Abstract: A semiconductor structure includes a first layer, a second layer, a first interconnection layer, and a second interconnection layer. The first layer includes an upper passive component pattern, and the second layer includes a lower passive component pattern, wherein the upper passive component pattern is opposite to the lower passive component pattern. The first interconnection layer includes at least one first interconnect structure electrically connected on the upper passive component pattern. The second interconnection layer includes at least one second interconnect structure electrically connected on the passive component pattern. The first interconnect structure on the upper passive component pattern is hybrid bonded with the second interconnect structure on the lower passive component pattern. Therefore, the upper passive component pattern and the lower passive component pattern are joined by hybrid bonding to form a passive device.

Abstract: A coolant through spindle device is disclosed, including a rotating joint member secured to the rear end of the spindle for conducting coolant into the spindle, the coolant being conducted through a separate coolant passage inside the spindle to the nozzles formed on a cutting tool to be sprayed out thereof so as to fully cool down and lubricate the cutting point thereof, increase machining precision and cutting rate, and prolong service life of the cutting tool. Moreover, by using a switching collar to provide separated coolant passage and pressurized air passage, no residual coolant can follow the pressurized air jet into the tapper hole of the spindle to contaminate the tapper hole.