Abstract: The present disclosure provides an organic compound, a mixture, a composition, and an organic electronic device.

Abstract: Provided is a tetrahydronaphthalene-based organic compound having a structure as shown in general formula (1), a mixture, a composition, and an organic electronic device. When the tetrahydronaphthalene organic compound provided in the present disclosure is used as a blue fluorescent luminescent material, not only luminescence efficiency and lifetime of the device be improved, but also dark blue luminescence of the device can be realized.

Abstract: The present disclosure provides a MEMS -based variable optical attenuator (VOA) array, sequentially including an optical fiber array, a micro-lens array, and a MEMS-based micro-reflector array to form a VOA array having several optical attenuation units. The MEMS-based micro-reflectors can change the propagation direction of a beam, causing a misalignment coupling loss to the beam and thereby achieving optical attenuation, with a broad range of dynamic attenuation, low polarization dependent loss and wavelength dependent loss, good repeatability, short response time (at the millisecond level), etc. Arrayed device elements are used as assembly units of the present disclosure, and the assembly of arrayed elements facilitates tuning in batches. Accordingly, automation levels are improved, and the production costs are reduced.

Abstract: The present disclosure provides a MEMS-based variable optical attenuator (VOA) array, sequentially including an optical fiber array, a micro-lens array, and a MEMS-based micro-reflector array to form a VOA array having several optical attenuation units. The MEMS-based micro-reflectors can change the propagation direction of a beam, causing a misalignment coupling loss to the beam and thereby achieving optical attenuation, with a broad range of dynamic attenuation, low polarization dependent loss and wavelength dependent loss, good repeatability, short response time (at the millisecond level), etc. Arrayed device elements are used as assembly units of the present disclosure, and the assembly of arrayed elements facilitates tuning in batches. Accordingly, automation levels are improved, and the production costs are reduced.

Abstract: A LED controller for an LED pixel array includes a serial interface to an external data bus, along with an address generator connected to the serial interface and the LED pixel array. An image frame buffer is connected to the interface to receive image data and further connected to the address generator to receive an image frame buffer address. A command and control module is connected to the serial interface and configured to modify image frame buffer output signals. A calibration data storage module is connected to the command and control module to store calibration data related to pixel voltage response in the LED pixel array and enable modification of voltage provided by the dynamic power supply at least in part based on the image presented by the LED pixel array.

Abstract: The present disclosure provides a MEMS-based variable optical attenuator (VOA) array, sequentially including an optical fiber array, a micro-lens array, and a MEMS-based micro-reflector array to form a VOA array having several optical attenuation units. The MEMS-based micro-reflectors can change the propagation direction of a beam, causing a misalignment coupling loss to the beam and thereby achieving optical attenuation, with a broad range of dynamic attenuation, low polarization dependent loss and wavelength dependent loss, good repeatability, short response time (at the millisecond level), etc. Arrayed device elements are used as assembly units of the present disclosure, and the assembly of arrayed elements facilitates tuning in batches. Accordingly, automation levels are improved, and the production costs are reduced.

Abstract: The present disclosure provides a MEMS-based variable optical attenuator (VOA) array, sequentially including an optical fiber array, a micro-lens array, and a MEMS-based micro-reflector array to form a VOA array having several optical attenuation units. The MEMS-based micro-reflectors can change the propagation direction of a beam, causing a misalignment coupling loss to the beam and thereby achieving optical attenuation, with a broad range of dynamic attenuation, low polarization dependent loss and wavelength dependent loss, good repeatability, short response time (at the millisecond level), etc. Arrayed device elements are used as assembly units of the present disclosure, and the assembly of arrayed elements facilitates tuning in batches. Accordingly, automation levels are improved, and the production costs are reduced.

Abstract: A LED controller for an LED pixel array includes a serial interface to an external data bus, along with an address generator connected to the serial interface and the LED pixel array. An image frame buffer is connected to the interface to receive image data and further connected to the address generator to receive an image frame buffer address. A command and control module is connected to the serial interface and configured to modify image frame buffer output signals. A calibration data storage module is connected to the command and control module to store calibration data related to pixel voltage response in the LED pixel array and enable modification of voltage provided by the dynamic power supply at least in part based on the image presented by the LED pixel array.

Abstract: The present disclosure provides a MEMS-based variable optical attenuator (VOA) array, sequentially including an optical fiber array, a micro-lens array, and a MEMS-based micro-reflector array to form a VOA array having several optical attenuation units. The MEMS-based micro-reflectors can change the propagation direction of a beam, causing a misalignment coupling loss to the beam and thereby achieving optical attenuation, with a broad range of dynamic attenuation, low polarization dependent loss and wavelength dependent loss, good repeatability, short response time (at the millisecond level), etc. Arrayed device elements are used as assembly units of the present disclosure, and the assembly of arrayed elements facilitates tuning in batches. Accordingly, automation levels are improved, and the production costs are reduced.

Abstract: A device includes a switch, a controller electrically coupled to the switch, an RC circuit, a diode and a zero current detection circuit. The controller is configured to provide a control signal to control the switch to charge and discharge an inductor between a zero current state and a peak current state to provide a light emitting diode (LED) drive current. The RC circuit includes at least a first resistive element, a second resistive element, and a capacitive element. The diode is electrically coupled in parallel with the RC circuit. The zero current detection circuit has a first input electrically coupled to the RC circuit, a second input electrically coupled to a threshold voltage, and an output electrically coupled to the controller.

Abstract: Embodiments include systems, methods, and apparatuses for providing a dimming function in a single stage AC input light emitting diode (LED) driver with a controller that contains an on-chip error amplifier and an on-chip fixed reference voltage source coupled to a first input of the error amplifier. The controller controls a duty cycle of a switching transistor to cause a feedback voltage, applied to a first package input terminal, to match the reference voltage. To achieve a dimming function, a voltage across a current sense resistor in series with the LEDs is applied to a first input of a high gain differential amplifier, and a variable dimming control voltage is applied to a second input of the differential amplifier. The output of the differential amplifier is coupled to the first package input terminal. The differential amplifier input signals will be matched at the target LED current level.

Abstract: A light emitting diode (LED) module may include a direct current (DC) voltage node formed on a first layer. The DC voltage node may be configured to sink a first current. One or more devices may be formed on the first layer configured to provide a second current to one or more LEDs. A device of the one or more devices may carry a steep slope voltage waveform. A local shielding area may be formed in a second layer directly below the DC voltage node and the one or more devices. The local shielding area may include a substantially continuous area of conductive material. A conductive via may extend through one or more layers. The conductive via may electrically connect the DC voltage node and the local shielding area.

Abstract: A light emitting diode (LED) module may include a direct current (DC) voltage node formed on a first layer. The DC voltage node may be configured to sink a first current. One or more devices may be formed on the first layer configured to provide a second current to one or more LEDs. A device of the one or more devices may carry a steep slope voltage waveform. A local shielding area may be formed in a second layer directly below the DC voltage node and the one or more devices. The local shielding area may include a substantially continuous area of conductive material. A conductive via may extend through one or more layers. The conductive via may electrically connect the DC voltage node and the local shielding area.

Abstract: A device includes a switch, a controller electrically coupled to the switch, an RC circuit, a diode and a zero current detection circuit. The controller is configured to provide a control signal to control the switch to charge and discharge an inductor between a zero current state and a peak current state to provide a light emitting diode (LED) drive current. The RC circuit includes at least a first resistive element, a second resistive element, and a capacitive element. The diode is electrically coupled in parallel with the RC circuit. The zero current detection circuit has a first input electrically coupled to the RC circuit, a second input electrically coupled to a threshold voltage, and an output electrically coupled to the controller.

Abstract: A device includes a first circuit and a second circuit. The first circuit receives a first voltage, at a first input, and provides a second voltage having one of a first level and a second level based on a level of the first voltage being above or below a threshold voltage. The second circuit is electrically coupled to the first input of the first circuit and decreases the level of the first voltage below a threshold voltage on a condition that the level of the first voltage is above the threshold voltage for a maximum time.

Abstract: A light emitting diode (LED) module may include a direct current (DC) voltage node formed on a first layer. The DC voltage node may be configured to sink a first current. One or more devices may be formed on the first layer configured to provide a second current to one or more LEDs. A device of the one or more devices may carry a steep slope voltage waveform. A local shielding area may be formed in a second layer directly below the DC voltage node and the one or more devices. The local shielding area may include a substantially continuous area of conductive material. A conductive via may extend through one or more layers. The conductive via may electrically connect the DC voltage node and the local shielding area.

Abstract: A multi-layer metal core printed circuit board (MCPCB) has mounted on it at least one or more heat-generating LEDs and one or more devices configured to provide current to the one or more LEDs. The one or more devices may include a device that carries a steep slope voltage waveform. Since there is typically a very thin dielectric between the patterned copper layer and the metal substrate, the steep slope voltage waveform may produce a current in the metal substrate due to AC coupling via parasitic capacitance. This AC-coupled current may produce electromagnetic interference (EMI). To reduce the EMI, a local shielding area may be formed between the metal substrate and the device carrying the steep slope voltage waveform. The local shielding area may be conductive and may be electrically connected, to a DC voltage node adjacent to the one or more devices.

Abstract: An apparatus (400A, 400B, 400C, 400D, 500A, 500B, 800) supplies power to an output thereof. The apparatus includes: an isolation transformer (110) and a rectifier (120). The isolation transformer has a parasitic capacitance (Cp) between one of its input terminals (1S/1F) and one of its output terminals (2S/2F). The rectifier has a pair of input terminals connected to the output terminals of the isolation transformer, and a pair of output terminals connected across the apparatus' output. The rectifier includes a plurality of diodes (D1/D2/D3/D4) connected in a bridge. The apparatus also includes a compensation device for compensating for an increase in an output voltage across the output of the apparatus due to a charge pump effect of the parasitic capacitance. The compensation device includes at least one compensation capacitor (410, 510/520, 810/812) connected across one of the diodes of the bridge.

Abstract: Embodiments include systems, methods, and apparatuses for providing a dimming function in a single stage AC input light emitting diode (LED) driver with a controller that contains an on-chip error amplifier and an on-chip fixed reference voltage source coupled to a first input of the error amplifier. The controller controls a duty cycle of a switching transistor to cause a feedback voltage, applied to a first package input terminal, to match the reference voltage. To achieve a dimming function, a voltage across a current sense resistor in series with the LEDs is applied to a first input of a high gain differential amplifier, and a variable dimming control voltage is applied to a second input of the differential amplifier. The output of the differential amplifier is coupled to the first package input terminal. The differential amplifier input signals will be matched at the target LED current level.

Abstract: A multi-layer metal core printed circuit board (MCPCB) has mounted on it at least one or more heat-generating LEDs and one or more devices configured to provide current to the one or more LEDs. The one or more devices may include a device that carries a steep slope voltage waveform. Since there is typically a very thin dielectric between the patterned copper layer and the metal substrate, the steep slope voltage waveform may produce a current in the metal substrate due to AC coupling via parasitic capacitance. This AC-coupled current may produce electromagnetic interference (EMI). To reduce the EMI, a local shielding area may be formed between the metal substrate and the device carrying the steep slope voltage waveform. The local shielding area may be conductive and may be electrically connected, to a DC voltage node adjacent to the one or more devices.