Patents by Inventor Zhi-Kai Sun

Zhi-Kai Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110194267
    Abstract: This invention provides an electronic assembly and a case thereof. The electronic assembly is used in an electronic device and includes a first cover, a second cover, a plurality of components, a sealing element, and at least one fastening element. The second cover is connected with the first cover to define a containing space. The components are contained in the containing space. The sealing element is sandwiched between the first cover and the second cover and has conductive nonwoven fabric. The fastening element fastens the first cover and the second cover and compresses the conductive nonwoven fabric of the sealing element to allow the first cover to be electrically connected to the second cover. The sealing element with the conductive nonwoven fabric is disposed between the first cover and the second cover of the case in the invention for preventing the components from water and EMI.
    Type: Application
    Filed: January 10, 2011
    Publication date: August 11, 2011
    Inventors: Zhi-Kai Sun, Ho-Ching Huang, Wen-Bin Li