Patents by Inventor ZHIJIE QIU

ZHIJIE QIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEASUREMENT METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE
    Publication number: 20140236528
    Abstract: A measurement method for a junction-to-case thermal resistance is provided. First, a first transient cooling curve of the chip for the semiconductor device under test (DUT) without grease is measured. Then a second transient cooling curve of the chip for the DUT with grease is measured. A difference ?T of temperature variations of the two transient cooling curves with and without grease is calculated. The temperature of a constant temperature cold plate for fixing the semiconductor DUT is increased by ?T, and a third transient cooling curve of the chip for the DUT with grease is measured again. The first transient cooling curve and the third transient cooling curve are used to calculate the junction-to-case thermal resistance.
    Type: Application
    Filed: October 16, 2013
    Publication date: August 21, 2014
    Applicant: INSTITUTE OF ELECTRICAL ENGINEERING, CHINESE ACADEMY OF SCIENCES
    Inventors: ZHIJIE QIU, JIN ZHANG, XUHUI WEN