Patents by Inventor Zhi-Lun Hsieh

Zhi-Lun Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating wire bonding structure
    Patent number: 9289846
    Abstract: A method for fabricating a wire bonding structure is disclosed, which includes: providing a substrate having a plurality of bonding pads; and foaming a ball end of a bonding wire on at least one of the bonding pads by performing a scrubbing process along a path around a periphery of the bonding pad, thereby preventing delamination of the ball end of small size from the bonding pad.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: March 22, 2016
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Wei-Sheng Lin, Lung-Tang Hung, Meng-Hung Yeh, Zhi-Lun Hsieh, Yude Chu
  • METHOD FOR FABRICATING WIRE BONDING STRUCTURE
    Publication number: 20150028081
    Abstract: A method for fabricating a wire bonding structure is disclosed, which includes: providing a substrate having a plurality of bonding pads; and foaming a ball end of a bonding wire on at least one of the bonding pads by performing a scrubbing process along a path around a periphery of the bonding pad, thereby preventing delamination of the ball end of small size from the bonding pad.
    Type: Application
    Filed: November 21, 2013
    Publication date: January 29, 2015
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD
    Inventors: Wei-Sheng Lin, Lung-Tang Hung, Meng-Hung Yeh, Zhi-Lun Hsieh, Yude Chu