Abstract: A heat dissipation apparatus includes fins each including a body and blades extending radially outwardly from the body. The blades define cutouts therebetween. The fins are stacked together in such a manner that the cutouts of the fins cooperatively form airflow guiding channels each extending spirally from top to bottom.

Abstract: A heat dissipation device for removing heat from an electronic device and electronic components, includes a base plate in contact with the electronic device, a first fin set and a second fin set mounted on the base plate. The first fin set includes a plurality of first fins perpendicularly arranged on the base plate. The second fin set includes a plurality of second fins attached to a lateral side of the first fin set and perpendicular to both the first fins and the base plate. A fan is mounted on tops of the first fin set and the second fin set to cover both of them. Air generated by the fan flows through the first and second fin sets to cool the electronic components mounted on orthogonally neighboring sides of the heat dissipation device.

Abstract: A heat dissipation device includes a heat sink, a fan having a flange and a plurality of brackets mounting the fan on the heat sink. Each of the brackets includes two pair of spaced buckles extending from a top thereof toward the fan. A bottom of each bracket is fixed on a bottom of the heat sink. The two pair of buckles of the bracket are buckled on the flange of the fan.

Abstract: A heat dissipation device removing heat from a memory module includes two conducting plate clipping the memory module and an elastic member. Each conducting plate includes a lower part and an upper part. The two lower parts of the two conducting plates abut against two opposite sides of the memory module, respectively. The two upper parts of the two conducting plates are pivotably connected together and located above the memory module. The elastic member is located between the two upper parts and urges the two lower parts towards the memory module. The upper part of each conducting plate is slantwise at an obtuse angle to the lower part to make the two upper parts of the two conducting plates splay upwardly.

Abstract: A heat dissipation device removing heat from a heat generating electronic device on a printed circuit board includes a base, a plurality of fins attached to the base and a clip for mounting the base and the fins onto the heat generating electronic device. Each of the fins defines a closed through hole therein. The holes of the fins cooperatively define a channel. The clip includes a locking beam extending through the channel of the fins and two fasteners engaging the locking beam mounting the base and the fins onto the heat generating electronic device.

Abstract: A heat dissipation device configured for dissipating heat of a memory module includes two fin assemblies pivotally assembled together through a pivot, two heat spreaders adapted for being arranged at two opposite side surfaces of the memory module, and two heat pipes. Each of the two heat pipes includes an evaporation section and a condensation section formed at two opposite ends thereof. The condensation sections of the heat pipes are respectively attached to the fin assemblies, and the evaporation sections of the heat pipes are respectively and thermally attached to the heat spreaders, whereby the heat of the memory module is transferred by the heat pipes from the heat spreaders to the fin assemblies for dissipation.

Abstract: A heat dissipation device for dissipating heat generated by a heat-generating component mounted on a printed circuit board, includes a heat absorbing board with a bottom thereof attached to the heat-generating component, two heat sinks, two heat pipes respectively connecting the heat absorbing board and the two heat sinks, two centrifugal fans and two clips. Each of the centrifugal fans is located at a lateral side of a corresponding heat sink. Each of the clips includes an engaging portion riveting with the heat absorbing board and two locking portions extending from two ends of the engaging portion and locked onto the printed circuit board to thereby secure the heat absorbing board on the heat-generating component.

Abstract: A heat dissipation apparatus includes fins each including a body and blades extending radially outwardly from the body. The blades define cutouts therebetween. The fins are stacked together in such a manner that the cutouts of the fins cooperatively form airflow guiding channels each extending spirally from top to bottom.

Abstract: A heat dissipation device includes a heat sink, a fan having a flange and a plurality of brackets mounting the fan on the heat sink. Each of the brackets includes two pair of spaced buckles extending from a top thereof toward the fan. A bottom of each bracket is fixed on a bottom of the heat sink. The two pair of buckles of the bracket are buckled on the flange of the fan.

Abstract: A heat dissipation device removing heat from a memory module includes two conducting plate clipping the memory module and an elastic member. Each conducting plate includes a lower part and an upper part. The two lower parts of the two conducting plates abut against two opposite sides of the memory module, respectively. The two upper parts of the two conducting plates are pivotably connected together and located above the memory module. The elastic member is located between the two upper parts and urges the two lower parts towards the memory module. The upper part of each conducting plate is slantwise at an obtuse angle to the lower part to make the two upper parts of the two conducting plates splay upwardly.

Abstract: A heat dissipation device for dissipating heat generated by a heat-generating component mounted on a printed circuit board, includes a heat absorbing board with a bottom thereof attached to the heat-generating component, two heat sinks, two heat pipes respectively connecting the heat absorbing board and the two heat sinks, two centrifugal fans and two clips. Each of the centrifugal fans is located at a lateral side of a corresponding heat sink. Each of the clips includes an engaging portion riveting with the heat absorbing board and two locking portions extending from two ends of the engaging portion and locked onto the printed circuit board to thereby secure the heat absorbing board on the heat-generating component.

Abstract: A thermal module includes a mounting plate, a centrifugal fan with a fin assembly arranged at an air outlet thereof, and a heat pipe connected the fin assembly with the heat mounting plate. The centrifugal fan includes a fan housing and an impeller rotatably received in the fan housing. The fan housing is disposed immediately neighboring to the mounting plate and mounted to a lateral side of the mounting plate via a securing structure formed between the fan housing and the mounting plate. The fan housing consists of a base and a cover. The base is made of a plastic material.

Abstract: A heat dissipation device for removing heat from heat-generating components includes a fin unit. The fin unit includes a plurality of fins stacked together. Each fin is wave-shaped in profile and comprises a plurality of wave crests and wave troughs alternately arranged with each other. The wave crests of one of the fins respectively engage the wave troughs of a neighboring upper one of the fins. The wave troughs of the one of the fins are separated from and located below the corresponding wave crests of the upper one of the fins.

Abstract: A heat dissipation device configured for dissipating heat of a memory module includes two fin assemblies pivotally assembled together through a pivot, two heat spreaders adapted for being arranged at two opposite side surfaces of the memory module, and two heat pipes. Each of the two heat pipes includes an evaporation section and a condensation section formed at two opposite ends thereof. The condensation sections of the heat pipes are respectively attached to the fin assemblies, and the evaporation sections of the heat pipes are respectively and thermally attached to the heat spreaders, whereby the heat of the memory module is transferred by the heat pipes from the heat spreaders to the fin assemblies for dissipation.

Abstract: A heat dissipation device includes a base, first and second fin units, two heat pipes, and a fan. The first fin unit is located on the base, and the second fin unit is located on the first fin unit. Each fin unit comprises a plurality of parallel fins with a plurality of channels defined therebetween. Each fin comprises an inlet section, an outlet section and a neck section interconnecting the inlet and outlet sections. A height of the neck section reduces gradually from the inlet section to the outlet section. Each heat pipe comprises an evaporating portion connecting with the base and a condensing portion inserting into a corresponding one of the outlet sections of the first and second fin units. The fan is located above the base and mounted onto the inlet sections of the first and second fin units.

Abstract: A heat dissipation device for removing heat from an electronic device and electronic components, includes a base plate in contact with the electronic device, a first fin set and a second fin set mounted on the base plate. The first fin set includes a plurality of first fins perpendicularly arranged on the base plate. The second fin set includes a plurality of second fins attached to a lateral side of the first fin set and perpendicular to both the first fins and the base plate. A fan is mounted on tops of the first fin set and the second fin set to cover both of them. Air generated by the fan flows through the first and second fin sets to cool the electronic components mounted on orthogonally neighboring sides of the heat dissipation device.

Abstract: A projector includes first, second and third light sources and first, second and third heat dissipation devices attached to and thermally connecting with the light sources for dissipating heat generated thereby. The first heat dissipation device includes a first heat sink located adjacent to a lateral side of the projector from which a lens protrudes, a fin assembly and a bent heat pipe connecting the first heat sink and the fin assembly. The second heat dissipation device includes a base and a plurality of fins located at a rear side of the projector and defining a stepped portion on which the fin assembly of the first heat dissipation device is mounted. The third heat dissipation device includes a base and a plurality of fins and is located adjacent to an opposite lateral side of the projector.

Abstract: A heat dissipation device removing heat from a heat generating electronic device on a printed circuit board includes a base, a plurality of fins attached to the base and a clip for mounting the base and the fins onto the heat generating electronic device. Each of the fins defines a closed through hole therein. The holes of the fins cooperatively define a channel. The clip includes a locking beam extending through the channel of the fins and two fasteners engaging the locking beam mounting the base and the fins onto the heat generating electronic device.