Abstract: The present invention relates to the technical field of catalyst preparation, disclosing a preparation method and application of a coated vanadium-tungsten-titanium oxide monolithic SCR catalyst. The method includes the steps of mixing a vanadium oxide precursor, a tungsten oxide precursor, titanium dioxide, an inorganic adhesive, an organic adhesive and a macromolecular surfactant with deionized water and stirring them to obtain a thick liquid; adding a pH adjuster to the thick liquid to make its pH 1.5-4.5; impregnating a cordierite honeycomb carrier in the thick liquid to obtain a preliminarily-impregnated catalyst and dried and calcined the preliminarily-impregnated catalyst to obtain a finished catalyst. The method has advantages such as simple operation, easy repetition and short time-consuming, so it can be applied to exhaust gas post-treatment of a marine diesel engine, and provide a good choice for catalysts used to denitrify medium and high temperature exhausted gas from marine engines.

Abstract: The present disclosure provides a method for controlling a 3D NAND memory using a read operation. The method can include increasing a voltage to a plurality of top select gates, with respect to a first reference voltage level, during a pre-pulse period of the read operation prior to a read period of the read operation. The method can also include increasing a voltage to a plurality of word lines, with respect to a second reference voltage level, during the pre-pulse period. The method can also include decreasing a voltage to a bit line, with respect to the first voltage, during the pre-pulse period. The method can also include applying no voltage change to a bottom select gate during the pre-pulse period.

Abstract: A memory device, an operating method thereof, a system, and a non-transitory tangible storage medium are disclosed. The memory device includes a source line (SL), a bit line (BL), a memory string, a word line, a select line and a peripheral circuit. The memory string includes a memory cell and a select transistor including a storage layer. The word line is coupled to the memory cell. The select line is coupled to the select transistor. The peripheral circuit is coupled to the SL, the BL, the select line, and the word line. The peripheral circuit is configured to: apply a first voltage to the select line; and apply a second voltage to the SL and/or the BL, in which a first peak level of the first voltage is greater than a second peak level of second voltage.

Abstract: A memory, a programming method, and a memory system are provided. The programming method includes programming a selected memory cell string according to a programming sequence; applying, when programming a memory cell in the selected memory cell string that is coupled to a selected non-edge word line in a plurality of word lines, a first pass voltage to edge word lines in the plurality of word lines; and applying a second pass voltage to a non-edge word line adjacent to the edge word lines. The edge word lines are at least one word line in the plurality of word lines adjacent to the source line or to the bit line; the non-edge word lines are word lines in the plurality of word lines other than the edge word lines; and the selected non-edge word line is not adjacent to the edge word lines.

Abstract: This disclosure provides a memory device, a memory system, and an operation method. The memory device includes a memory array having a plurality of memory blocks and a control circuit coupled to the memory array and used to control the memory array. The control circuit is configured to determine a first average value of threshold voltages of bottom dummy cells in an unused memory block, determine a difference value between the first average value and a first reference value, and judge based on the difference value when bottom dummy cells in the memory block are to be programmed so that the first average value reaches a first threshold.

Abstract: A memory device includes a memory array including memory blocks, and a control circuit coupled to the memory array. The control circuit is configured to when multi-pass program operations are performed, during a non-last pass program of the memory cells in a first memory sub-block of a first memory block, determine verify loop counts of verify operations after programming the memory cells in the first memory sub-block of the first memory block to one or more first target program states; and when programming the memory cells in a second memory sub-block of the first memory block to the one or more first target program states using the same program and verify conditions as for the first memory sub-block of the first memory block, during the non-last pass program, not perform at least the verify operation corresponding to the last of the verify loop counts.

Abstract: A memory device includes a plurality of memory cells arranged in a plurality of rows and a plurality of strings. A method of programming the memory device includes programming a first row of the memory cells. The method also includes, after programing the first row of the memory cells, programming a second row of the memory cells. The second row is adjacent to the first row in a first string direction. The method further includes, after programming the second row of the memory cells, programming a third row of the memory cells. The third row is two rows apart from the second row in a second string direction opposite to the first string direction.

Abstract: A memory device is provided. The memory device includes an array of memory cells arranged in a plurality of rows, a plurality of word lines respectively coupled to the plurality of rows of the memory cells; and a peripheral circuit coupled to the word lines and configured to perform multi-pass programming on a selected row of memory cells coupled to a selected word line of the word lines. The multi-pass programming includes a plurality of programming passes, each of the programming passes having a programming operation and a verify operation. To perform the multi-pass programming, the peripheral circuit is configured to, in a non-last programming pass, perform a negative gate stress (NGS) operation on each memory cell in the selected row of memory cells between the programming operation and the verify operation.

Abstract: A memory device is provided. The memory device includes an array of memory cells arranged, a plurality of word lines, and a peripheral circuit configured to perform multi-pass programming on a selected row of memory cells coupled to a selected word line. The multi-pass programming includes a plurality of programming passes. Each of the programming passes includes a programming operation and a verify operation. To perform the multi-pass programming, the peripheral circuit is configured to, in a non-last programming pass of memory cells, perform a negative gate stress (NGS) operation on a memory cell in the selected row of memory cells between the programming operation and the verify operation; and at a same time, perform a NGS operation on a memory cell in an unselected row of memory cells coupled to an unselected word line of the word lines. The unselected word line is adjacent to the selected word line.

Abstract: A memory device is provided. The memory device includes an array of memory cells arranged in a plurality of rows, a plurality of word lines respectively coupled to the plurality of rows of the memory cells; and a peripheral circuit coupled to the word lines and configured to perform multi-pass programming on a selected row of memory cells coupled to a selected word line of the word lines. The multi-pass programming includes a plurality of programming passes, each of the programming passes having a programming operation and a verify operation. To perform the multi-pass programming, the peripheral circuit is configured to, in a non-last programming pass, perform a negative gate stress (NGS) operation on each memory cell in the selected row of memory cells between the programming operation and the verify operation.

Abstract: A memory device is provided. The memory device includes an array of memory cells arranged, a plurality of word lines, and a peripheral circuit configured to perform multi-pass programming on a selected row of memory cells coupled to a selected word line. The multi-pass programming includes a plurality of programming passes. Each of the programming passes includes a programming operation and a verify operation. To perform the multi-pass programming, the peripheral circuit is configured to, in a non-last programming pass of memory cells, perform a negative gate stress (NGS) operation on a memory cell in the selected row of memory cells between the programming operation and the verify operation; and at a same time, perform a NGS operation on a memory cell in an unselected row of memory cells coupled to an unselected word line of the word lines. The unselected word line is adjacent to the selected word line.

Abstract: A memory device includes a plurality of memory cells arranged in a plurality of rows and a plurality of strings. A method of programming the memory device includes programming a first row of the memory cells. The method also includes, after programing the first row of the memory cells, programming a second row of the memory cells. The second row is adjacent to the first row in a first string direction. The method further includes, after programming the second row of the memory cells, programming a third row of the memory cells. The third row is two rows apart from the second row in a second string direction opposite to the first string direction.

Abstract: A memory device includes a plurality of memory cells arranged in a plurality of rows and a plurality of strings. A method of programming the memory device includes programming a first row of the memory cells. The method also includes, after programing the first row of the memory cells, programming a second row of the memory cells. The second row is adjacent to the first row in a first string direction. The method further includes, after programming the second row of the memory cells, programming a third row of the memory cells. The third row is two rows apart from the second row in a second string direction opposite to the first string direction.

Abstract: A memory device includes a plurality of memory cells arranged in a plurality of rows and a plurality of strings. A method of programming the memory device includes programming a first row of the memory cells. The method also includes, after programing the first row of the memory cells, programming a second row of the memory cells. The second row is adjacent to the first row in a first string direction. The method further includes, after programming the second row of the memory cells, programming a third row of the memory cells. The third row is two rows apart from the second row in a second string direction opposite to the first string direction.

Abstract: A memory device includes a plurality of memory cells arranged in N rows, N being a positive integer. A method includes programming a first row of the N rows; after programming the first row, programming a (2m+1)th row, m being an integer between 1 and N/2?1; and immediately after programming the (2m+1)th row, programming a (2m)th row; and after programming an (N?2)th row, programming an Nth row. Even rows closer to the first row are programmed before even rows farther away from the first row.