Patents by Inventor Zhi Rong Guo

Zhi Rong Guo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multipurpose decapsulation holder and method for a ball grid array package
    Patent number: 7772030
    Abstract: A method and apparatus for the decapsulation of integrated circuit packages. The apparatus includes a support member, the support member having an open region and an adjustable device coupled to the support member. The adjustable device can be adapted to hold a BGA package such that a surface region of the BGA package is spatially disposed to face a decapsulation source and a plurality of balls on the BGA package remain free from contact from the decapsulation source and free from contact from a thermal source capable of causing damage to one or more of the balls. The decapsulation source is provided to subject a portion of the surface region of the BGA package for removal of the portion of the BGA package.
    Type: Grant
    Filed: December 23, 2006
    Date of Patent: August 10, 2010
    Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventors: Chun Kui Ji, Shan An Liang, Zhi Rong Guo, Min Pan
  • MULTIPURPOSE DECAPSULATION HOLDER AND METHOD FOR A BALL GRID ARRAY PACKAGE
    Publication number: 20080142482
    Abstract: A method and apparatus for the decapsulation of integrated circuit packages. The apparatus includes a support member, the support member having an open region and an adjustable device coupled to the support member. The adjustable device can be adapted to hold a BGA package such that a surface region of the BGA package is spatially disposed to face a decapsulation source and a plurality of balls on the BGA package remain free from contact from the decapsulation source and free from contact from a thermal source capable of causing damage to one or more of the balls. The decapsulation source is provided to subject a portion of the surface region of the BGA package for removal of the portion of the BGA package.
    Type: Application
    Filed: December 23, 2006
    Publication date: June 19, 2008
    Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventors: Chun Kui Ji, Shan An Liang, Zhi Rong Guo, Min Pan