Abstract: A connector and a manufacturing method of the connector are provided. The connector, comprising an insulator (10), a first conductive layer (11) disposed on one side surface of the insulator (10), and a second conductive layer (12) disposed on the other side surface of the insulator (10), the insulator (10) is further provided with a conductive medium (13) connecting the first conductive layer (11) and the second conductive layer (12), and a protrusion portion (14) is disposed on the surface of the first conductive layer (11) or/and the second conductive layer (12).

Abstract: Provided are a method and apparatus for evaluating a degree of frequency regulation urgency of a generator set, a power system and a storage medium.

Abstract: A flexible connector, comprising an insulator (10), multiple first conductors (11) are disposed on one side surface of the insulator (10), and multiple second conductors (12) are disposed on the other side surface of the insulator (10), the insulator (10) is further provided with a conductive medium (13) connecting the first conductors (11) and the second conductors (12), and protrusion portions (14) are disposed on the surfaces of the first conductors (11) and the second conductors (12).

Abstract: An electromagnetic scattering film, and an electronic device with the electromagnetic scattering film are provided. The electromagnetic scattering film includes a metal layer, wherein the metal layer is provided with a through hole penetrating through an upper surface and a lower surface of the metal layer, and a maximum value of the distance s between any two points on a contour of a section of the through hole is less than the wavelength ? of a microwave emitted into the through hole, such that the microwave is diffracted after being emitted into the through hole. By arranging, on the metal layer, a through hole being smaller than the wavelength of a microwave, the microwave, which was originally transmitted in a linear manner, is diffracted after being emitted into the through hole, thereby expanding a microwave transmission and/or receiving space range.

Abstract: A shielding film and a circuit board are provided. The shielding film includes a first film layer (11), a contrast structural layer (12) and an electromagnetic shielding layer (13). The first film layer (11) is disposed on a first side of the electromagnetic shielding layer (13). The contrast structural layer (12) is disposed on the first side of the electromagnetic shielding layer (13). The grayscale value of the color of the contrast structural layer (12) is greater than the grayscale value of the color of the first film layer (11). In the contrast structural layer (12) and the first film layer (11), a hollowed-out pattern of an identification code is formed on a layer away from the electromagnetic shielding layer (13).

Abstract: A composite metal foil and a preparation method thereof are provided. The composite metal foil includes a carrier layer, a barrier layer, a striping layer, and a metal foil layer. The carrier layer, the barrier layer, the striping layer, and the metal foil layer are sequentially stacked, the barrier layer includes a metal bonding layer and a high-temperature resistant layer stacked, and the metal bonding layer is disposed between the carrier layer and the high-temperature resistant layer. The striping layer is disposed between the carrier layer and the metal foil layer so as to facilitate peeling of the carrier layer, and the barrier layer is disposed between the carrier layer and the metal foil layer so as to prevent the carrier layer and the metal foil layer from diffusing mutually to cause bonding at a high temperature, so that the carrier layer and the metal foil layer are easy to peel off.

Abstract: Provided are a scattering film and an electronic device with the scattering film. The scattering film includes: a carrier layer configured to emit microwave signals and/or receive microwave signals and a first protruding structure arranged on the surface of the carrier layer; and when passing through the first protruding structure, microwaves are reflected. According to the solution, a first protruding structure is provided, and microwaves can be reflected when passing through the first protruding structure, so that the transmitting and/or receiving space range for the microwaves which are originally only directionally transmitted is enlarged, and the coverage range of microwave signals is increased.

Abstract: The present disclosure provides a circuit board for high frequency transmission and a shielding method. The circuit board for high frequency transmission includes: a first shielding film, a second shielding film and a circuit board body. The circuit board body includes a first surface and a second surface that are arranged opposite to each other. The first shielding film covers the first surface, and the second shielding film covers the second surface. The circuit board body is provided with a wire region. The first shielding film and the second shielding film are in electrical connection at a lateral side of the wire region. Therefore, leaky waves at the lateral side of the circuit board body are effectively avoided, and the circuit board body is thin in structure.

Abstract: An electromagnetic scattering film, and an electronic device with the electromagnetic scattering film are provided. The electromagnetic scattering film includes a metal layer, wherein the metal layer is provided with a through hole penetrating through an upper surface and a lower surface of the metal layer, and a maximum value of the distance s between any two points on a contour of a section of the through hole is less than the wavelength ? of a microwave emitted into the through hole, such that the microwave is diffracted after being emitted into the through hole. By arranging, on the metal layer, a through hole being smaller than the wavelength of a microwave, the microwave, which was originally transmitted in a linear manner, is diffracted after being emitted into the through hole, thereby expanding a microwave transmission and/or receiving space range.

Abstract: Provided are an Electromagnetic Interference (EMI) shielding film, a circuit board including the EMI shielding film, and a preparation method for the EMI shielding film. The EMI shielding film includes a shielding layer and an adhesive film layer, wherein the shielding layer includes a first surface and a second surface opposite to each other; the second surface is a rolling uneven surface; convex conductor particles are also formed on the rolling uneven surface; and the second surface of the shielding layer is provided with the adhesive film layer, so the adhesive film layer of the EMI shielding film will extrude adhesive materials into recesses of the second surface in a lamination process, the adhesive holding capacity is increased, and delamination and blister of board is unlikely to occur.

Abstract: Disclosed herein are methods, systems, and processes to secure external access to runtime systems in appliances. A request to register a security token configured to permit access to a computing system is received at the computing system. An authorization response authenticating the security token is sent. Another request to access the computing system based on the authenticated security token is received, and access is permitted to the computing system.

Abstract: A metal foil that has a carrier and a preparation method thereof. The metal foil with a carrier comprises a carrier layer, a barrier layer, a striping layer, and a metal foil layer. The carrier layer, the barrier layer, the striping lay, and the metal foil layer are sequentially stacked, or the carrier layer, the striping layer, the barrier layer, and the metal foil layer are sequentially stacked. The diffusion depth of the carrier layer to the metal foil layer is less than or equal to 3 ?m and the diffusion depth of the metal foil layer toward the carrier layer is less than or equal to 3 ?m at a temperature of 20-400° C.

Abstract: A flexible connector, comprising an insulator (10), multiple first conductors (11) are disposed on one side surface of the insulator (10), and multiple second conductors (12) are disposed on the other side surface of the insulator (10), the insulator (10) is further provided with a conductive medium (13) connecting the first conductors (11) and the second conductors (12), and protrusion portions (14) are disposed on the surfaces of the first conductors (11) and the second conductors (12).

Abstract: A connector and a manufacturing method of the connector are provided. The connector, comprising an insulator (10), a first conductive layer (11) disposed on one side surface of the insulator (10), and a second conductive layer (12) disposed on the other side surface of the insulator (10), the insulator (10) is further provided with a conductive medium (13) connecting the first conductive layer (11) and the second conductive layer (12), and a protrusion portion (14) is disposed on the surface of the first conductive layer (11) or/and the second conductive layer (12).

Abstract: A composite metal foil and a preparation method thereof are provided. The composite metal foil includes a carrier layer, a barrier layer, a striping layer, and a metal foil layer. The carrier layer, the barrier layer, the striping layer, and the metal foil layer are sequentially stacked, the barrier layer includes a metal bonding layer and a high-temperature resistant layer stacked, and the metal bonding layer is disposed between the carrier layer and the high-temperature resistant layer. The striping layer is disposed between the carrier layer and the metal foil layer so as to facilitate peeling of the carrier layer, and the barrier layer is disposed between the carrier layer and the metal foil layer so as to prevent the carrier layer and the metal foil layer from diffusing mutually to cause bonding at a high temperature, so that the carrier layer and the metal foil layer are easy to peel off.

Abstract: Provided are an Electromagnetic Interference (EMI) shielding film, a circuit board including the EMI shielding film, and a preparation method for the EMI shielding film. The EMI shielding film includes a shielding layer and an adhesive film layer, wherein the shielding layer includes a first surface and a second surface opposite to each other; the second surface is a rolling uneven surface; convex conductor particles are also formed on the rolling uneven surface; and the second surface of the shielding layer is provided with the adhesive film layer, so the adhesive film layer of the EMI shielding film will extrude adhesive materials into recesses of the second surface in a lamination process, the adhesive holding capacity is increased, and delamination and blister of board is unlikely to occur.

Abstract: Disclosed are an electromagnetic interference shielding film, a circuit board and a preparation method for the electromagnetic Interference shielding film. The electromagnetic interference shielding film includes a first shielding layer, a second shielding layer, an adhesive film layer and multiple convex particles, wherein a second surface of the first shielding layer is an undulating uneven surface; the multiple convex particles are adhered on the second surface of the first shielding layer; the second shielding layer is disposed on the second surface of the first shielding layer and covers the multiple convex particles, thereby forming a protrusion portion on an outer surface of the second shielding layer and forming a recessed portion at other positions; the undulation degree of the outer surface of the second shielding layer is greater than that of the second surface; and the adhesive film layer is disposed on the outer surface of the second shielding layer.

Abstract: Disclosed are an electromagnetic interference shielding film, a circuit board and a preparation method for the electromagnetic Interference shielding film. The electromagnetic interference shielding film includes a first shielding layer, a second shielding layer, an adhesive film layer and multiple convex particles, wherein a second surface of the first shielding layer is an undulating uneven surface; the multiple convex particles are adhered on the second surface of the first shielding layer; the second shielding layer is disposed on the second surface of the first shielding layer and covers the multiple convex particles, thereby forming a protrusion portion on an outer surface of the second shielding layer and forming a recessed portion at other positions; the undulation degree of the outer surface of the second shielding layer is greater than that of the second surface; and the adhesive film layer is disposed on the outer surface of the second shielding layer.

Abstract: Disclosed are an Electromagnetic Interference shielding film, a circuit board and a preparation method of the electromagnetic Interference shielding film. The electromagnetic Interference shielding film includes: a first shielding layer, a second shielding layer, an adhesive film and multiple convex particles, wherein the first shielding layer includes a first surface and a second surface opposite to each other; the second surface is a flat surface; the multiple convex particles are adhered on the second surface of the first shielding layer; the second shielding layer is disposed on the second surface of the first shielding layer and covers the multiple convex particles, thereby forming a protrusion portion at a position corresponding to the convex particles on an outer surface of the second shielding layer and forming a gentle portion at other positions; and the adhesive film is disposed on the outer surface of the second shielding layer.

Abstract: Disclosed are an Electromagnetic Interference shielding film, a circuit board and a preparation method of the electromagnetic Interference shielding film. The electromagnetic Interference shielding film includes: a first shielding layer, a second shielding layer, an adhesive film and multiple convex particles, wherein the first shielding layer includes a first surface and a second surface opposite to each other; the second surface is a flat surface; the multiple convex particles are adhered on the second surface of the first shielding layer; the second shielding layer is disposed on the second surface of the first shielding layer and covers the multiple convex particles, thereby forming a protrusion portion at a position corresponding to the convex particles on an outer surface of the second shielding layer and forming a gentle portion at other positions; and the adhesive film is disposed on the outer surface of the second shielding layer.