Patents by Inventor Zhikang Qin

Zhikang Qin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240140787
    Abstract: A magnesium-based solid hydrogen storage material with liquid phase regulation function and a preparation method thereof and an application thereof in an all-solid-state battery are provided, belonging to the technical field of new energy. The magnesium-based solid hydrogen storage material with the liquid phase regulation function includes following raw materials in percentage by mass: 95% of magnesium hydride and 5% of lithium borohydride. Lithium borohydride as an ionic conductor is dispersed on a surface and matrix of magnesium hydride, which provides channels for the rapid hydrogen storage of the magnesium hydride-based materials.
    Type: Application
    Filed: July 13, 2023
    Publication date: May 2, 2024
    Inventors: Yongtao LI, Zhikang QIN, Xiaoli DING, Haiwen LI, Tingzhi SI, Dongming LIU, Qingan ZHANG
  • Publication number: 20040262723
    Abstract: At least one of a corner portion of the semiconductor chip, a corner portion of the sealing member, and a portion in which two neighboring gold wires are spaced at a larger distance than any other two neighboring gold wires adjacent to the two neighboring gold wires is configured such that one electrode and another electrode adjacent to it are arranged in such a way that the space between one gold wire connected to one electrode and another gold wire connected to another electrode and adjacent to one gold wire is substantially equal to the diameter of these gold wires when one gold wire has been displaced toward another gold wire due to a flow of a resin at a time of sealing with the resin.
    Type: Application
    Filed: June 24, 2004
    Publication date: December 30, 2004
    Applicant: Renesas Technology Corp.
    Inventors: Zhikang Qin, Yasuki Takata, Hiroshi Horibe, Fumiaki Aga, Noriaki Higuchi, Yasuhito Suzuki
  • Patent number: 6602738
    Abstract: A semiconductor element is first fixed on a frame. The semiconductor element and a plurality of leads are connected together. The semiconductor element is sealed with molding resin, to thereby fabricate a package having a length per side of 14 mm or more. After tie bars interconnecting a plurality of leads have been cut, a package is subjected to heat treatment at a predetermined temperature.
    Type: Grant
    Filed: September 12, 2002
    Date of Patent: August 5, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Zhikang Qin, Namiki Moriga
  • Publication number: 20030096455
    Abstract: A semiconductor element is first fixed on a frame. The semiconductor element and a plurality of leads are connected together. The semiconductor element is sealed with molding resin, to thereby fabricate a package having a length per side of 14 mm or more. After tie bars interconnecting a plurality of leads have been cut, a package is subjected to heat treatment at a predetermined temperature.
    Type: Application
    Filed: September 12, 2002
    Publication date: May 22, 2003
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Zhikang Qin, Namiki Moriga