension of about 500 &mgr;m or less, the substrate being capable of undergoing a thermal cycle of about one hour at about 150 ° C. while maintaining about ±10 &mgr;m or less dimensional stability of the embossed shaped indentations, and wherein the substrate comprises an amorphous thermoplastic material. During the thermal cycle the substrate has an elastic modulus greater than about 1010 dynes/cm2 and a viscoelastic index of less than about 0.1.

Abstract: Substantially transparent electrodes are formed upon a substrate by forming on the substrate, in order, a high index layer, a metallic conductive layer, and a conductive or semi-conductive top layer; and patterning the top layer and the conductive layer, preferably by laser ablation, to form a plurality of discrete electrodes from the metallic conductive layer. Conductors can be attached directly to the top layer, without requiring removal of this layer to expose the metallic conductive layer. The high index layer, conductive layer and top layer can all be formed by sputtering or similar processes which do not require high temperatures, so that plastic substrates can be used. The electrodes can be used, for example, in flat panel displays and in touch screen displays.

Abstract: Substantially transparent electrodes are formed upon a substrate by forming on the substrate, in order, a high index layer, a metallic conductive layer, and a conductive or semi-conductive top layer; and patterning the top layer and the conductive layer, preferably by laser ablation, to form a plurality of discrete electrodes from the metallic conductive layer. Conductors can be attached directly to the top layer, without requiring removal of this layer to expose the metallic conductive layer. The high index layer, conductive layer and top layer can all be formed by sputtering or similar processes which do not require high temperatures, so that plastic substrates can be used. The electrodes can be used, for example, in flat panel displays and in touch screen displays.