Abstract: A segmental precast composite-material composite-slab composite beam and a construction method thereof are provided, relating to the technical field of bridge design and construction. The segmental precast composite-material composite-slab composite beam mainly includes a segmental precast orthotropic composite top slab, a web, a bottom slab, and a wet joint between segments. The orthotropic composite top slab is composed of an orthotropic slab and an ultra-high-performance concrete layer (UHPC), and the interface connection of the orthotropic slab and the UHPC structural layer is achieved by a shear key. The UHPC structural layer is superposed with the orthotropic slab in segments in a precast plant to form a composite-slab composite beam segment to be entirely transported, hoisted and assembled, and the connection of the UHPC structural layers between the segments is achieved by casting a transverse wet joint in place.

Abstract: The method of forming the semiconductor structure includes the following steps. Bit line structures are formed on a substrate. A first liner is formed on the bit line structures. A second liner is formed on the first liner. A portion of the second liner is removed to expose a portion of the top surface of the first liner. A portion of the first liner is removed to form a space between each bit line structure and the second liner and form a remaining first liner. A sealing material is formed at the opening of the space to form an air gap between each bit line structure and the second liner.

Abstract: The present disclosure provides a method and system for manufacturing a semiconductor layer. The method includes: placing a first wafer in a cavity to form a metal film on the first wafer; before forming the metal film, the temperature inside the cavity is a first temperature; transferring the first wafer on which the metal film has been formed out of the cavity; the temperature in the cavity is a second temperature, and the second temperature is greater than the first temperature; introducing an inert gas into the cavity to cool the cavity, such that the temperature in the cavity is equal to the first temperature; after the temperature in the cavity is equal to the first temperature, placing a second wafer in the cavity to form the metal film on the second wafer. The manufacturing method can reduce the defects on the surface of the metal film.

Abstract: The present disclosure provides a method and system for manufacturing a semiconductor layer. The method includes: placing a first wafer in a cavity to form a metal film on the first wafer; before forming the metal film, the temperature inside the cavity is a first temperature; transferring the first wafer on which the metal film has been formed out of the cavity; the temperature in the cavity is a second temperature, and the second temperature is greater than the first temperature; introducing an inert gas into the cavity to cool the cavity, such that the temperature in the cavity is equal to the first temperature; after the temperature in the cavity is equal to the first temperature, placing a second wafer in the cavity to form the metal film on the second wafer. The manufacturing method can reduce the defects on the surface of the metal film.

Abstract: A pre-processing method, a method for forming a metal silicide and a semiconductor processing apparatus are disclosed by the present invention. In the pre-processing method, a plasma etching process is performed on a semiconductor structure including a substrate. A first conductive portion and an isolation spacer covering a side surface of the first conductive portion are formed on a surface of an active area in the substrate. In the plasma etching process, a bias voltage applied to a surface of the semiconductor structure is adjusted by adjusting power outputs of two RF sources and is not lower than 150 V. In the metal silicide formation method, after a semiconductor structure including a first conductive portion and a second conductive portion is pre-processed in the manner as described above, a metal film is deposited thereon and annealed to result in the formation of the metal silicide.

Abstract: A pre-processing method, a method for forming a metal silicide and a semiconductor processing apparatus are disclosed by the present invention. In the pre-processing method, a plasma etching process is performed on a semiconductor structure including a substrate. A first conductive portion and an isolation spacer covering a side surface of the first conductive portion are formed on a surface of an active area in the substrate. In the plasma etching process, a bias voltage applied to a surface of the semiconductor structure is adjusted by adjusting power outputs of two RF sources and is not lower than 150 V. In the metal silicide formation method, after a semiconductor structure including a first conductive portion and a second conductive portion is pre-processed in the manner as described above, a metal film is deposited thereon and annealed to result in the formation of the metal silicide.

Abstract: A system and method of sealing leaks in process piping and equipment without process shutdown by providing a clamp having a cavity surrounding a leaking structure, sealant equipment comprising an injection gun to inject a sealant into the clamp cavity, means for pressuring moldable sealant from the gun into the clamp cavity in a staged manner beginning at a point away from the leak site. The preferred sealant comprises a moldable nitrile rubber delayed curing (vulcanizing) formulation or composition molded into shapes for insertion into an injection gun.

Abstract: Processes for manufacture and assembly of implantable medical devices are described. In particular, techniques are provided for nondestructive electrical isolation assessment of feedthrough assemblies of the implantable medical devices. The feedthrough assemblies may include an insulating structure, a plurality of terminal pins extending through the insulator and a ferrule having an inner lumen into which the insulating structure is disposed. One or more insulating seals may be disposed at the interface of the ferrule-to-insulating structure and/or the terminal pin-to-insulating structure. The electrical isolation assessments may be based on the dielectric properties of the components of the feedthrough assemblies, such as the insulating structure.

Abstract: A system and method of sealing leaks in process piping and equipment without process shutdown by providing a clamp having a cavity surrounding a leaking structure, sealant equipment comprising an injection gun to inject a sealant into the clamp cavity, means for pressuring moldable sealant from the gun into the clamp cavity in a staged manner beginning at a point away from the leak site. The preferred sealant comprises a moldable nitrile rubber delayed curing (vulcanizing) formulation or composition molded into shapes for insertion into an injection gun.

Abstract: Processes for manufacture and assembly of implantable medical devices are described. In particular, techniques are provided for nondestructive electrical isolation assessment of feedthrough assemblies of the implantable medical devices. The feedthrough assemblies may include an insulating structure, a plurality of terminal pins extending through the insulator and a ferrule having an inner lumen into which the insulating structure is disposed. One or more insulating seals may be disposed at the interface of the ferrule-to-insulating structure and/or the terminal pin-to-insulating structure. The electrical isolation assessments may be based on the dielectric properties of the components of the feedthrough assemblies, such as the insulating structure.

Abstract: A feedthrough assembly of an implantable medical device includes a glass insulator containing at least approximately 20 mol % of calcium oxide (CaO), preferably of a CABAL-12 type composition. The assembly is either manufactured so that the glass insulator includes a surface layer including calcium phosphate, preferably of relatively low solubility, or is assembled in the implantable device so that the glass insulator is exposed to phosphate-containing body fluid, when the device is implanted, for the formation of a surface layer including calcium phosphate.

Abstract: An electronic device and a method for controlling an user interface thereof are provided. The method includes detecting an orientation of the electronic device, determining a arrangement of the user interface according to the detected orientation, displaying a shortcut key area and a status area on the user interface, and adjusting the user interface according to the operational signals from a touch panel of the electronic device.

Abstract: A system and method of sealing leaks in process piping and equipment without process shutdown by providing a clamp having a cavity surrounding a leaking structure, sealant equipment comprising an injection gun to inject a sealant into the clamp cavity, means for pressuring moldable sealant from the gun into the clamp cavity in a staged manner beginning at a point away from the leak site. The preferred sealant comprises a moldable nitrile rubber delayed curing (vulcanizing) formulation or composition molded into shapes for insertion into an injection gun.

Abstract: A nitrile rubber based sealant system including seals a made from a unique delayed curing nitrite rubber composition. The composition has excellent storage ability in dry form which can be cured (vulcanized) as needed under and with the aid of varying field conditions. The seals provide superior leak seal suitable for sealing leaks in pipes, fittings, flanges and other structures and are made by heating delayed self curing nitrile rubber formulation comprised of a critically selected combination of components including specially preconditioned nitrile rubber, sulfur, accelerants, activators, fillers, plasticizers, flame retardant, antidegradant, metallic filaments and optionally, nanophase rare earth material.

Abstract: An electronic device and a method for controlling an user interface thereof are provided. The method includes detecting an orientation of the electronic device, determining a arrangement of the user interface according to the detected orientation, displaying a shortcut key area and a status area on the user interface, and adjusting the user interface according to the operational signals from a touch panel of the electronic device.

Abstract: A feedthrough assembly of an implantable medical device includes a glass insulator containing at least approximately 20 mol % of calcium oxide (CaO), preferably of a CABAL-12 type composition. The assembly is either manufactured so that the glass insulator includes a surface layer including calcium phosphate, preferably of relatively low solubility, or is assembled in the implantable device so that the glass insulator is exposed to phosphate-containing body fluid, when the device is implanted, for the formation of a surface layer including calcium phosphate.

Abstract: The present invention provides a method for switching booting devices of a computer (10). The method includes the steps of: powering on the computer, and executing basic input/output system power on self test (BIOS POST) program; trying to boot the computer from a primary booting device (14); reading a boot program (151) of a secondary booting device (15) into a particular portion of a memory (12) of the computer; determining whether the boot program of the secondary booting device is valid for normal booting of the computer; executing the boot program of the secondary booting device, if the boot program of the secondary booting device is valid for normal booting of the computer; and booting the computer from the secondary booting device. A related computer is also provided.

Abstract: A hermetic implantable medical device (IMD) is provided with a single or multi-pin arrangement including selected glass to metal seals for a feedthrough including a ceramic disk member coupled to the sealing glass surface in potential contact with body fluids. By judicious selection of component materials (ferrule, seal insulator and pin) provides for either compression or match seals for electrical feedthroughs (having a single or multi-pin array) provide corrosion resistance and biocompatibility required in IMDs. The resultant feedthrough configuration accommodates one pin within a single ferrule or at least two pins in a single ferrule having a pin surrounded by insulator material (e.g.

Abstract: An electrolytic capacitor comprising an anode, cathode and an electrolyte. The electrolyte comprises: about 35-60%, by weight water; about 10-55%, by weight organic solvent; about 0.05 to 10%, by weight, sulphuric acid; about 0.05 to 10%, by weight, boric acid; and about 0.05 to 10%, by weight, phosphorus oxy acid.

Abstract: An electrolytic capacitor comprising an anode, cathode and an electrolyte. The electrolyte comprises: about 35-60%, by weight water; about 10-55%, by weight organic solvent; about 0.05 to 10%, by weight, sulphuric acid; about 0.05 to 10%, by weight, boric acid; and about 0.05 to 10%, by weight, phosphorus oxy acid.