Abstract: A method for wireless communication includes that: a terminal device detects M downlink control channels using N groups of search spaces or N groups of control resource sets (CORESETs), N being an integer greater than or equal to 2, and M being an integer greater than or equal to 2, and different groups of search spaces or different groups of CORESETs are used for detecting different downlink control channels. Further, a terminal device is also provided.

Abstract: Provided are a method and apparatus for evaluating a degree of frequency regulation urgency of a generator set, a power system and a storage medium.

Abstract: A battery, a power consuming apparatus, and a method for manufacturing a battery are disclosed. The battery includes a case, at least one row of battery cells, and a support member, where an accommodation space is formed inside the case; the at least one row of battery cells is arranged in the accommodation space, and each row of battery cells includes at least two battery cells arranged opposite each other in a first direction; and the support member extends in the first direction, and two ends of the support member are fixed to the case. The support member is arranged in the case, and an extending direction of the support member is the same as that of one row of battery cells, such that interference between the support member and the battery cell can be avoided. The two ends of the support member are fixed to the case.

Abstract: The present disclosure provides a method and system for manufacturing a semiconductor layer. The method includes: placing a first wafer in a cavity to form a metal film on the first wafer; before forming the metal film, the temperature inside the cavity is a first temperature; transferring the first wafer on which the metal film has been formed out of the cavity; the temperature in the cavity is a second temperature, and the second temperature is greater than the first temperature; introducing an inert gas into the cavity to cool the cavity, such that the temperature in the cavity is equal to the first temperature; after the temperature in the cavity is equal to the first temperature, placing a second wafer in the cavity to form the metal film on the second wafer. The manufacturing method can reduce the defects on the surface of the metal film.

Abstract: The present disclosure provides a method and system for manufacturing a semiconductor layer. The method includes: placing a first wafer in a cavity to form a metal film on the first wafer; before forming the metal film, the temperature inside the cavity is a first temperature; transferring the first wafer on which the metal film has been formed out of the cavity; the temperature in the cavity is a second temperature, and the second temperature is greater than the first temperature; introducing an inert gas into the cavity to cool the cavity, such that the temperature in the cavity is equal to the first temperature; after the temperature in the cavity is equal to the first temperature, placing a second wafer in the cavity to form the metal film on the second wafer. The manufacturing method can reduce the defects on the surface of the metal film.

Abstract: A pre-processing method, a method for forming a metal silicide and a semiconductor processing apparatus are disclosed by the present invention. In the pre-processing method, a plasma etching process is performed on a semiconductor structure including a substrate. A first conductive portion and an isolation spacer covering a side surface of the first conductive portion are formed on a surface of an active area in the substrate. In the plasma etching process, a bias voltage applied to a surface of the semiconductor structure is adjusted by adjusting power outputs of two RF sources and is not lower than 150 V. In the metal silicide formation method, after a semiconductor structure including a first conductive portion and a second conductive portion is pre-processed in the manner as described above, a metal film is deposited thereon and annealed to result in the formation of the metal silicide.

Abstract: A pre-processing method, a method for forming a metal silicide and a semiconductor processing apparatus are disclosed by the present invention. In the pre-processing method, a plasma etching process is performed on a semiconductor structure including a substrate. A first conductive portion and an isolation spacer covering a side surface of the first conductive portion are formed on a surface of an active area in the substrate. In the plasma etching process, a bias voltage applied to a surface of the semiconductor structure is adjusted by adjusting power outputs of two RF sources and is not lower than 150 V. In the metal silicide formation method, after a semiconductor structure including a first conductive portion and a second conductive portion is pre-processed in the manner as described above, a metal film is deposited thereon and annealed to result in the formation of the metal silicide.

Abstract: A system and method of sealing leaks in process piping and equipment without process shutdown by providing a clamp having a cavity surrounding a leaking structure, sealant equipment comprising an injection gun to inject a sealant into the clamp cavity, means for pressuring moldable sealant from the gun into the clamp cavity in a staged manner beginning at a point away from the leak site. The preferred sealant comprises a moldable nitrile rubber delayed curing (vulcanizing) formulation or composition molded into shapes for insertion into an injection gun.

Abstract: Processes for manufacture and assembly of implantable medical devices are described. In particular, techniques are provided for nondestructive electrical isolation assessment of feedthrough assemblies of the implantable medical devices. The feedthrough assemblies may include an insulating structure, a plurality of terminal pins extending through the insulator and a ferrule having an inner lumen into which the insulating structure is disposed. One or more insulating seals may be disposed at the interface of the ferrule-to-insulating structure and/or the terminal pin-to-insulating structure. The electrical isolation assessments may be based on the dielectric properties of the components of the feedthrough assemblies, such as the insulating structure.

Abstract: A system and method of sealing leaks in process piping and equipment without process shutdown by providing a clamp having a cavity surrounding a leaking structure, sealant equipment comprising an injection gun to inject a sealant into the clamp cavity, means for pressuring moldable sealant from the gun into the clamp cavity in a staged manner beginning at a point away from the leak site. The preferred sealant comprises a moldable nitrile rubber delayed curing (vulcanizing) formulation or composition molded into shapes for insertion into an injection gun.

Abstract: Processes for manufacture and assembly of implantable medical devices are described. In particular, techniques are provided for nondestructive electrical isolation assessment of feedthrough assemblies of the implantable medical devices. The feedthrough assemblies may include an insulating structure, a plurality of terminal pins extending through the insulator and a ferrule having an inner lumen into which the insulating structure is disposed. One or more insulating seals may be disposed at the interface of the ferrule-to-insulating structure and/or the terminal pin-to-insulating structure. The electrical isolation assessments may be based on the dielectric properties of the components of the feedthrough assemblies, such as the insulating structure.

Abstract: A feedthrough assembly of an implantable medical device includes a glass insulator containing at least approximately 20 mol % of calcium oxide (CaO), preferably of a CABAL-12 type composition. The assembly is either manufactured so that the glass insulator includes a surface layer including calcium phosphate, preferably of relatively low solubility, or is assembled in the implantable device so that the glass insulator is exposed to phosphate-containing body fluid, when the device is implanted, for the formation of a surface layer including calcium phosphate.

Abstract: An electronic device and a method for controlling an user interface thereof are provided. The method includes detecting an orientation of the electronic device, determining a arrangement of the user interface according to the detected orientation, displaying a shortcut key area and a status area on the user interface, and adjusting the user interface according to the operational signals from a touch panel of the electronic device.

Abstract: A system and method of sealing leaks in process piping and equipment without process shutdown by providing a clamp having a cavity surrounding a leaking structure, sealant equipment comprising an injection gun to inject a sealant into the clamp cavity, means for pressuring moldable sealant from the gun into the clamp cavity in a staged manner beginning at a point away from the leak site. The preferred sealant comprises a moldable nitrile rubber delayed curing (vulcanizing) formulation or composition molded into shapes for insertion into an injection gun.

Abstract: A nitrile rubber based sealant system including seals a made from a unique delayed curing nitrite rubber composition. The composition has excellent storage ability in dry form which can be cured (vulcanized) as needed under and with the aid of varying field conditions. The seals provide superior leak seal suitable for sealing leaks in pipes, fittings, flanges and other structures and are made by heating delayed self curing nitrile rubber formulation comprised of a critically selected combination of components including specially preconditioned nitrile rubber, sulfur, accelerants, activators, fillers, plasticizers, flame retardant, antidegradant, metallic filaments and optionally, nanophase rare earth material.

Abstract: An electronic device and a method for controlling an user interface thereof are provided. The method includes detecting an orientation of the electronic device, determining a arrangement of the user interface according to the detected orientation, displaying a shortcut key area and a status area on the user interface, and adjusting the user interface according to the operational signals from a touch panel of the electronic device.

Abstract: A feedthrough assembly of an implantable medical device includes a glass insulator containing at least approximately 20 mol % of calcium oxide (CaO), preferably of a CABAL-12 type composition. The assembly is either manufactured so that the glass insulator includes a surface layer including calcium phosphate, preferably of relatively low solubility, or is assembled in the implantable device so that the glass insulator is exposed to phosphate-containing body fluid, when the device is implanted, for the formation of a surface layer including calcium phosphate.

Abstract: The present invention provides a method for switching booting devices of a computer (10). The method includes the steps of: powering on the computer, and executing basic input/output system power on self test (BIOS POST) program; trying to boot the computer from a primary booting device (14); reading a boot program (151) of a secondary booting device (15) into a particular portion of a memory (12) of the computer; determining whether the boot program of the secondary booting device is valid for normal booting of the computer; executing the boot program of the secondary booting device, if the boot program of the secondary booting device is valid for normal booting of the computer; and booting the computer from the secondary booting device. A related computer is also provided.

Abstract: A hermetic implantable medical device (IMD) is provided with a single or multi-pin arrangement including selected glass to metal seals for a feedthrough including a ceramic disk member coupled to the sealing glass surface in potential contact with body fluids. By judicious selection of component materials (ferrule, seal insulator and pin) provides for either compression or match seals for electrical feedthroughs (having a single or multi-pin array) provide corrosion resistance and biocompatibility required in IMDs. The resultant feedthrough configuration accommodates one pin within a single ferrule or at least two pins in a single ferrule having a pin surrounded by insulator material (e.g.

Abstract: An electrolytic capacitor comprising an anode, cathode and an electrolyte. The electrolyte comprises: about 35-60%, by weight water; about 10-55%, by weight organic solvent; about 0.05 to 10%, by weight, sulphuric acid; about 0.05 to 10%, by weight, boric acid; and about 0.05 to 10%, by weight, phosphorus oxy acid.