Patents by Inventor Zhi-Houng Pan

Zhi-Houng Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation module and detachable expansion card using the same
    Patent number: 7852632
    Abstract: A heat-dissipation module dissipating heat for a heat-generating element on circuit board and including a heat-transferring base, a base, a first heat-dissipation unit, a heat pipe and a second heat-dissipation unit is provided. One surface of the heat-transferring base contacts the heat-generating element. The base is connected to the other surface of the heat-transferring base and has a heat-transferring block. The first heat-dissipation unit has a first fin assembly provided on the base. The first heat pipe is embedded in the heat-transferring base, one end thereof passes through the first heat-dissipation unit, and the other end thereof passes through the heat-transferring block. The second heat-dissipation unit has a second fin assembly and a second heat pipe passing through the second fin assembly and actively connected to the heat-transferring block along a route. The second heat-dissipation unit is suitable to move relative to the first heat-dissipation unit along the route.
    Type: Grant
    Filed: August 7, 2008
    Date of Patent: December 14, 2010
    Assignee: ASUSTeK Computer Inc.
    Inventors: Hung-Chun Chu, Hsi-Feng Lin, Zhi-Houng Pan
  • HEAT DISSIPATION MODULE AND DETACHABLE EXPANSION CARD USING THE SAME
    Publication number: 20090040722
    Abstract: A heat-dissipation module dissipating heat for a heat-generating element on circuit board and including a heat-transferring base, a base, a first heat-dissipation unit, a heat pipe and a second heat-dissipation unit is provided. One surface of the heat-transferring base contacts the heat-generating element. The base is connected to the other surface of the heat-transferring base and has a heat-transferring block. The first heat-dissipation unit has a first fin assembly provided on the base. The first heat pipe is embedded in the heat-transferring base, one end thereof passes through the first heat-dissipation unit, and the other end thereof passes through the heat-transferring block. The second heat-dissipation unit has a second fin assembly and a second heat pipe passing through the second fin assembly and actively connected to the heat-transferring block along a route. The second heat-dissipation unit is suitable to move relative to the first heat-dissipation unit along the route.
    Type: Application
    Filed: August 7, 2008
    Publication date: February 12, 2009
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Hung-Chun Chu, Hsi-Feng Lin, Zhi-Houng Pan